TWI366240B - - Google Patents
Info
- Publication number
- TWI366240B TWI366240B TW094122130A TW94122130A TWI366240B TW I366240 B TWI366240 B TW I366240B TW 094122130 A TW094122130 A TW 094122130A TW 94122130 A TW94122130 A TW 94122130A TW I366240 B TWI366240 B TW I366240B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004236405A JP4215693B2 (ja) | 2004-08-16 | 2004-08-16 | ワイヤボンディング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200608501A TW200608501A (en) | 2006-03-01 |
| TWI366240B true TWI366240B (cg-RX-API-DMAC10.html) | 2012-06-11 |
Family
ID=36031645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094122130A TW200608501A (en) | 2004-08-16 | 2005-06-30 | Wire bonding method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4215693B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR100660821B1 (cg-RX-API-DMAC10.html) |
| TW (1) | TW200608501A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH697970B1 (de) * | 2006-03-30 | 2009-04-15 | Oerlikon Assembly Equipment Ag | Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke. |
| TWI543284B (zh) * | 2014-02-10 | 2016-07-21 | 新川股份有限公司 | 半導體裝置的製造方法以及打線裝置 |
| CN114242597A (zh) * | 2021-12-17 | 2022-03-25 | 苏州高邦半导体科技有限公司 | 芯片封装键合方法 |
-
2004
- 2004-08-16 JP JP2004236405A patent/JP4215693B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-30 TW TW094122130A patent/TW200608501A/zh not_active IP Right Cessation
- 2005-07-19 KR KR20050065072A patent/KR100660821B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200608501A (en) | 2006-03-01 |
| KR100660821B1 (ko) | 2006-12-26 |
| JP4215693B2 (ja) | 2009-01-28 |
| JP2006054383A (ja) | 2006-02-23 |
| KR20060053871A (ko) | 2006-05-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |