JP4213907B2 - リソグラフィーシステムのフォーカス精度を向上させるための方法およびシステム - Google Patents
リソグラフィーシステムのフォーカス精度を向上させるための方法およびシステム Download PDFInfo
- Publication number
- JP4213907B2 JP4213907B2 JP2002125047A JP2002125047A JP4213907B2 JP 4213907 B2 JP4213907 B2 JP 4213907B2 JP 2002125047 A JP2002125047 A JP 2002125047A JP 2002125047 A JP2002125047 A JP 2002125047A JP 4213907 B2 JP4213907 B2 JP 4213907B2
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- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 47
- 238000001459 lithography Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 105
- 238000005259 measurement Methods 0.000 claims description 88
- 230000003287 optical effect Effects 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 239000000523 sample Substances 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 82
- 230000006870 function Effects 0.000 description 16
- 238000003860 storage Methods 0.000 description 12
- 230000009897 systematic effect Effects 0.000 description 6
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- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
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- 238000001015 X-ray lithography Methods 0.000 description 3
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- 239000004020 conductor Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000002508 contact lithography Methods 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
- D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
- D21H23/22—Addition to the formed paper
- D21H23/32—Addition to the formed paper by contacting paper with an excess of material, e.g. from a reservoir or in a manner necessitating removal of applied excess material from the paper
- D21H23/34—Knife or blade type coaters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N21/00—Selective content distribution, e.g. interactive television or video on demand [VOD]
- H04N21/40—Client devices specifically adapted for the reception of or interaction with content, e.g. set-top-box [STB]; Operations thereof
- H04N21/41—Structure of client; Structure of client peripherals
- H04N21/414—Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance
- H04N21/41415—Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance involving a public display, viewable by several users in a public space outside their home, e.g. movie theatre, information kiosk
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/841,187 US6859260B2 (en) | 2001-04-25 | 2001-04-25 | Method and system for improving focus accuracy in a lithography system |
| US09/841,187 | 2001-04-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003031493A JP2003031493A (ja) | 2003-01-31 |
| JP2003031493A5 JP2003031493A5 (enExample) | 2005-09-29 |
| JP4213907B2 true JP4213907B2 (ja) | 2009-01-28 |
Family
ID=25284253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002125047A Expired - Fee Related JP4213907B2 (ja) | 2001-04-25 | 2002-04-25 | リソグラフィーシステムのフォーカス精度を向上させるための方法およびシステム |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6859260B2 (enExample) |
| EP (1) | EP1253471A3 (enExample) |
| JP (1) | JP4213907B2 (enExample) |
| KR (1) | KR100719975B1 (enExample) |
| TW (1) | TW541593B (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6859260B2 (en) * | 2001-04-25 | 2005-02-22 | Asml Holding N.V. | Method and system for improving focus accuracy in a lithography system |
| JP2003031474A (ja) * | 2001-07-16 | 2003-01-31 | Oki Electric Ind Co Ltd | 露光装置および露光方法 |
| US7289230B2 (en) | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
| AU2003266613A1 (en) * | 2002-10-10 | 2004-05-04 | Sony Corporation | Method of producing optical disk-use original and method of producing optical disk |
| US6781103B1 (en) * | 2003-04-02 | 2004-08-24 | Candela Instruments | Method of automatically focusing an optical beam on transparent or reflective thin film wafers or disks |
| US7068349B2 (en) * | 2003-04-24 | 2006-06-27 | Asml Netherlands B.V. | Method of and preventing focal plane anomalies in the focal plane of a projection system |
| US20050134816A1 (en) * | 2003-12-22 | 2005-06-23 | Asml Netherlands B.V. | Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby |
| US7126668B2 (en) * | 2004-04-28 | 2006-10-24 | Litel Instruments | Apparatus and process for determination of dynamic scan field curvature |
| US7265364B2 (en) * | 2004-06-10 | 2007-09-04 | Asml Netherlands B.V. | Level sensor for lithographic apparatus |
