JP2003031493A5 - - Google Patents

Download PDF

Info

Publication number
JP2003031493A5
JP2003031493A5 JP2002125047A JP2002125047A JP2003031493A5 JP 2003031493 A5 JP2003031493 A5 JP 2003031493A5 JP 2002125047 A JP2002125047 A JP 2002125047A JP 2002125047 A JP2002125047 A JP 2002125047A JP 2003031493 A5 JP2003031493 A5 JP 2003031493A5
Authority
JP
Japan
Prior art keywords
sensor
area
specific
control sensor
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002125047A
Other languages
English (en)
Japanese (ja)
Other versions
JP4213907B2 (ja
JP2003031493A (ja
Filing date
Publication date
Priority claimed from US09/841,187 external-priority patent/US6859260B2/en
Application filed filed Critical
Publication of JP2003031493A publication Critical patent/JP2003031493A/ja
Publication of JP2003031493A5 publication Critical patent/JP2003031493A5/ja
Application granted granted Critical
Publication of JP4213907B2 publication Critical patent/JP4213907B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002125047A 2001-04-25 2002-04-25 リソグラフィーシステムのフォーカス精度を向上させるための方法およびシステム Expired - Fee Related JP4213907B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/841,187 2001-04-25
US09/841,187 US6859260B2 (en) 2001-04-25 2001-04-25 Method and system for improving focus accuracy in a lithography system

Publications (3)

Publication Number Publication Date
JP2003031493A JP2003031493A (ja) 2003-01-31
JP2003031493A5 true JP2003031493A5 (enExample) 2005-09-29
JP4213907B2 JP4213907B2 (ja) 2009-01-28

Family

ID=25284253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002125047A Expired - Fee Related JP4213907B2 (ja) 2001-04-25 2002-04-25 リソグラフィーシステムのフォーカス精度を向上させるための方法およびシステム

Country Status (5)

Country Link
US (3) US6859260B2 (enExample)
EP (1) EP1253471A3 (enExample)
JP (1) JP4213907B2 (enExample)
KR (1) KR100719975B1 (enExample)
TW (1) TW541593B (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system
JP2003031474A (ja) * 2001-07-16 2003-01-31 Oki Electric Ind Co Ltd 露光装置および露光方法
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
EP1551020B1 (en) * 2002-10-10 2010-11-03 Sony Corporation Method of producing optical disk-use original and method of producing optical disk
US6781103B1 (en) * 2003-04-02 2004-08-24 Candela Instruments Method of automatically focusing an optical beam on transparent or reflective thin film wafers or disks
US7068349B2 (en) * 2003-04-24 2006-06-27 Asml Netherlands B.V. Method of and preventing focal plane anomalies in the focal plane of a projection system
US20050134816A1 (en) * 2003-12-22 2005-06-23 Asml Netherlands B.V. Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby
US7126668B2 (en) * 2004-04-28 2006-10-24 Litel Instruments Apparatus and process for determination of dynamic scan field curvature
US7265364B2 (en) * 2004-06-10 2007-09-04 Asml Netherlands B.V. Level sensor for lithographic apparatus
US7835017B2 (en) * 2004-12-22 2010-11-16 Asml Netherlands B.V. Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby
US7504833B1 (en) * 2005-04-01 2009-03-17 Cypress Semiconductor Corporation Automatically balanced sensing device and method for multiple capacitive sensors
US7369214B2 (en) * 2005-08-11 2008-05-06 Asml Holding N.V. Lithographic apparatus and device manufacturing method utilizing a metrology system with sensors
US7502096B2 (en) * 2006-02-07 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, calibration method, device manufacturing method and computer program product
CN101410690B (zh) 2006-02-21 2011-11-23 赛博光学半导体公司 半导体加工工具中的电容性距离感测
US7893697B2 (en) 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
JP5092298B2 (ja) * 2006-07-21 2012-12-05 富士通セミコンダクター株式会社 フォトマスク、焦点計測装置及び方法
CN101517701B (zh) 2006-09-29 2011-08-10 赛博光学半导体公司 衬底形的粒子传感器
KR20100057758A (ko) 2007-08-24 2010-06-01 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 그리고 패턴 형성 방법 및 패턴 형성 장치
US8237919B2 (en) 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US7940374B2 (en) * 2008-06-30 2011-05-10 Asml Holding N.V. Parallel process focus compensation
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
US10274838B2 (en) 2013-03-14 2019-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for performing lithography process in semiconductor device fabrication
US10576603B2 (en) 2014-04-22 2020-03-03 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
EP3117454B1 (en) * 2014-06-24 2020-06-03 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
JP2018138990A (ja) 2016-12-08 2018-09-06 ウルトラテック インク 再構成ウェハーのリソグラフィ処理のための焦点制御のための走査方法
IL273651B2 (en) 2017-10-04 2024-06-01 Asml Netherlands Bv Interferometric positioning device
KR102693518B1 (ko) 2018-09-06 2024-08-08 삼성전자주식회사 Opc 방법, 및 그 opc 방법을 이용한 마스크 제조방법
WO2021216771A1 (en) * 2020-04-24 2021-10-28 Coventor, Inc. System and method for performing local cdu modeling and control in a virtual fabrication environment
KR102526522B1 (ko) * 2022-11-02 2023-04-27 (주)오로스테크놀로지 포커스를 제어하는 오버레이 계측 장치 및 방법과 이를 위한 프로그램

