JP4100155B2 - 発光光源、発光光源アレイ及び当該発光光源を用いた機器 - Google Patents

発光光源、発光光源アレイ及び当該発光光源を用いた機器 Download PDF

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Publication number
JP4100155B2
JP4100155B2 JP2002354279A JP2002354279A JP4100155B2 JP 4100155 B2 JP4100155 B2 JP 4100155B2 JP 2002354279 A JP2002354279 A JP 2002354279A JP 2002354279 A JP2002354279 A JP 2002354279A JP 4100155 B2 JP4100155 B2 JP 4100155B2
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JP
Japan
Prior art keywords
light
total reflection
region
light emitting
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002354279A
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English (en)
Japanese (ja)
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JP2004186092A5 (enExample
JP2004186092A (ja
Inventor
健次 本間
隆広 綾部
浩伸 清本
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Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2002354279A priority Critical patent/JP4100155B2/ja
Priority to EP03104429A priority patent/EP1427029A3/en
Priority to US10/727,175 priority patent/US7161567B2/en
Priority to CNB2003101198933A priority patent/CN1305141C/zh
Publication of JP2004186092A publication Critical patent/JP2004186092A/ja
Publication of JP2004186092A5 publication Critical patent/JP2004186092A5/ja
Application granted granted Critical
Publication of JP4100155B2 publication Critical patent/JP4100155B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
JP2002354279A 2002-12-05 2002-12-05 発光光源、発光光源アレイ及び当該発光光源を用いた機器 Expired - Fee Related JP4100155B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002354279A JP4100155B2 (ja) 2002-12-05 2002-12-05 発光光源、発光光源アレイ及び当該発光光源を用いた機器
EP03104429A EP1427029A3 (en) 2002-12-05 2003-11-27 Light emitting device and apparatus using the same
US10/727,175 US7161567B2 (en) 2002-12-05 2003-12-03 Light emitting device and apparatus using the same
CNB2003101198933A CN1305141C (zh) 2002-12-05 2003-12-05 发光光源、发光光源阵列和采用该发光光源的设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002354279A JP4100155B2 (ja) 2002-12-05 2002-12-05 発光光源、発光光源アレイ及び当該発光光源を用いた機器

Publications (3)

Publication Number Publication Date
JP2004186092A JP2004186092A (ja) 2004-07-02
JP2004186092A5 JP2004186092A5 (enExample) 2005-07-21
JP4100155B2 true JP4100155B2 (ja) 2008-06-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002354279A Expired - Fee Related JP4100155B2 (ja) 2002-12-05 2002-12-05 発光光源、発光光源アレイ及び当該発光光源を用いた機器

Country Status (4)

Country Link
US (1) US7161567B2 (enExample)
EP (1) EP1427029A3 (enExample)
JP (1) JP4100155B2 (enExample)
CN (1) CN1305141C (enExample)

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EP1235281A4 (en) * 1999-11-30 2006-12-06 Omron Tateisi Electronics Co OPTICAL COMPONENT AND APPARATUS CONTAINING THE OPTICAL COMPONENT
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JP2003173712A (ja) * 2001-12-05 2003-06-20 Toyoda Gosei Co Ltd 発光装置及びディスプレイ

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CN1305141C (zh) 2007-03-14
EP1427029A3 (en) 2006-02-01
EP1427029A2 (en) 2004-06-09
US7161567B2 (en) 2007-01-09
CN1519959A (zh) 2004-08-11
JP2004186092A (ja) 2004-07-02

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