JP4230492B2 - 低密着性材料、樹脂成形型及び防汚性材料 - Google Patents

低密着性材料、樹脂成形型及び防汚性材料 Download PDF

Info

Publication number
JP4230492B2
JP4230492B2 JP2006108869A JP2006108869A JP4230492B2 JP 4230492 B2 JP4230492 B2 JP 4230492B2 JP 2006108869 A JP2006108869 A JP 2006108869A JP 2006108869 A JP2006108869 A JP 2006108869A JP 4230492 B2 JP4230492 B2 JP 4230492B2
Authority
JP
Japan
Prior art keywords
main body
surface layer
resin
low adhesion
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006108869A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007276402A (ja
Inventor
孝希 久野
欣紀 野口
啓司 前田
諭 北岡
直樹 川島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Fine Ceramics Center
Towa Corp
Original Assignee
Japan Fine Ceramics Center
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006108869A priority Critical patent/JP4230492B2/ja
Application filed by Japan Fine Ceramics Center, Towa Corp filed Critical Japan Fine Ceramics Center
Priority to EP06843408.3A priority patent/EP2006083B1/en
Priority to CN2006800392783A priority patent/CN101291805B/zh
Priority to US11/988,802 priority patent/US7901797B2/en
Priority to KR1020087001220A priority patent/KR100923623B1/ko
Priority to PCT/JP2006/326026 priority patent/WO2007116571A1/ja
Priority to TW095150112A priority patent/TW200738581A/zh
Publication of JP2007276402A publication Critical patent/JP2007276402A/ja
Application granted granted Critical
Publication of JP4230492B2 publication Critical patent/JP4230492B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
JP2006108869A 2006-04-11 2006-04-11 低密着性材料、樹脂成形型及び防汚性材料 Expired - Fee Related JP4230492B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006108869A JP4230492B2 (ja) 2006-04-11 2006-04-11 低密着性材料、樹脂成形型及び防汚性材料
CN2006800392783A CN101291805B (zh) 2006-04-11 2006-12-27 低粘附性材料、树脂成形模及防污性材料
US11/988,802 US7901797B2 (en) 2006-04-11 2006-12-27 Low-adhesion material, resin molding die, and soil resistant material
KR1020087001220A KR100923623B1 (ko) 2006-04-11 2006-12-27 저밀착성 재료, 수지 성형틀 및 방오성 재료
EP06843408.3A EP2006083B1 (en) 2006-04-11 2006-12-27 Low-adhesion material, mold for shaping resin and stainproof material
PCT/JP2006/326026 WO2007116571A1 (ja) 2006-04-11 2006-12-27 低密着性材料、樹脂成形型および防汚性材料
TW095150112A TW200738581A (en) 2006-04-11 2006-12-29 Low-adhesion material, mold for shaping resin and stainproof material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006108869A JP4230492B2 (ja) 2006-04-11 2006-04-11 低密着性材料、樹脂成形型及び防汚性材料

Publications (2)

Publication Number Publication Date
JP2007276402A JP2007276402A (ja) 2007-10-25
JP4230492B2 true JP4230492B2 (ja) 2009-02-25

Family

ID=38580873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006108869A Expired - Fee Related JP4230492B2 (ja) 2006-04-11 2006-04-11 低密着性材料、樹脂成形型及び防汚性材料

Country Status (7)

