JP4100965B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4100965B2
JP4100965B2 JP2002161865A JP2002161865A JP4100965B2 JP 4100965 B2 JP4100965 B2 JP 4100965B2 JP 2002161865 A JP2002161865 A JP 2002161865A JP 2002161865 A JP2002161865 A JP 2002161865A JP 4100965 B2 JP4100965 B2 JP 4100965B2
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JP
Japan
Prior art keywords
substrate
flexible substrate
base film
imaging apparatus
photoelectric conversion
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Expired - Fee Related
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JP2002161865A
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English (en)
Japanese (ja)
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JP2003133654A5 (enExample
JP2003133654A (ja
Inventor
修 浜本
賢治 梶原
浩司 佐藤
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Canon Inc
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Canon Inc
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Priority to JP2002161865A priority Critical patent/JP4100965B2/ja
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Publication of JP2003133654A5 publication Critical patent/JP2003133654A5/ja
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  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2002161865A 2001-06-13 2002-06-03 半導体装置の製造方法 Expired - Fee Related JP4100965B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002161865A JP4100965B2 (ja) 2001-06-13 2002-06-03 半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001178844 2001-06-13
JP2001-178844 2001-06-13
JP2002161865A JP4100965B2 (ja) 2001-06-13 2002-06-03 半導体装置の製造方法

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JP2003133654A JP2003133654A (ja) 2003-05-09
JP2003133654A5 JP2003133654A5 (enExample) 2005-10-06
JP4100965B2 true JP4100965B2 (ja) 2008-06-11

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JP2002161865A Expired - Fee Related JP4100965B2 (ja) 2001-06-13 2002-06-03 半導体装置の製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014091970A1 (ja) 2012-12-12 2014-06-19 オリンパス株式会社 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4209762B2 (ja) * 2003-12-12 2009-01-14 パナソニック株式会社 撮像装置
JP4871629B2 (ja) * 2006-04-12 2012-02-08 キヤノン株式会社 放射線撮像装置の製造方法及び放射線撮像システム
JP4855168B2 (ja) * 2006-07-27 2012-01-18 オリンパス株式会社 固体撮像装置
KR101761817B1 (ko) 2011-03-04 2017-07-26 삼성전자주식회사 대면적 엑스선 검출기
JP2012227404A (ja) * 2011-04-21 2012-11-15 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板
JP6231778B2 (ja) * 2013-06-05 2017-11-15 キヤノン株式会社 電気デバイスおよび放射線検査装置
CN109804720A (zh) * 2016-12-28 2019-05-24 株式会社藤仓 布线体组件、布线基板以及接触式传感器
CN113241352B (zh) * 2021-05-19 2024-03-15 中国科学院长春光学精密机械与物理研究所 图像传感器封装用可打线的柔性电路板及其制备工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014091970A1 (ja) 2012-12-12 2014-06-19 オリンパス株式会社 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム
US9997449B2 (en) 2012-12-12 2018-06-12 Olympus Corporation Semiconductor device connection structure, ultrasonic module, and ultrasonic endoscope system having ultrasonic module

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JP2003133654A (ja) 2003-05-09

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