JP4208418B2 - 電子線又はx線用ネガ型レジスト組成物 - Google Patents
電子線又はx線用ネガ型レジスト組成物 Download PDFInfo
- Publication number
- JP4208418B2 JP4208418B2 JP2001005374A JP2001005374A JP4208418B2 JP 4208418 B2 JP4208418 B2 JP 4208418B2 JP 2001005374 A JP2001005374 A JP 2001005374A JP 2001005374 A JP2001005374 A JP 2001005374A JP 4208418 B2 JP4208418 B2 JP 4208418B2
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- Prior art keywords
- group
- substituent
- resin
- acid
- hydrogen atom
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- Expired - Fee Related
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- 0 CC1[C@@]2(C)C(*)C(*)C(C)(*)C(C3*)C13C2C(Cc(c(*)c(*)c(*)c1*)c1N)Cc1c(*)c(CC*)c(*)c(*)c1O* Chemical compound CC1[C@@]2(C)C(*)C(*)C(C)(*)C(C3*)C13C2C(Cc(c(*)c(*)c(*)c1*)c1N)Cc1c(*)c(CC*)c(*)c(*)c1O* 0.000 description 1
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- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001005374A JP4208418B2 (ja) | 2000-01-13 | 2001-01-12 | 電子線又はx線用ネガ型レジスト組成物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000004766 | 2000-01-13 | ||
| JP2000084469 | 2000-03-24 | ||
| JP2000-84469 | 2000-03-24 | ||
| JP2000-4766 | 2000-03-24 | ||
| JP2001005374A JP4208418B2 (ja) | 2000-01-13 | 2001-01-12 | 電子線又はx線用ネガ型レジスト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001337452A JP2001337452A (ja) | 2001-12-07 |
| JP2001337452A5 JP2001337452A5 (enExample) | 2006-01-19 |
| JP4208418B2 true JP4208418B2 (ja) | 2009-01-14 |
Family
ID=27342029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001005374A Expired - Fee Related JP4208418B2 (ja) | 2000-01-13 | 2001-01-12 | 電子線又はx線用ネガ型レジスト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4208418B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4222850B2 (ja) | 2003-02-10 | 2009-02-12 | Spansion Japan株式会社 | 感放射線性樹脂組成物、その製造法並びにそれを用いた半導体装置の製造方法 |
| JP4569119B2 (ja) * | 2004-02-09 | 2010-10-27 | Jsr株式会社 | 突起および/またはスペーサー形成用の感放射線性樹脂組成物並びに突起および/またはスペーサーの形成方法 |
| JP4753040B2 (ja) * | 2006-09-21 | 2011-08-17 | 日産化学工業株式会社 | 重合性基を有する化合物を含有するネガ型感光性樹脂組成物 |
| JP4629741B2 (ja) * | 2008-01-28 | 2011-02-09 | 富士フイルム株式会社 | 平版印刷版の作製方法 |
| US10656521B2 (en) | 2014-11-26 | 2020-05-19 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate |
-
2001
- 2001-01-12 JP JP2001005374A patent/JP4208418B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001337452A (ja) | 2001-12-07 |
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