KR20040039201A - 공구 열화를 측정하기 위한 장치 및 방법 - Google Patents
공구 열화를 측정하기 위한 장치 및 방법 Download PDFInfo
- Publication number
- KR20040039201A KR20040039201A KR10-2003-7016078A KR20037016078A KR20040039201A KR 20040039201 A KR20040039201 A KR 20040039201A KR 20037016078 A KR20037016078 A KR 20037016078A KR 20040039201 A KR20040039201 A KR 20040039201A
- Authority
- KR
- South Korea
- Prior art keywords
- tool
- sample
- state
- light
- dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims description 17
- 230000015556 catabolic process Effects 0.000 title description 6
- 238000006731 degradation reaction Methods 0.000 title description 6
- 230000005284 excitation Effects 0.000 claims abstract description 19
- 238000001228 spectrum Methods 0.000 claims abstract description 17
- 238000010183 spectrum analysis Methods 0.000 claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims abstract description 9
- 238000001069 Raman spectroscopy Methods 0.000 claims description 22
- 230000003595 spectral effect Effects 0.000 claims description 17
- 230000006866 deterioration Effects 0.000 claims description 10
- 238000001237 Raman spectrum Methods 0.000 claims description 7
- 230000002542 deteriorative effect Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000010287 polarization Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 31
- 239000000463 material Substances 0.000 abstract description 30
- 235000012431 wafers Nutrition 0.000 description 34
- 239000010432 diamond Substances 0.000 description 31
- 229910003460 diamond Inorganic materials 0.000 description 27
- 238000005498 polishing Methods 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 14
- 239000012876 carrier material Substances 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 13
- 239000013307 optical fiber Substances 0.000 description 13
- 239000002245 particle Substances 0.000 description 11
- 229910052729 chemical element Inorganic materials 0.000 description 8
- 239000000835 fiber Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000005553 drilling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003841 Raman measurement Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0904—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool before or after machining
- B23Q17/0909—Detection of broken tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
- B24B49/183—Wear compensation without the presence of dressing tools
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/65—Raman scattering
Landscapes
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/877,531 US6633379B2 (en) | 2001-06-08 | 2001-06-08 | Apparatus and method for measuring the degradation of a tool |
| US09/877,531 | 2001-06-08 | ||
| PCT/US2002/013875 WO2002100592A1 (en) | 2001-06-08 | 2002-05-02 | Apparatus and method for measuring tool degradation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040039201A true KR20040039201A (ko) | 2004-05-10 |
Family
ID=25370164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7016078A Ceased KR20040039201A (ko) | 2001-06-08 | 2002-05-02 | 공구 열화를 측정하기 위한 장치 및 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6633379B2 (https=) |
| EP (1) | EP1399291B1 (https=) |
| JP (1) | JP4238130B2 (https=) |
| KR (1) | KR20040039201A (https=) |
| DE (1) | DE60227807D1 (https=) |
| TW (1) | TWI291395B (https=) |
| WO (1) | WO2002100592A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102175530B1 (ko) * | 2019-07-04 | 2020-11-09 | 강원대학교 산학협력단 | 드릴 상태 모니터링 시스템 |
| KR20210097017A (ko) * | 2020-01-29 | 2021-08-06 | 가부시기가이샤 디스코 | 절삭 장치 |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6808345B2 (en) * | 2001-10-16 | 2004-10-26 | Toshiba Kikai Kabushiki Kaisha | Tool, tool holder, and machine tool |
| US6741342B2 (en) * | 2002-04-10 | 2004-05-25 | Hewlett-Packard Development Company, L.P. | Using a laser beam to indicate roller wear |
| US6752694B2 (en) * | 2002-11-08 | 2004-06-22 | Motorola, Inc. | Apparatus for and method of wafer grinding |
| CN1910011B (zh) * | 2004-01-26 | 2010-12-15 | Tbw工业有限公司 | 使用原位修整制程的化学机械平面化制程控制 |
