JP4197292B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP4197292B2 JP4197292B2 JP2003411240A JP2003411240A JP4197292B2 JP 4197292 B2 JP4197292 B2 JP 4197292B2 JP 2003411240 A JP2003411240 A JP 2003411240A JP 2003411240 A JP2003411240 A JP 2003411240A JP 4197292 B2 JP4197292 B2 JP 4197292B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- radiator
- housing
- heat
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Surgical Instruments (AREA)
- Valve Device For Special Equipments (AREA)
- Noodles (AREA)
Description
12 筐体
14 第一基板
16 第二基板
18 放熱器
20 コネクタ
22 発熱部品
28 組立ガイド構造
30 凸部
32 穴部
Claims (8)
- 筐体と、
前記筐体に組み付けられた第一の基板と、
前記第一の基板と接続され、発熱部品が実装された第二の基板と、
前記発熱部品と接触するように配置された放熱器とを備え、
前記第二の基板は前記筐体と前記放熱器の取付部分にて、前記筐体と前記放熱器との間に挟み込まれたことを特徴とする電子装置。 - 前記放熱器は、前記第二の基板を介して前記筐体と接続されたことを特徴とする請求項1に記載の電子装置。
- 前記筐体および前記放熱器を形成する面のうち、前記筐体と前記放熱器と前記第二の基板とがそれぞれ組付けられた状態において前記第二の基板と向かい合っている前記筐体の面および前記放熱器の面が前記第二の基板の面と同じ大きさであることを特徴とする請求項1または請求項2に記載の電子装置。
- 前記筐体は、筐体外面から突出した筐体側取付部を備え、前記筐体側取付部に前記第二の基板が取り付けられたことを特徴とする請求項1に記載の電子装置。
- 前記放熱器は、放熱器外面から突出した放熱器側取付部を備え、前記放熱器側取付部に前記第二の基板が取り付けられたことを特徴とする請求項1ないし請求項4のいずれかに記載の電子装置。
- 前記第一の基板と前記第二の基板とが、前記第一の基板と前記第二の基板とを所定の組付位置で組み付けるために、前記第一の基板と前記第二の基板の一方に設けられた穴部と、他方に設けられた凸部で構成された組立ガイド構造をそれぞれ備えたことを特徴とする請求項1ないし請求項5のいずれかに記載の電子装置。
- 筐体と、
発熱部品が実装された基板と、
前記発熱部品に接触するように配置された放熱器とを備え、
前記基板は前記筐体と前記放熱器の取付部分にて、前記筐体と前記放熱器との間に挟み込まれたことを特徴とする電子装置。 - 前記放熱器は、前記基板を介して前記筐体と接続されたことを特徴とする請求項7に記載の電子装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003411240A JP4197292B2 (ja) | 2003-12-10 | 2003-12-10 | 電子装置 |
DE602004030988T DE602004030988D1 (de) | 2003-12-10 | 2004-11-18 | Elektronische Vorrichtung |
EP04027461A EP1542521B1 (en) | 2003-12-10 | 2004-11-18 | An electronic device |
AT04027461T ATE495655T1 (de) | 2003-12-10 | 2004-11-18 | Elektronische vorrichtung |
CNB2004101003179A CN100471373C (zh) | 2003-12-10 | 2004-12-06 | 电子装置 |
US11/006,106 US7262970B2 (en) | 2003-12-10 | 2004-12-07 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003411240A JP4197292B2 (ja) | 2003-12-10 | 2003-12-10 | 電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005175103A JP2005175103A (ja) | 2005-06-30 |
JP4197292B2 true JP4197292B2 (ja) | 2008-12-17 |
Family
ID=34510508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003411240A Expired - Fee Related JP4197292B2 (ja) | 2003-12-10 | 2003-12-10 | 電子装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7262970B2 (ja) |
EP (1) | EP1542521B1 (ja) |
JP (1) | JP4197292B2 (ja) |
CN (1) | CN100471373C (ja) |
AT (1) | ATE495655T1 (ja) |
DE (1) | DE602004030988D1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2355628B1 (en) | 2010-01-29 | 2013-10-16 | LG Electronics Inc. | Mobile terminal |
CN102420001B (zh) * | 2010-10-21 | 2014-04-09 | 延锋伟世通汽车电子有限公司 | 一种汽车音响光碟机芯散热模块 |
CN108990251B (zh) | 2017-06-02 | 2020-12-25 | 台达电子工业股份有限公司 | 印刷电路板组装结构及其组装方法 |
TWI642331B (zh) * | 2017-06-02 | 2018-11-21 | 台達電子工業股份有限公司 | 印刷電路板組裝結構及其組裝方法 |
JP2021040019A (ja) * | 2019-09-03 | 2021-03-11 | 住友電装株式会社 | 基板ケース及び電気接続箱 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2964621A (en) * | 1957-02-04 | 1960-12-13 | Motorola Inc | Combined transistor heat sink and panel |
JPS60261160A (ja) * | 1984-06-07 | 1985-12-24 | Mitsubishi Electric Corp | 電気機器の放熱装置 |
US4872102A (en) * | 1986-04-28 | 1989-10-03 | Dimensions Unlimited, Inc. | D.C. to A.C. inverter having improved structure providing improved thermal dissipation |
US5689403A (en) * | 1994-12-27 | 1997-11-18 | Motorola, Inc. | Intercooled electronic device |
JP2001111272A (ja) * | 1999-10-12 | 2001-04-20 | Kenwood Corp | 放熱器取付構造 |
US6778388B1 (en) * | 2001-07-23 | 2004-08-17 | Garmin Ltd. | Water-resistant electronic enclosure having a heat sink |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
-
2003
- 2003-12-10 JP JP2003411240A patent/JP4197292B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-18 EP EP04027461A patent/EP1542521B1/en not_active Not-in-force
- 2004-11-18 AT AT04027461T patent/ATE495655T1/de not_active IP Right Cessation
- 2004-11-18 DE DE602004030988T patent/DE602004030988D1/de active Active
- 2004-12-06 CN CNB2004101003179A patent/CN100471373C/zh not_active Expired - Fee Related
- 2004-12-07 US US11/006,106 patent/US7262970B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1542521B1 (en) | 2011-01-12 |
CN1627893A (zh) | 2005-06-15 |
EP1542521A2 (en) | 2005-06-15 |
DE602004030988D1 (de) | 2011-02-24 |
ATE495655T1 (de) | 2011-01-15 |
CN100471373C (zh) | 2009-03-18 |
JP2005175103A (ja) | 2005-06-30 |
EP1542521A3 (en) | 2008-02-20 |
US7262970B2 (en) | 2007-08-28 |
US20050128711A1 (en) | 2005-06-16 |
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