JP4215693B2 - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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Publication number
JP4215693B2
JP4215693B2 JP2004236405A JP2004236405A JP4215693B2 JP 4215693 B2 JP4215693 B2 JP 4215693B2 JP 2004236405 A JP2004236405 A JP 2004236405A JP 2004236405 A JP2004236405 A JP 2004236405A JP 4215693 B2 JP4215693 B2 JP 4215693B2
Authority
JP
Japan
Prior art keywords
wire
bonding
capillary
wiring
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004236405A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006054383A (ja
Inventor
竜成 三井
広司 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004236405A priority Critical patent/JP4215693B2/ja
Priority to TW094122130A priority patent/TW200608501A/zh
Priority to KR20050065072A priority patent/KR100660821B1/ko
Publication of JP2006054383A publication Critical patent/JP2006054383A/ja
Application granted granted Critical
Publication of JP4215693B2 publication Critical patent/JP4215693B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP2004236405A 2004-08-16 2004-08-16 ワイヤボンディング方法 Expired - Fee Related JP4215693B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004236405A JP4215693B2 (ja) 2004-08-16 2004-08-16 ワイヤボンディング方法
TW094122130A TW200608501A (en) 2004-08-16 2005-06-30 Wire bonding method
KR20050065072A KR100660821B1 (ko) 2004-08-16 2005-07-19 와이어본딩 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004236405A JP4215693B2 (ja) 2004-08-16 2004-08-16 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JP2006054383A JP2006054383A (ja) 2006-02-23
JP4215693B2 true JP4215693B2 (ja) 2009-01-28

Family

ID=36031645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004236405A Expired - Fee Related JP4215693B2 (ja) 2004-08-16 2004-08-16 ワイヤボンディング方法

Country Status (3)

Country Link
JP (1) JP4215693B2 (cg-RX-API-DMAC10.html)
KR (1) KR100660821B1 (cg-RX-API-DMAC10.html)
TW (1) TW200608501A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697970B1 (de) * 2006-03-30 2009-04-15 Oerlikon Assembly Equipment Ag Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke.
TWI543284B (zh) * 2014-02-10 2016-07-21 新川股份有限公司 半導體裝置的製造方法以及打線裝置
CN114242597A (zh) * 2021-12-17 2022-03-25 苏州高邦半导体科技有限公司 芯片封装键合方法

Also Published As

Publication number Publication date
TW200608501A (en) 2006-03-01
KR100660821B1 (ko) 2006-12-26
JP2006054383A (ja) 2006-02-23
KR20060053871A (ko) 2006-05-22
TWI366240B (cg-RX-API-DMAC10.html) 2012-06-11

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