| US7489856B2 (en) * | 2004-06-25 | 2009-02-10 | Nokia Corporation | Electrical device for automatically adjusting operating speed of a tool |
| US20060025048A1 (en) * | 2004-07-28 | 2006-02-02 | 3M Innovative Properties Company | Abrasive article detection system and method |
| US20060025047A1 (en) * | 2004-07-28 | 2006-02-02 | 3M Innovative Properties Company | Grading system and method for abrasive article |
| US7090560B2 (en) * | 2004-07-28 | 2006-08-15 | 3M Innovative Properties Company | System and method for detecting abrasive article orientation |
| ATE390244T1 (de) * | 2005-02-08 | 2008-04-15 | Mikron Agie Charmilles Ag | Kontrollverfahren für eine werkzeugmaschine |
| JP5060808B2 (ja) * | 2007-03-27 | 2012-10-31 | オリンパス株式会社 | 外観検査装置 |
| CH701168B1 (de) * | 2007-08-17 | 2010-12-15 | Kellenberger & Co Ag L | Verfahren und Bearbeitungsmaschine zur Behandlung von Werkstücken. |
| JP2009210423A (ja) * | 2008-03-04 | 2009-09-17 | Sony Corp | テラヘルツ分光装置 |
| US8419508B2 (en) * | 2010-05-28 | 2013-04-16 | Corning Incorporated | Methods of fabricating a honeycomb extrusion die from a die body |
| JP5603175B2 (ja) * | 2010-09-03 | 2014-10-08 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
| US20120270474A1 (en) * | 2011-04-20 | 2012-10-25 | Nanya Technology Corporation | Polishing pad wear detecting apparatus |
| US8760668B1 (en) * | 2011-08-03 | 2014-06-24 | Us Synthetic Corporation | Methods for determining wear volume of a tested polycrystalline diamond element |
| CN102426119A (zh) * | 2011-08-25 | 2012-04-25 | 上海华碧检测技术有限公司 | 一种小尺寸晶圆样品结构截面观察的样品制备方法 |
| WO2013102900A1 (en) * | 2012-01-04 | 2013-07-11 | Mike Goldstein | Inspection device for mechanical instruments and uses thereof |
| CA2883247C (en) | 2012-08-31 | 2017-12-12 | Halliburton Energy Services, Inc. | System and method for analyzing cuttings using an opto-analytical device |
| US10012070B2 (en) | 2012-08-31 | 2018-07-03 | Halliburton Energy Services, Inc. | System and method for measuring gaps using an opto-analytical device |
| US9885234B2 (en) * | 2012-08-31 | 2018-02-06 | Halliburton Energy Services, Inc. | System and method for measuring temperature using an opto-analytical device |
| US10012067B2 (en) | 2012-08-31 | 2018-07-03 | Halliburton Energy Services, Inc. | System and method for determining torsion using an opto-analytical device |
| US10167718B2 (en) | 2012-08-31 | 2019-01-01 | Halliburton Energy Services, Inc. | System and method for analyzing downhole drilling parameters using an opto-analytical device |
| EP2877695A4 (en) | 2012-08-31 | 2016-07-13 | Halliburton Energy Services Inc | SYSTEM AND METHOD FOR DETECTING DRILLING EVENTS USING AN OPTO-ANALYTICAL DEVICE |
| EP2890988A4 (en) | 2012-08-31 | 2016-07-20 | Halliburton Energy Services Inc | SYSTEM AND METHOD FOR DETECTING VIBRATIONS USING AN OPTO-ANALYTICAL DEVICE |
| JP2014092437A (ja) * | 2012-11-02 | 2014-05-19 | Hitachi Chemical Co Ltd | 複合材料の分析方法 |
| JP6068209B2 (ja) * | 2013-03-12 | 2017-01-25 | 株式会社ディスコ | 切削方法 |
| DE102013209963A1 (de) * | 2013-05-28 | 2014-12-18 | Siemens Aktiengesellschaft | Anordnung zum Aufrakeln eines Pulvers |
| JP6521687B2 (ja) * | 2015-03-23 | 2019-05-29 | 株式会社ディスコ | 切削ブレードの検査方法 |
| DE102017206179A1 (de) * | 2017-04-11 | 2018-10-11 | Homag Bohrsysteme Gmbh | Schleifvorrichtung |
| CH713798A1 (de) * | 2017-05-19 | 2018-11-30 | Reishauer Ag | Maschine zur Feinbearbeitung von verzahnten Werkstücken sowie Verfahren zur Vermessung von Kenngrössen eines Feinbearbeitungswerkzeugs. |
| EP3511101B1 (de) * | 2018-01-10 | 2020-09-23 | Klingelnberg GmbH | Verfahren zum prüfen eines schleifwerkzeugs und entsprechende vorrichtung |
| DE102018105133A1 (de) * | 2018-03-06 | 2019-09-12 | Karl Heesemann Maschinenfabrik Gmbh & Co. Kg | Verfahren zum Betreiben einer Schleifvorrichtung |
| DE102018105134A1 (de) * | 2018-03-06 | 2019-09-12 | Karl Heesemann Maschinenfabrik Gmbh & Co. Kg | Verfahren zum Betreiben einer Schleifvorrichtung und Schleifvorrichtung |
| US11904428B2 (en) * | 2019-10-25 | 2024-02-20 | Vitaly Tsukanov | Systems for blade sharpening and contactless blade sharpness detection |
| TWI717302B (zh) * | 2020-07-30 | 2021-01-21 | 頂極科技股份有限公司 | 半導體製程零配件的質變檢測系統及方法 |
