JP2002319652A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002319652A5 JP2002319652A5 JP2002083503A JP2002083503A JP2002319652A5 JP 2002319652 A5 JP2002319652 A5 JP 2002319652A5 JP 2002083503 A JP2002083503 A JP 2002083503A JP 2002083503 A JP2002083503 A JP 2002083503A JP 2002319652 A5 JP2002319652 A5 JP 2002319652A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083503A JP4104887B2 (ja) | 2002-03-25 | 2002-03-25 | 電気電子器具の内部構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083503A JP4104887B2 (ja) | 2002-03-25 | 2002-03-25 | 電気電子器具の内部構造 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10275300A Division JP2000106495A (ja) | 1998-09-29 | 1998-09-29 | 電気電子器具の内部構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002319652A JP2002319652A (ja) | 2002-10-31 |
| JP2002319652A5 true JP2002319652A5 (enExample) | 2005-11-10 |
| JP4104887B2 JP4104887B2 (ja) | 2008-06-18 |
Family
ID=19193390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002083503A Expired - Fee Related JP4104887B2 (ja) | 2002-03-25 | 2002-03-25 | 電気電子器具の内部構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4104887B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
| JP4841566B2 (ja) * | 2008-01-07 | 2011-12-21 | 三菱電機株式会社 | パワーコンディショナ |
| JP5643648B2 (ja) | 2008-09-22 | 2014-12-17 | パナソニック株式会社 | 携帯電子機器 |
| KR101848539B1 (ko) * | 2011-11-15 | 2018-04-12 | 헨켈 아이피 앤드 홀딩 게엠베하 | 단열 층을 구비하여 조립된 전자 장치 |
| JP2013220652A (ja) * | 2012-04-19 | 2013-10-28 | Three M Innovative Properties Co | 遮熱シート |
| JP5906140B2 (ja) | 2012-06-22 | 2016-04-20 | 日東電工株式会社 | 輻射熱伝導抑制シート |
| TWI657132B (zh) | 2013-12-19 | 2019-04-21 | Henkel IP & Holding GmbH | 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置 |
| TWM489869U (en) * | 2014-07-16 | 2014-11-11 | Force Applied Material Tech Company | Heat insulation adhesive structure and substrate having the same |
| JP6304772B2 (ja) | 2015-10-26 | 2018-04-04 | Ｎｅｃプラットフォームズ株式会社 | 電子部品、サーバー、カバー部材、および、支持部材 |
| CN105555107B (zh) * | 2016-02-29 | 2018-06-29 | 联想(北京)有限公司 | 无风扇散热系统及电子设备 |
-
2002
- 2002-03-25 JP JP2002083503A patent/JP4104887B2/ja not_active Expired - Fee Related