| US7835017B2 (en) * | 2004-12-22 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby |
| US7504833B1 (en) * | 2005-04-01 | 2009-03-17 | Cypress Semiconductor Corporation | Automatically balanced sensing device and method for multiple capacitive sensors |
| US7369214B2 (en) * | 2005-08-11 | 2008-05-06 | Asml Holding N.V. | Lithographic apparatus and device manufacturing method utilizing a metrology system with sensors |
| US7502096B2 (en) * | 2006-02-07 | 2009-03-10 | Asml Netherlands B.V. | Lithographic apparatus, calibration method, device manufacturing method and computer program product |
| US7893697B2 (en) | 2006-02-21 | 2011-02-22 | Cyberoptics Semiconductor, Inc. | Capacitive distance sensing in semiconductor processing tools |
| CN101410690B (zh) * | 2006-02-21 | 2011-11-23 | 赛博光学半导体公司 | 半导体加工工具中的电容性距离感测 |
| JP5092298B2 (ja) * | 2006-07-21 | 2012-12-05 | 富士通セミコンダクター株式会社 | フォトマスク、焦点計測装置及び方法 |
| KR101388304B1 (ko) | 2006-09-29 | 2014-04-22 | 싸이버옵틱스 쎄미콘덕터 인코퍼레이티드 | 기판형 입자 센서 |
| US8237919B2 (en) | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
| JPWO2009028157A1 (ja) * | 2007-08-24 | 2010-11-25 | 株式会社ニコン | 移動体駆動方法及び移動体駆動システム、並びにパターン形成方法及びパターン形成装置 |
| US7940374B2 (en) * | 2008-06-30 | 2011-05-10 | Asml Holding N.V. | Parallel process focus compensation |
| US20110261344A1 (en) * | 2009-12-31 | 2011-10-27 | Mapper Lithography Ip B.V. | Exposure method |
| US10274838B2 (en) | 2013-03-14 | 2019-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for performing lithography process in semiconductor device fabrication |
| US10576603B2 (en) | 2014-04-22 | 2020-03-03 | Kla-Tencor Corporation | Patterned wafer geometry measurements for semiconductor process controls |
| WO2015199801A1 (en) * | 2014-06-24 | 2015-12-30 | Kla-Tencor Corporation | Patterned wafer geometry measurements for semiconductor process controls |
| JP2018138990A (ja) | 2016-12-08 | 2018-09-06 | ウルトラテック インク | 再構成ウェハーのリソグラフィ処理のための焦点制御のための走査方法 |
| CN111183501B (zh) | 2017-10-04 | 2022-11-25 | Asml荷兰有限公司 | 干涉测量台定位装置 |
| KR102693518B1 (ko) | 2018-09-06 | 2024-08-08 | 삼성전자주식회사 | Opc 방법, 및 그 opc 방법을 이용한 마스크 제조방법 |
| TW202211074A (zh) * | 2020-04-24 | 2022-03-16 | 美商科文特股份有限公司 | 用於在虛擬工廠環境中執行局部cdu建模和控制的系統及方法 |
| KR102526522B1 (ko) * | 2022-11-02 | 2023-04-27 | (주)오로스테크놀로지 | 포커스를 제어하는 오버레이 계측 장치 및 방법과 이를 위한 프로그램 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61196532A (ja) * | 1985-02-26 | 1986-08-30 | Canon Inc | 露光装置 |
| US5883703A (en) | 1996-02-08 | 1999-03-16 | Megapanel Corporation | Methods and apparatus for detecting and compensating for focus errors in a photolithography tool |
| AU5067898A (en) * | 1996-11-28 | 1998-06-22 | Nikon Corporation | Aligner and method for exposure |
| US6208407B1 (en) * | 1997-12-22 | 2001-03-27 | Asm Lithography B.V. | Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement |
| EP1037117A3 (en) * | 1999-03-08 | 2003-11-12 | ASML Netherlands B.V. | Off-axis levelling in lithographic projection apparatus |
| JP2001160530A (ja) * | 1999-12-01 | 2001-06-12 | Nikon Corp | ステージ装置及び露光装置 |
| US6859260B2 (en) * | 2001-04-25 | 2005-02-22 | Asml Holding N.V. | Method and system for improving focus accuracy in a lithography system |
-
2001
- 2001-04-25 US US09/841,187 patent/US6859260B2/en not_active Expired - Lifetime
-
2002
- 2002-04-22 TW TW091108247A patent/TW541593B/zh not_active IP Right Cessation
- 2002-04-24 KR KR1020020022398A patent/KR100719975B1/ko not_active Expired - Fee Related
- 2002-04-25 EP EP02009481A patent/EP1253471A3/en not_active Withdrawn
- 2002-04-25 JP JP2002125047A patent/JP4213907B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-07 US US11/050,694 patent/US7053984B2/en not_active Expired - Fee Related
-
2006
- 2006-04-24 US US11/408,956 patent/US7248336B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1253471A2 (en) | 2002-10-30 |
| KR100719975B1 (ko) | 2007-05-21 |
| US6859260B2 (en) | 2005-02-22 |
| US7053984B2 (en) | 2006-05-30 |
| US20020158185A1 (en) | 2002-10-31 |
| US20060187436A1 (en) | 2006-08-24 |
| US20050128456A1 (en) | 2005-06-16 |
| US7248336B2 (en) | 2007-07-24 |
| TW541593B (en) | 2003-07-11 |
| EP1253471A3 (en) | 2005-11-02 |
| KR20020092175A (ko) | 2002-12-11 |
| JP2003031493A (ja) | 2003-01-31 |
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| R250 | Receipt of annual fees |
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