JP4102277B2 - 半導体集積回路装置 - Google Patents

半導体集積回路装置 Download PDF

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Publication number
JP4102277B2
JP4102277B2 JP2003321059A JP2003321059A JP4102277B2 JP 4102277 B2 JP4102277 B2 JP 4102277B2 JP 2003321059 A JP2003321059 A JP 2003321059A JP 2003321059 A JP2003321059 A JP 2003321059A JP 4102277 B2 JP4102277 B2 JP 4102277B2
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Prior art keywords
circuit
terminal
power supply
potential
protection
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Expired - Fee Related
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JP2003321059A
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Japanese (ja)
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JP2005093496A (ja
JP2005093496A5 (enrdf_load_stackoverflow
Inventor
信孝 北川
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Toshiba Corp
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Toshiba Corp
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  • Semiconductor Integrated Circuits (AREA)
JP2003321059A 2003-09-12 2003-09-12 半導体集積回路装置 Expired - Fee Related JP4102277B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003321059A JP4102277B2 (ja) 2003-09-12 2003-09-12 半導体集積回路装置

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JP2003321059A JP4102277B2 (ja) 2003-09-12 2003-09-12 半導体集積回路装置

Publications (3)

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JP2005093496A JP2005093496A (ja) 2005-04-07
JP2005093496A5 JP2005093496A5 (enrdf_load_stackoverflow) 2005-08-25
JP4102277B2 true JP4102277B2 (ja) 2008-06-18

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JP2003321059A Expired - Fee Related JP4102277B2 (ja) 2003-09-12 2003-09-12 半導体集積回路装置

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JP (1) JP4102277B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4913376B2 (ja) * 2005-08-22 2012-04-11 ローム株式会社 半導体集積回路装置
JP5388632B2 (ja) * 2008-03-14 2014-01-15 株式会社半導体エネルギー研究所 半導体装置
JP5578805B2 (ja) * 2008-05-19 2014-08-27 キヤノン株式会社 半導体集積回路の保護回路及びその駆動方法
JP2011040520A (ja) * 2009-08-10 2011-02-24 Asahi Kasei Electronics Co Ltd 保護回路
JP2011119356A (ja) 2009-12-01 2011-06-16 Sanyo Electric Co Ltd 半導体装置
JP2012174983A (ja) * 2011-02-23 2012-09-10 Toshiba Corp 集積回路
JP5743850B2 (ja) 2011-10-28 2015-07-01 株式会社東芝 集積回路
JP5752659B2 (ja) * 2012-09-20 2015-07-22 株式会社東芝 半導体回路
JP7413303B2 (ja) * 2021-03-17 2024-01-15 株式会社東芝 半導体装置及び半導体システム

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