JP2001337452A5 - - Google Patents
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- Publication number
- JP2001337452A5 JP2001337452A5 JP2001005374A JP2001005374A JP2001337452A5 JP 2001337452 A5 JP2001337452 A5 JP 2001337452A5 JP 2001005374 A JP2001005374 A JP 2001005374A JP 2001005374 A JP2001005374 A JP 2001005374A JP 2001337452 A5 JP2001337452 A5 JP 2001337452A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- substituent
- hydrogen atom
- electron beam
- resist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001005374A JP4208418B2 (ja) | 2000-01-13 | 2001-01-12 | 電子線又はx線用ネガ型レジスト組成物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000004766 | 2000-01-13 | ||
| JP2000084469 | 2000-03-24 | ||
| JP2000-84469 | 2000-03-24 | ||
| JP2000-4766 | 2000-03-24 | ||
| JP2001005374A JP4208418B2 (ja) | 2000-01-13 | 2001-01-12 | 電子線又はx線用ネガ型レジスト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001337452A JP2001337452A (ja) | 2001-12-07 |
| JP2001337452A5 true JP2001337452A5 (enExample) | 2006-01-19 |
| JP4208418B2 JP4208418B2 (ja) | 2009-01-14 |
Family
ID=27342029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001005374A Expired - Fee Related JP4208418B2 (ja) | 2000-01-13 | 2001-01-12 | 電子線又はx線用ネガ型レジスト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4208418B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4222850B2 (ja) | 2003-02-10 | 2009-02-12 | Spansion Japan株式会社 | 感放射線性樹脂組成物、その製造法並びにそれを用いた半導体装置の製造方法 |
| JP4569119B2 (ja) * | 2004-02-09 | 2010-10-27 | Jsr株式会社 | 突起および/またはスペーサー形成用の感放射線性樹脂組成物並びに突起および/またはスペーサーの形成方法 |
| JP4753040B2 (ja) * | 2006-09-21 | 2011-08-17 | 日産化学工業株式会社 | 重合性基を有する化合物を含有するネガ型感光性樹脂組成物 |
| JP4629741B2 (ja) * | 2008-01-28 | 2011-02-09 | 富士フイルム株式会社 | 平版印刷版の作製方法 |
| US10656521B2 (en) | 2014-11-26 | 2020-05-19 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate |
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2001
- 2001-01-12 JP JP2001005374A patent/JP4208418B2/ja not_active Expired - Fee Related