JP4192742B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP4192742B2 JP4192742B2 JP2003342707A JP2003342707A JP4192742B2 JP 4192742 B2 JP4192742 B2 JP 4192742B2 JP 2003342707 A JP2003342707 A JP 2003342707A JP 2003342707 A JP2003342707 A JP 2003342707A JP 4192742 B2 JP4192742 B2 JP 4192742B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- metal base
- submount
- emitting element
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 133
- 239000002184 metal Substances 0.000 claims description 133
- 239000011521 glass Substances 0.000 claims description 61
- 238000007789 sealing Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 31
- 239000003086 colorant Substances 0.000 claims description 2
- 239000005394 sealing glass Substances 0.000 description 20
- 230000000694 effects Effects 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000002893 slag Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002991 molded plastic Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003342707A JP4192742B2 (ja) | 2003-09-30 | 2003-09-30 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003342707A JP4192742B2 (ja) | 2003-09-30 | 2003-09-30 | 発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005109282A JP2005109282A (ja) | 2005-04-21 |
JP2005109282A5 JP2005109282A5 (enrdf_load_stackoverflow) | 2007-08-16 |
JP4192742B2 true JP4192742B2 (ja) | 2008-12-10 |
Family
ID=34536896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003342707A Expired - Fee Related JP4192742B2 (ja) | 2003-09-30 | 2003-09-30 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4192742B2 (enrdf_load_stackoverflow) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310204A (ja) * | 2005-04-28 | 2006-11-09 | Toyoda Gosei Co Ltd | Led灯具 |
JP4839687B2 (ja) * | 2005-06-15 | 2011-12-21 | パナソニック電工株式会社 | 発光装置 |
JP2007043125A (ja) * | 2005-06-30 | 2007-02-15 | Matsushita Electric Works Ltd | 発光装置 |
WO2007004572A1 (ja) | 2005-06-30 | 2007-01-11 | Matsushita Electric Works, Ltd. | 発光装置 |
JP2007165937A (ja) * | 2005-06-30 | 2007-06-28 | Matsushita Electric Works Ltd | 発光装置 |
JP3948488B2 (ja) * | 2005-09-09 | 2007-07-25 | 松下電工株式会社 | 発光装置 |
JP4203675B2 (ja) * | 2005-09-20 | 2009-01-07 | パナソニック電工株式会社 | 発光装置 |
JP3952075B2 (ja) * | 2005-09-20 | 2007-08-01 | 松下電工株式会社 | 発光装置 |
JP4204058B2 (ja) * | 2005-09-20 | 2009-01-07 | パナソニック電工株式会社 | Led照明器具 |
JP4829577B2 (ja) * | 2005-09-20 | 2011-12-07 | パナソニック電工株式会社 | 発光装置 |
JP3963188B2 (ja) * | 2005-09-20 | 2007-08-22 | 松下電工株式会社 | 発光装置 |
JP3948483B2 (ja) * | 2005-09-20 | 2007-07-25 | 松下電工株式会社 | 発光装置 |
CN100594623C (zh) | 2005-09-20 | 2010-03-17 | 松下电工株式会社 | 发光二极管照明器具 |
KR100985452B1 (ko) | 2005-09-20 | 2010-10-05 | 파나소닉 전공 주식회사 | 발광 장치 |
JP5212532B2 (ja) * | 2005-10-31 | 2013-06-19 | 豊田合成株式会社 | 発光装置の製造方法 |
JP3992059B2 (ja) * | 2005-11-21 | 2007-10-17 | 松下電工株式会社 | 発光装置の製造方法 |
JP4013077B2 (ja) * | 2005-11-21 | 2007-11-28 | 松下電工株式会社 | 発光装置およびその製造方法 |
JP4631785B2 (ja) * | 2006-04-06 | 2011-02-16 | パナソニック電工株式会社 | 金属ベース回路板及びその製造方法、実装部品、モジュール |
JP5214121B2 (ja) * | 2006-08-07 | 2013-06-19 | 新光電気工業株式会社 | 発光装置 |
TWI337410B (en) * | 2007-05-28 | 2011-02-11 | Everlight Electronics Co Ltd | A light emitting diode package with two heat disspation paths |
JP4678392B2 (ja) * | 2007-07-17 | 2011-04-27 | パナソニック電工株式会社 | 発光装置およびその製造方法 |
JP2009239116A (ja) * | 2008-03-27 | 2009-10-15 | Sharp Corp | 発光装置 |
DE102008021435A1 (de) * | 2008-04-29 | 2009-11-19 | Schott Ag | Gehäuse für LEDs mit hoher Leistung |
JP6022183B2 (ja) * | 2011-03-31 | 2016-11-09 | 株式会社神戸製鋼所 | Led照明用ヒートシンク |
CN102881812B (zh) * | 2011-07-15 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光二极管封装结构的制造方法 |
JP5748611B2 (ja) * | 2011-08-22 | 2015-07-15 | 京セラ株式会社 | 発光装置 |
US9874316B2 (en) * | 2012-01-03 | 2018-01-23 | Philips Lighting Holding B.V. | Lighting assembly, a light source and a luminaire |
CN104576904B (zh) * | 2013-10-15 | 2017-09-19 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
-
2003
- 2003-09-30 JP JP2003342707A patent/JP4192742B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005109282A (ja) | 2005-04-21 |
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