JP4184396B2 - 電子部品を内蔵した配線基板の製造方法 - Google Patents
電子部品を内蔵した配線基板の製造方法 Download PDFInfo
- Publication number
- JP4184396B2 JP4184396B2 JP2006188280A JP2006188280A JP4184396B2 JP 4184396 B2 JP4184396 B2 JP 4184396B2 JP 2006188280 A JP2006188280 A JP 2006188280A JP 2006188280 A JP2006188280 A JP 2006188280A JP 4184396 B2 JP4184396 B2 JP 4184396B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulating member
- wiring board
- manufacturing
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
以上、添付図面を参照しながら本発明の好適な実施例について説明したが、本発明はかかる例に限定されないことは言うまでもない。当業者であれば、特許請求の範囲に記載された範疇内において、各種の変更例または修正例に想到し得ることは明らかである。
102、202 実装孔
103、203 電子部品
104、204 位置決め突起
105 樹脂塗布銅箔
205 層間接着材
206 銅箔
Claims (7)
- (a)絶縁部材、および下面に位置決め手段が設けられた電子部品を準備する工程と、
(b)前記絶縁部材に前記位置決め手段と対応する実装孔を設ける工程と、
(c)前記位置決め手段が前記実装孔に合わせられるように、前記電子部品を前記絶縁部材に実装する工程と、
(d)前記電子部品を覆うように、接着剤の塗布された銅箔を前記絶縁部材に設置する工程と、
(e)前記銅箔を加熱および/または加圧する工程と、
(f)前記電子部品と電気的に連結されるように、前記銅箔にビアホールを設け、前記銅箔に回路を形成する工程とを含むことを特徴とする、電子部品を内蔵した配線基板の製造方法。 - (a)絶縁部材、及び下面に位置決め手段が設けられた電子部品を準備する工程と、
(b)前記絶縁部材に前記位置決め手段と対応する実装孔を設ける工程と、
(c)前記位置決め手段が前記実装孔に合わせられるように、前記電子部品を前記絶縁部材に実装する工程と、
(d)前記電子部品を覆うように、前記絶縁部材の両面に層間接着材を設置する工程と、
(e)前記層間接着材の両面に銅箔を設置する工程と、
(f)前記銅箔を加熱および/または加圧する工程と、
(g)前記電子部品と電気的に連結されるように、前記銅箔にビアホールを設け、前記銅箔に回路を形成する工程とを含むことを特徴とする、電子部品を内蔵した配線基板の製造方法。 - 前記層間接着材は、プリプレグであることを特徴とする、請求項2に記載の配線基板の製造方法。
- 前記層間接着材は、固相または液相であることを特徴とする、請求項2に記載の配線基板の製造方法。
- 前記絶縁部材は、樹脂、プリプレグまたは金属コア(metal core)で製造されることを特徴とする、請求項1または2に記載の配線基板の製造方法。
- 前記位置決め手段は、前記電子部品と電気的に連結される金属パッドであることを特徴とする、請求項1または2に記載の配線基板の製造方法。
- 前記位置決め手段は、前記電子部品と電気的に断絶される位置決め突起であることを特徴とする、請求項1または2に記載の配線基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050061370A KR100651563B1 (ko) | 2005-07-07 | 2005-07-07 | 전자부품이 내장된 배선기판의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007019516A JP2007019516A (ja) | 2007-01-25 |
JP4184396B2 true JP4184396B2 (ja) | 2008-11-19 |
Family
ID=37598152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006188280A Expired - Fee Related JP4184396B2 (ja) | 2005-07-07 | 2006-07-07 | 電子部品を内蔵した配線基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7328504B2 (ja) |
JP (1) | JP4184396B2 (ja) |
KR (1) | KR100651563B1 (ja) |
CN (1) | CN100556247C (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101003585B1 (ko) * | 2008-06-25 | 2010-12-22 | 삼성전기주식회사 | 전자부품 내장형 인쇄회로기판 및 그 제조방법 |
US8186042B2 (en) * | 2009-05-06 | 2012-05-29 | Bae Systems Information And Electronic Systems Integration Inc. | Manufacturing method of a printed board assembly |
CN204810668U (zh) * | 2014-04-04 | 2015-11-25 | 史利利 | 印制线路板 |
KR20160013706A (ko) * | 2014-07-28 | 2016-02-05 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
US20180177045A1 (en) * | 2016-12-21 | 2018-06-21 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding Component in Component Carrier by Component Fixation Structure |
CN108347820B (zh) * | 2017-01-25 | 2020-09-15 | 奥特斯(中国)有限公司 | 容纳部件的基底结构上的高导热涂层 |
CN110798974B (zh) * | 2018-08-01 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | 埋嵌式基板及其制作方法,及具有该埋嵌式基板的电路板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
US4918811A (en) * | 1986-09-26 | 1990-04-24 | General Electric Company | Multichip integrated circuit packaging method |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
FR2625067A1 (fr) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Procede pour fixer sur un support un composant electronique et ses contacts |
USRE35385E (en) * | 1988-12-12 | 1996-12-03 | Sgs-Thomson Microelectronics, Sa. | Method for fixing an electronic component and its contacts to a support |
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
JP3280394B2 (ja) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | 電子装置 |
JP4270769B2 (ja) | 2000-12-15 | 2009-06-03 | イビデン株式会社 | 多層プリント配線板の製造方法 |
-
2005
- 2005-07-07 KR KR1020050061370A patent/KR100651563B1/ko not_active IP Right Cessation
-
2006
- 2006-06-15 US US11/453,790 patent/US7328504B2/en not_active Expired - Fee Related
- 2006-06-20 CN CNB2006100867657A patent/CN100556247C/zh not_active Expired - Fee Related
- 2006-07-07 JP JP2006188280A patent/JP4184396B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100556247C (zh) | 2009-10-28 |
US7328504B2 (en) | 2008-02-12 |
CN1893776A (zh) | 2007-01-10 |
US20070006456A1 (en) | 2007-01-11 |
KR100651563B1 (ko) | 2006-11-29 |
JP2007019516A (ja) | 2007-01-25 |
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