Country Link
US (1) US7901797B2 (https=)
EP (1) EP2006083B1 (https=)
JP (1) JP4230492B2 (https=)
KR (1) KR100923623B1 (https=)
CN (1) CN101291805B (https=)
TW (1) TW200738581A (https=)
WO (1) WO2007116571A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
CN102407703A (zh) * 2010-09-25 2012-04-11 天津市阿波罗信息技术有限公司 又一种数字化防伪印刷的处理方法
CN102442096B (zh) * 2010-10-09 2014-12-17 天津市阿波罗信息技术有限公司 一种在文字字库中埋入信息的可变信息印刷方法
GB201022127D0 (en) * 2010-12-31 2011-02-02 Element Six Production Pty Ltd A superhard structure and method of making same
JP6366348B2 (ja) * 2014-05-09 2018-08-01 Ｔｏｗａ株式会社 成形型
CN106414043B (zh) * 2014-06-24 2019-05-10 庞巴迪公司 热膨胀成型工具和用该工具成型的方法
JP6335812B2 (ja) * 2015-02-16 2018-05-30 三菱電機株式会社 成形用金型、およびその製造方法
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04149074A (ja) * 1990-10-09 1992-05-22 Toshiba Tungaloy Co Ltd 高強度積層セラミックス焼結体
US5176839A (en) * 1991-03-28 1993-01-05 General Electric Company Multilayered mold structure for hot surface molding in a short cycle time
JPH04364945A (ja) * 1991-06-12 1992-12-17 Inax Corp 高強度多結晶焼結セラミックス積層体
JP2912125B2 (ja) * 1993-08-10 1999-06-28 東レ株式会社 陶磁器板およびその製造方法
CN2381460Y (zh) * 1999-04-14 2000-06-07 徐文忠 复合坚韧耐磨树脂基模具
TWI253975B (en) * 2003-05-13 2006-05-01 Kuraray Co Mold for molding resins and process for producing the same
JP2005193610A (ja) * 2004-01-09 2005-07-21 Towa Corp 複合材料及び樹脂成形型
JP3996138B2 (ja) 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006017335A (ja) 2004-06-30 2006-01-19 Okawara Mfg Co Ltd 被処理物の分散性を向上させた連続式伝導伝熱乾燥機並びにその運転方法
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Also Published As

Publication number Publication date
EP2006083A4 (en) 2012-10-24
CN101291805B (zh) 2012-06-20
WO2007116571A1 (ja) 2007-10-18
US20090107361A1 (en) 2009-04-30
JP2007276402A (ja) 2007-10-25
EP2006083A9 (en) 2009-07-01
KR20080031284A (ko) 2008-04-08
KR100923623B1 (ko) 2009-10-23
EP2006083A2 (en) 2008-12-24
TW200738581A (en) 2007-10-16
US7901797B2 (en) 2011-03-08
CN101291805A (zh) 2008-10-22
TWI344412B (https=) 2011-07-01
EP2006083B1 (en) 2017-04-05

Similar Documents

Publication Publication Date Title
CN104755445B (zh) 金属‑陶瓷‑基材以及制备金属‑陶瓷‑基材的方法
TWI501432B (zh) Ｌｅｄ晶片接合體、ｌｅｄ封裝、及ｌｅｄ封裝之製造方法
JP4230492B2 (ja) 低密着性材料、樹脂成形型及び防汚性材料
TWI357788B (https=)
US20100282459A1 (en) Heat sink and method for manufacturing a heat sink
US20120076886A1 (en) Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
JP5561992B2 (ja) 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
JP5366859B2 (ja) 窒化珪素基板およびそれを用いた半導体モジュール
TWI308133B (en) Low-adhesion material and mold for molding resin using the same material
JP2006131429A5 (https=)
JP3974152B2 (ja) 低密着性材料、樹脂成形型及び防汚性材料
JP5554898B2 (ja) 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP3737072B2 (ja) アルミニウム−炭化珪素質複合体とその製造方法
JPH05152471A (ja) 閉孔複合体を用いた電子パツケージ
CN101220421A (zh) 一种大于70%硅含量的Si-Al热沉材料的成型工艺
JP2007187678A (ja) 密着性の評価方法
CN113678244A (zh) 氮化硅电路基板及电子部件模块
CN118580102A (zh) 一种热压烧结Ag粉制备覆银AlN陶瓷基板的方法
CN115297986A (zh) 金属接合体、半导体装置、波导管及被接合构件的接合方法

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20081125

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20081203

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111212

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121212

Year of fee payment: 4

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121212

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131212

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees