JP4104887B2 - 電気電子器具の内部構造 - Google Patents

電気電子器具の内部構造 Download PDF

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Publication number
JP4104887B2
JP4104887B2 JP2002083503A JP2002083503A JP4104887B2 JP 4104887 B2 JP4104887 B2 JP 4104887B2 JP 2002083503 A JP2002083503 A JP 2002083503A JP 2002083503 A JP2002083503 A JP 2002083503A JP 4104887 B2 JP4104887 B2 JP 4104887B2
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JP
Japan
Prior art keywords
heat
conducting member
heat conducting
electric
generating electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002083503A
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English (en)
Japanese (ja)
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JP2002319652A (ja
JP2002319652A5 (enExample
Inventor
公人 船戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to JP2002083503A priority Critical patent/JP4104887B2/ja
Publication of JP2002319652A publication Critical patent/JP2002319652A/ja
Publication of JP2002319652A5 publication Critical patent/JP2002319652A5/ja
Application granted granted Critical
Publication of JP4104887B2 publication Critical patent/JP4104887B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002083503A 2002-03-25 2002-03-25 電気電子器具の内部構造 Expired - Fee Related JP4104887B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002083503A JP4104887B2 (ja) 2002-03-25 2002-03-25 電気電子器具の内部構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002083503A JP4104887B2 (ja) 2002-03-25 2002-03-25 電気電子器具の内部構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP10275300A Division JP2000106495A (ja) 1998-09-29 1998-09-29 電気電子器具の内部構造

Publications (3)

Publication Number Publication Date
JP2002319652A JP2002319652A (ja) 2002-10-31
JP2002319652A5 JP2002319652A5 (enExample) 2005-11-10
JP4104887B2 true JP4104887B2 (ja) 2008-06-18

Family

ID=19193390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002083503A Expired - Fee Related JP4104887B2 (ja) 2002-03-25 2002-03-25 電気電子器具の内部構造

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JP (1) JP4104887B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676793A1 (en) 2012-06-22 2013-12-25 Nitto Denko Corporation Radiant heat conduction-suppressing sheet

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7188484B2 (en) * 2003-06-09 2007-03-13 Lg Electronics Inc. Heat dissipating structure for mobile device
JP4841566B2 (ja) * 2008-01-07 2011-12-21 三菱電機株式会社 パワーコンディショナ
US8673471B2 (en) 2008-09-22 2014-03-18 Panasonic Corporation Portable electronic device
KR101848539B1 (ko) * 2011-11-15 2018-04-12 헨켈 아이피 앤드 홀딩 게엠베하 단열 층을 구비하여 조립된 전자 장치
JP2013220652A (ja) * 2012-04-19 2013-10-28 Three M Innovative Properties Co 遮熱シート
TWI657132B (zh) 2013-12-19 2019-04-21 Henkel IP & Holding GmbH 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
TWM489869U (en) * 2014-07-16 2014-11-11 Force Applied Material Tech Company Heat insulation adhesive structure and substrate having the same
JP6304772B2 (ja) * 2015-10-26 2018-04-04 Ｎｅｃプラットフォームズ株式会社 電子部品、サーバー、カバー部材、および、支持部材
CN105555107B (zh) * 2016-02-29 2018-06-29 联想(北京)有限公司 无风扇散热系统及电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676793A1 (en) 2012-06-22 2013-12-25 Nitto Denko Corporation Radiant heat conduction-suppressing sheet

Also Published As

Publication number Publication date
JP2002319652A (ja) 2002-10-31

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