TW200608501A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
TW200608501A
TW200608501A TW094122130A TW94122130A TW200608501A TW 200608501 A TW200608501 A TW 200608501A TW 094122130 A TW094122130 A TW 094122130A TW 94122130 A TW94122130 A TW 94122130A TW 200608501 A TW200608501 A TW 200608501A
Authority
TW
Taiwan
Prior art keywords
bonding
wire
capillary
bonding method
wire bonding
Prior art date
Application number
TW094122130A
Other languages
English (en)
Chinese (zh)
Other versions
TWI366240B (cg-RX-API-DMAC10.html
Inventor
Tatsunari Mitsui
Koji Watanabe
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200608501A publication Critical patent/TW200608501A/zh
Application granted granted Critical
Publication of TWI366240B publication Critical patent/TWI366240B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
TW094122130A 2004-08-16 2005-06-30 Wire bonding method TW200608501A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004236405A JP4215693B2 (ja) 2004-08-16 2004-08-16 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
TW200608501A true TW200608501A (en) 2006-03-01
TWI366240B TWI366240B (cg-RX-API-DMAC10.html) 2012-06-11

Family

ID=36031645

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122130A TW200608501A (en) 2004-08-16 2005-06-30 Wire bonding method

Country Status (3)

Country Link
JP (1) JP4215693B2 (cg-RX-API-DMAC10.html)
KR (1) KR100660821B1 (cg-RX-API-DMAC10.html)
TW (1) TW200608501A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114242597A (zh) * 2021-12-17 2022-03-25 苏州高邦半导体科技有限公司 芯片封装键合方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697970B1 (de) * 2006-03-30 2009-04-15 Oerlikon Assembly Equipment Ag Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke.
TWI543284B (zh) * 2014-02-10 2016-07-21 新川股份有限公司 半導體裝置的製造方法以及打線裝置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114242597A (zh) * 2021-12-17 2022-03-25 苏州高邦半导体科技有限公司 芯片封装键合方法

Also Published As

Publication number Publication date
KR100660821B1 (ko) 2006-12-26
JP4215693B2 (ja) 2009-01-28
JP2006054383A (ja) 2006-02-23
KR20060053871A (ko) 2006-05-22
TWI366240B (cg-RX-API-DMAC10.html) 2012-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees