JP2004530886A5 - - Google Patents

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Publication number
JP2004530886A5
JP2004530886A5 JP2003503397A JP2003503397A JP2004530886A5 JP 2004530886 A5 JP2004530886 A5 JP 2004530886A5 JP 2003503397 A JP2003503397 A JP 2003503397A JP 2003503397 A JP2003503397 A JP 2003503397A JP 2004530886 A5 JP2004530886 A5 JP 2004530886A5
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JP
Japan
Prior art keywords
sample
tool
sample light
cutting tool
semiconductor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003503397A
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English (en)
Japanese (ja)
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JP4238130B2 (ja
JP2004530886A (ja
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Priority claimed from US09/877,531 external-priority patent/US6633379B2/en
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Publication of JP2004530886A publication Critical patent/JP2004530886A/ja
Publication of JP2004530886A5 publication Critical patent/JP2004530886A5/ja
Application granted granted Critical
Publication of JP4238130B2 publication Critical patent/JP4238130B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003503397A 2001-06-08 2002-05-02 工具の劣化を測定するための装置及び方法 Expired - Fee Related JP4238130B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/877,531 US6633379B2 (en) 2001-06-08 2001-06-08 Apparatus and method for measuring the degradation of a tool
PCT/US2002/013875 WO2002100592A1 (en) 2001-06-08 2002-05-02 Apparatus and method for measuring tool degradation

Publications (3)

Publication Number Publication Date
JP2004530886A JP2004530886A (ja) 2004-10-07
JP2004530886A5 true JP2004530886A5 (https=) 2006-01-05
JP4238130B2 JP4238130B2 (ja) 2009-03-11

Family

ID=25370164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003503397A Expired - Fee Related JP4238130B2 (ja) 2001-06-08 2002-05-02 工具の劣化を測定するための装置及び方法

Country Status (7)

Country Link
US (1) US6633379B2 (https=)
EP (1) EP1399291B1 (https=)
JP (1) JP4238130B2 (https=)
KR (1) KR20040039201A (https=)
DE (1) DE60227807D1 (https=)
TW (1) TWI291395B (https=)
WO (1) WO2002100592A1 (https=)

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US10012067B2 (en) 2012-08-31 2018-07-03 Halliburton Energy Services, Inc. System and method for determining torsion using an opto-analytical device
US10167718B2 (en) 2012-08-31 2019-01-01 Halliburton Energy Services, Inc. System and method for analyzing downhole drilling parameters using an opto-analytical device
EP2877695A4 (en) 2012-08-31 2016-07-13 Halliburton Energy Services Inc SYSTEM AND METHOD FOR DETECTING DRILLING EVENTS USING AN OPTO-ANALYTICAL DEVICE
EP2890988A4 (en) 2012-08-31 2016-07-20 Halliburton Energy Services Inc SYSTEM AND METHOD FOR DETECTING VIBRATIONS USING AN OPTO-ANALYTICAL DEVICE
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DE102013209963A1 (de) * 2013-05-28 2014-12-18 Siemens Aktiengesellschaft Anordnung zum Aufrakeln eines Pulvers
JP6521687B2 (ja) * 2015-03-23 2019-05-29 株式会社ディスコ 切削ブレードの検査方法
DE102017206179A1 (de) * 2017-04-11 2018-10-11 Homag Bohrsysteme Gmbh Schleifvorrichtung
CH713798A1 (de) * 2017-05-19 2018-11-30 Reishauer Ag Maschine zur Feinbearbeitung von verzahnten Werkstücken sowie Verfahren zur Vermessung von Kenngrössen eines Feinbearbeitungswerkzeugs.
EP3511101B1 (de) * 2018-01-10 2020-09-23 Klingelnberg GmbH Verfahren zum prüfen eines schleifwerkzeugs und entsprechende vorrichtung
DE102018105133A1 (de) * 2018-03-06 2019-09-12 Karl Heesemann Maschinenfabrik Gmbh & Co. Kg Verfahren zum Betreiben einer Schleifvorrichtung
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KR102175530B1 (ko) * 2019-07-04 2020-11-09 강원대학교 산학협력단 드릴 상태 모니터링 시스템
US11904428B2 (en) * 2019-10-25 2024-02-20 Vitaly Tsukanov Systems for blade sharpening and contactless blade sharpness detection
JP7420571B2 (ja) * 2020-01-29 2024-01-23 株式会社ディスコ 切削装置
TWI717302B (zh) * 2020-07-30 2021-01-21 頂極科技股份有限公司 半導體製程零配件的質變檢測系統及方法
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