JP4208418B2 - 電子線又はx線用ネガ型レジスト組成物 - Google Patents

電子線又はx線用ネガ型レジスト組成物 Download PDF

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Publication number
JP4208418B2
JP4208418B2 JP2001005374A JP2001005374A JP4208418B2 JP 4208418 B2 JP4208418 B2 JP 4208418B2 JP 2001005374 A JP2001005374 A JP 2001005374A JP 2001005374 A JP2001005374 A JP 2001005374A JP 4208418 B2 JP4208418 B2 JP 4208418B2
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group
substituent
resin
acid
hydrogen atom
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Expired - Fee Related
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JP2001005374A
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Japanese (ja)
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JP2001337452A5 (enExample
JP2001337452A (ja
Inventor
利明 青合
豊 阿出川
盛夫 八木原
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2001005374A priority Critical patent/JP4208418B2/ja
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Publication of JP2001337452A5 publication Critical patent/JP2001337452A5/ja
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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2001005374A 2000-01-13 2001-01-12 電子線又はx線用ネガ型レジスト組成物 Expired - Fee Related JP4208418B2 (ja)

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Application Number Priority Date Filing Date Title
JP2001005374A JP4208418B2 (ja) 2000-01-13 2001-01-12 電子線又はx線用ネガ型レジスト組成物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000004766 2000-01-13
JP2000084469 2000-03-24
JP2000-84469 2000-03-24
JP2000-4766 2000-03-24
JP2001005374A JP4208418B2 (ja) 2000-01-13 2001-01-12 電子線又はx線用ネガ型レジスト組成物

Publications (3)

Publication Number Publication Date
JP2001337452A JP2001337452A (ja) 2001-12-07
JP2001337452A5 JP2001337452A5 (enExample) 2006-01-19
JP4208418B2 true JP4208418B2 (ja) 2009-01-14

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JP2001005374A Expired - Fee Related JP4208418B2 (ja) 2000-01-13 2001-01-12 電子線又はx線用ネガ型レジスト組成物

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4222850B2 (ja) 2003-02-10 2009-02-12 Spansion Japan株式会社 感放射線性樹脂組成物、その製造法並びにそれを用いた半導体装置の製造方法
JP4569119B2 (ja) * 2004-02-09 2010-10-27 Jsr株式会社 突起および/またはスペーサー形成用の感放射線性樹脂組成物並びに突起および/またはスペーサーの形成方法
JP4753040B2 (ja) * 2006-09-21 2011-08-17 日産化学工業株式会社 重合性基を有する化合物を含有するネガ型感光性樹脂組成物
JP4629741B2 (ja) * 2008-01-28 2011-02-09 富士フイルム株式会社 平版印刷版の作製方法
US10656521B2 (en) 2014-11-26 2020-05-19 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate

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JP2001337452A (ja) 2001-12-07

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