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196532A (ja) * 1985-02-26 1986-08-30 Canon Inc 露光装置
US5883703A (en) * 1996-02-08 1999-03-16 Megapanel Corporation Methods and apparatus for detecting and compensating for focus errors in a photolithography tool
CN1244018C (zh) * 1996-11-28 2006-03-01 株式会社尼康 曝光方法和曝光装置
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
EP1037117A3 (en) * 1999-03-08 2003-11-12 ASML Netherlands B.V. Off-axis levelling in lithographic projection apparatus
JP2001160530A (ja) * 1999-12-01 2001-06-12 Nikon Corp ステージ装置及び露光装置
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system

Similar Documents

Publication Publication Date Title
JP2003031493A5 (enExample)
US5805866A (en) Alignment method
CN111656282B (zh) 确定衬底栅格的测量设备和方法
TWI298428B (en) Lithographic apparatus, method of controlling projection of beams onto a substrate, and lithographic substrate focus control system
JP6140662B2 (ja) 応力ならびにオーバーレイのフィードフォーワード、及び／または、フィードバック・リソグラフィック・プロセス制御
KR101704872B1 (ko) 교정 방법, 측정 장치, 노광 장치 및 물품의 제조 방법
JP2008199034A (ja) リソグラフィ投影装置のオフアクシスレベリング
WO2008038751A1 (en) Line width measuring method, image forming status detecting method, adjusting method, exposure method and device manufacturing method
US20090284722A1 (en) Method for monitoring focus on an integrated wafer
WO1998025182A1 (en) Reticle that compensates for lens error in a photolithographic system
JPH08288193A (ja) 位置合わせ方法
US20240184221A1 (en) Alignment method and associated alignment and lithographic apparatuses
US11809088B2 (en) Method for controlling a lithographic apparatus
TWI444786B (zh) 微影裝置及器件製造方法
US8555208B2 (en) Systems and methods for implementing and manufacturing reticles for use in photolithography tools
JP2009071103A (ja) 露光システムおよび半導体装置の製造方法
CN114616523B (zh) 用于推断诸如焦距的处理参数的方法和相关联装置和制造方法
CN116529673A (zh) 量测方法及相关量测和光刻装置
JP3271348B2 (ja) レベリング合わせ面計測方法及び露光装置
US7072027B2 (en) Exposure apparatus, method of controlling same, and method of manufacturing devices
TW202136926A (zh) 對準方法及相關的對準及微影設備
CN108333880A (zh) 光刻曝光装置及其焦面测量装置和方法
CN108292111B (zh) 用于在光刻设备中处理衬底的方法和设备
JP7331238B2 (ja) 基板高さを測定する装置及び方法
JPH05315222A (ja) 位置合わせ方法