JP4220378B2 - 処理結果の予測方法および処理装置 - Google Patents

処理結果の予測方法および処理装置 Download PDF

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Publication number
JP4220378B2
JP4220378B2 JP2003509517A JP2003509517A JP4220378B2 JP 4220378 B2 JP4220378 B2 JP 4220378B2 JP 2003509517 A JP2003509517 A JP 2003509517A JP 2003509517 A JP2003509517 A JP 2003509517A JP 4220378 B2 JP4220378 B2 JP 4220378B2
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Japan
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data
processing
wafer
operation data
processing result
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Expired - Fee Related
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JP2003509517A
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Japanese (ja)
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JPWO2003003437A1 (ja
Inventor
智 原田
真治 坂野
秀樹 田中
秀昭 佐藤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP2003509517A 2001-06-27 2002-06-25 処理結果の予測方法および処理装置 Expired - Fee Related JP4220378B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001194762 2001-06-27
JP2001194762 2001-06-27
PCT/JP2002/006348 WO2003003437A1 (fr) 2001-06-27 2002-06-25 Procede de prevision de resultats traites et dispositif de traitement

Publications (2)

Publication Number Publication Date
JPWO2003003437A1 JPWO2003003437A1 (ja) 2004-10-21
JP4220378B2 true JP4220378B2 (ja) 2009-02-04

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Family Applications (1)

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JP2003509517A Expired - Fee Related JP4220378B2 (ja) 2001-06-27 2002-06-25 処理結果の予測方法および処理装置

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JP (1) JP4220378B2 (enExample)
TW (1) TWI306269B (enExample)
WO (1) WO2003003437A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024205696A1 (en) * 2023-03-28 2024-10-03 Applied Materials, Inc. Thermal processing chamber state based on thermal sensor readings

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616759B2 (en) 2001-09-06 2003-09-09 Hitachi, Ltd. Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
CN1653598B (zh) 2002-05-16 2010-05-05 东京毅力科创株式会社 处理装置状态或处理结果的预测方法
JP4363861B2 (ja) * 2003-02-04 2009-11-11 株式会社日立ハイテクノロジーズ 半導体製造装置
JP4707421B2 (ja) * 2005-03-14 2011-06-22 東京エレクトロン株式会社 処理装置，処理装置の消耗部品管理方法，処理システム，処理システムの消耗部品管理方法
US7291285B2 (en) * 2005-05-10 2007-11-06 International Business Machines Corporation Method and system for line-dimension control of an etch process
KR101286240B1 (ko) 2007-10-23 2013-07-15 삼성전자주식회사 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법
JP4836994B2 (ja) * 2008-06-11 2011-12-14 株式会社日立製作所 半導体処理装置
JP5643528B2 (ja) 2009-03-30 2014-12-17 東京エレクトロン株式会社 基板処理装置
JP5782226B2 (ja) 2010-03-24 2015-09-24 東京エレクトロン株式会社 基板処理装置
KR102112130B1 (ko) * 2013-10-23 2020-05-19 주식회사 디엠에스 샤워헤드 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04212414A (ja) * 1990-08-16 1992-08-04 Fuji Electric Co Ltd プラズマ処理装置
JP3300816B2 (ja) * 1992-02-27 2002-07-08 株式会社日立国際電気 半導体製造装置管理方法及びその装置
US5442562A (en) * 1993-12-10 1995-08-15 Eastman Kodak Company Method of controlling a manufacturing process using multivariate analysis
US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JPH10223499A (ja) * 1997-02-06 1998-08-21 Hitachi Ltd 物品の製造方法、物品の製造システムおよび複数の加工処理装置の運用方法
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024205696A1 (en) * 2023-03-28 2024-10-03 Applied Materials, Inc. Thermal processing chamber state based on thermal sensor readings

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JPWO2003003437A1 (ja) 2004-10-21
WO2003003437A1 (fr) 2003-01-09
TWI306269B (enExample) 2009-02-11

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