JP4215571B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4215571B2 JP4215571B2 JP2003170757A JP2003170757A JP4215571B2 JP 4215571 B2 JP4215571 B2 JP 4215571B2 JP 2003170757 A JP2003170757 A JP 2003170757A JP 2003170757 A JP2003170757 A JP 2003170757A JP 4215571 B2 JP4215571 B2 JP 4215571B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- substrate
- film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 95
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims description 102
- 238000000034 method Methods 0.000 claims description 42
- 239000010949 copper Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000002313 adhesive film Substances 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 241000416536 Euproctis pseudoconspersa Species 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003170757A JP4215571B2 (ja) | 2002-06-18 | 2003-06-16 | 半導体装置の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002176775 | 2002-06-18 | ||
| JP2003170757A JP4215571B2 (ja) | 2002-06-18 | 2003-06-16 | 半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006088903A Division JP4286264B2 (ja) | 2002-06-18 | 2006-03-28 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004080006A JP2004080006A (ja) | 2004-03-11 |
| JP2004080006A5 JP2004080006A5 (enExample) | 2006-05-18 |
| JP4215571B2 true JP4215571B2 (ja) | 2009-01-28 |
Family
ID=32032455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003170757A Expired - Fee Related JP4215571B2 (ja) | 2002-06-18 | 2003-06-16 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4215571B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373747B (zh) * | 2004-03-16 | 2011-06-29 | 株式会社藤仓 | 具有通孔互连的装置及其制造方法 |
| JP4746847B2 (ja) * | 2004-04-27 | 2011-08-10 | 三洋電機株式会社 | 半導体装置の製造方法 |
| JP4936695B2 (ja) * | 2004-09-29 | 2012-05-23 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
| JP4522213B2 (ja) * | 2004-09-29 | 2010-08-11 | 三洋電機株式会社 | 半導体装置の製造方法 |
| TWI313914B (en) | 2005-01-31 | 2009-08-21 | Sanyo Electric Co | Semiconductor device and a method for manufacturing thereof |
| US20070090156A1 (en) * | 2005-10-25 | 2007-04-26 | Ramanathan Lakshmi N | Method for forming solder contacts on mounted substrates |
| US8513789B2 (en) | 2006-10-10 | 2013-08-20 | Tessera, Inc. | Edge connect wafer level stacking with leads extending along edges |
| US7901989B2 (en) | 2006-10-10 | 2011-03-08 | Tessera, Inc. | Reconstituted wafer level stacking |
| WO2009017758A2 (en) | 2007-07-27 | 2009-02-05 | Tessera, Inc. | Reconstituted wafer stack packaging with after-applied pad extensions |
| WO2009154761A1 (en) | 2008-06-16 | 2009-12-23 | Tessera Research Llc | Stacking of wafer-level chip scale packages having edge contacts |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06326293A (ja) * | 1993-05-12 | 1994-11-25 | Hamamatsu Photonics Kk | 光検出装置 |
| IL123207A0 (en) * | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
| KR100315030B1 (ko) * | 1998-12-29 | 2002-04-24 | 박종섭 | 반도체패키지의제조방법 |
| JP3750468B2 (ja) * | 2000-03-01 | 2006-03-01 | セイコーエプソン株式会社 | 半導体ウエハーの製造方法及び半導体装置 |
| JP2001313350A (ja) * | 2000-04-28 | 2001-11-09 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP4454805B2 (ja) * | 2000-07-04 | 2010-04-21 | 藤森工業株式会社 | 保護フィルム及び導体箔積層体 |
| JP2002093942A (ja) * | 2000-09-14 | 2002-03-29 | Nec Corp | 半導体装置およびその製造方法 |
-
2003
- 2003-06-16 JP JP2003170757A patent/JP4215571B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004080006A (ja) | 2004-03-11 |
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