| EP3950223B1 (en) * | 2020-08-07 | 2024-10-02 | Schneider GmbH & Co. KG | Apparatus and method for processing optical workpieces |
| TWI749961B (zh) | 2020-12-22 | 2021-12-11 | 雷應科技股份有限公司 | 刀具檢測器 |
| WO2023018917A2 (en) * | 2021-08-11 | 2023-02-16 | Bedrock Surgical, Inc | Infrared imaging for damage detection in surgical instruments |
| CN114260813B (zh) * | 2021-12-29 | 2023-06-23 | 西安奕斯伟材料科技有限公司 | 水平度调整装置、抛光设备及水平度调整方法 |
| CN115127597B (zh) * | 2022-08-25 | 2022-12-09 | 江苏京创先进电子科技有限公司 | 刀片安装状态检测方法及系统 |
| JP7798078B2 (ja) * | 2023-04-26 | 2026-01-14 | 信越半導体株式会社 | 機械加工用ダイヤモンド工具の検査方法、及び、機械加工用ダイヤモンド工具の性能評価方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3809870A (en) * | 1972-06-08 | 1974-05-07 | Gleason Works | Method and apparatus for monitoring condition of cutting blades |
| GB8300792D0 (en) * | 1983-01-12 | 1983-02-16 | Production Eng Res | Monitoring tool life |
| US4786220A (en) | 1984-06-18 | 1988-11-22 | Borg-Warner Corporation | Cutting tool wear monitor |
| JPS61252051A (ja) | 1985-04-30 | 1986-11-10 | Mitsubishi Heavy Ind Ltd | 切削機械の刃欠検出装置 |
| DE3725652A1 (de) * | 1987-08-03 | 1989-02-16 | Kadia Diamant | Werkzeug zur spanabhebenden bearbeitung |
| DD270142A1 (de) | 1988-03-11 | 1989-07-19 | Komb Pumpen Und Verdichter Veb | Verfahren und vorrichtung zur kontinuierlichen erfassung des momentanverschleisses an spanwerkzeugen |
| FR2645782B1 (fr) | 1989-04-14 | 1995-01-27 | Aerospatiale | Systeme de controle de bris d'outil sur centre d'usinage |
| DK164621C (da) | 1989-10-09 | 1992-12-07 | Kirk Acoustics As | Elektrodynamisk transducer |
| DE4003696C1 (https=) * | 1990-02-07 | 1990-12-13 | Petzetakis, George Aristovoulos, Piraeus, Gr | |
| JPH04189447A (ja) * | 1990-03-26 | 1992-07-07 | Ntn Corp | 切削機械の制御装置 |
| JP3119308B2 (ja) * | 1991-03-12 | 2000-12-18 | ヤマザキマザック株式会社 | マシニングセンタ |
| JPH05148089A (ja) * | 1991-12-03 | 1993-06-15 | Sumitomo Electric Ind Ltd | 切削工具用ダイヤモンド膜 |
| JP3675577B2 (ja) * | 1995-07-05 | 2005-07-27 | 日本特殊陶業株式会社 | ダイヤモンド被覆物品の製造方法 |
| JPH0985587A (ja) * | 1995-09-28 | 1997-03-31 | Mitsubishi Materials Corp | 回転切削工具による切削状態の検出装置および検出方法 |
| US5718615A (en) | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
| CA2263850C (en) | 1996-08-22 | 2003-04-29 | Eastman Chemical Company | On-line quantitative analysis of chemical compositions by raman spectrometry |
| US5929986A (en) | 1996-08-26 | 1999-07-27 | Kaiser Optical Systems, Inc. | Synchronous spectral line imaging methods and apparatus |
| US5934974A (en) | 1997-11-05 | 1999-08-10 | Aplex Group | In-situ monitoring of polishing pad wear |
| GB9819732D0 (en) * | 1998-09-11 | 1998-11-04 | Renishaw Plc | Tool conditioning monitoring |
| US6033288A (en) | 1998-10-29 | 2000-03-07 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
| US6348943B1 (en) * | 1998-10-30 | 2002-02-19 | Industrial Technology Research Institute | Digital non-contact blade position detection apparatus |
-
2001
- 2001-06-08 US US09/877,531 patent/US6633379B2/en not_active Expired - Fee Related
-
2002
- 2002-05-02 JP JP2003503397A patent/JP4238130B2/ja not_active Expired - Fee Related
- 2002-05-02 KR KR10-2003-7016078A patent/KR20040039201A/ko not_active Ceased
- 2002-05-02 EP EP02729106A patent/EP1399291B1/en not_active Expired - Lifetime
- 2002-05-02 DE DE60227807T patent/DE60227807D1/de not_active Expired - Fee Related
- 2002-05-02 WO PCT/US2002/013875 patent/WO2002100592A1/en not_active Ceased
-
2003
- 2003-03-11 TW TW092105203A patent/TWI291395B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102175530B1 (ko) * | 2019-07-04 | 2020-11-09 | 강원대학교 산학협력단 | 드릴 상태 모니터링 시스템 |
| KR20210097017A (ko) * | 2020-01-29 | 2021-08-06 | 가부시기가이샤 디스코 | 절삭 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4238130B2 (ja) | 2009-03-11 |
| TWI291395B (en) | 2007-12-21 |
| JP2004530886A (ja) | 2004-10-07 |
| DE60227807D1 (de) | 2008-09-04 |
| WO2002100592A1 (en) | 2002-12-19 |
| US6633379B2 (en) | 2003-10-14 |
| US20020186370A1 (en) | 2002-12-12 |
| TW200417721A (en) | 2004-09-16 |
| EP1399291A1 (en) | 2004-03-24 |
| EP1399291B1 (en) | 2008-07-23 |
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