JP4088232B2 - ボンディング方法、ボンディング装置及びボンディングプログラム - Google Patents

ボンディング方法、ボンディング装置及びボンディングプログラム Download PDF

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Publication number
JP4088232B2
JP4088232B2 JP2003348888A JP2003348888A JP4088232B2 JP 4088232 B2 JP4088232 B2 JP 4088232B2 JP 2003348888 A JP2003348888 A JP 2003348888A JP 2003348888 A JP2003348888 A JP 2003348888A JP 4088232 B2 JP4088232 B2 JP 4088232B2
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Japan
Prior art keywords
positioning pattern
image
pattern
bonding
chip
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Expired - Fee Related
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JP2003348888A
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English (en)
Japanese (ja)
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JP2005116766A (ja
JP2005116766A5 (https=
Inventor
聡 榎戸
健二 菅原
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Shinkawa Ltd
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Shinkawa Ltd
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Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2003348888A priority Critical patent/JP4088232B2/ja
Priority to US10/959,242 priority patent/US7209583B2/en
Publication of JP2005116766A publication Critical patent/JP2005116766A/ja
Publication of JP2005116766A5 publication Critical patent/JP2005116766A5/ja
Priority to US11/583,106 priority patent/US7324684B2/en
Priority to US11/583,105 priority patent/US7330582B2/en
Application granted granted Critical
Publication of JP4088232B2 publication Critical patent/JP4088232B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Image Processing (AREA)
JP2003348888A 2003-10-07 2003-10-07 ボンディング方法、ボンディング装置及びボンディングプログラム Expired - Fee Related JP4088232B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003348888A JP4088232B2 (ja) 2003-10-07 2003-10-07 ボンディング方法、ボンディング装置及びボンディングプログラム
US10/959,242 US7209583B2 (en) 2003-10-07 2004-10-06 Bonding method, bonding apparatus and bonding program
US11/583,106 US7324684B2 (en) 2003-10-07 2006-10-16 Bonding apparatus
US11/583,105 US7330582B2 (en) 2003-10-07 2006-10-16 Bonding program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003348888A JP4088232B2 (ja) 2003-10-07 2003-10-07 ボンディング方法、ボンディング装置及びボンディングプログラム

Publications (3)

Publication Number Publication Date
JP2005116766A JP2005116766A (ja) 2005-04-28
JP2005116766A5 JP2005116766A5 (https=) 2006-01-26
JP4088232B2 true JP4088232B2 (ja) 2008-05-21

Family

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JP2003348888A Expired - Fee Related JP4088232B2 (ja) 2003-10-07 2003-10-07 ボンディング方法、ボンディング装置及びボンディングプログラム

Country Status (2)

Country Link
US (3) US7209583B2 (https=)
JP (1) JP4088232B2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
JP4128513B2 (ja) * 2003-10-07 2008-07-30 株式会社新川 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム
US7586199B1 (en) 2005-03-23 2009-09-08 Marvell International Ltd. Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types
US8405220B1 (en) 2005-03-23 2013-03-26 Marvell International Ltd. Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types
JP4247299B1 (ja) * 2008-03-31 2009-04-02 株式会社新川 ボンディング装置及びボンディング方法
JP5576219B2 (ja) * 2010-09-09 2014-08-20 株式会社日立ハイテクインスツルメンツ ダイボンダおよびダイボンディング方法
USD654906S1 (en) 2010-10-05 2012-02-28 Bose Corporation Loudspeaker
US20120128229A1 (en) * 2010-11-23 2012-05-24 Kulicke And Soffa Industries, Inc. Imaging operations for a wire bonding system
USD719930S1 (en) 2013-02-07 2014-12-23 Bose Corporation Loudspeaker
US20150155211A1 (en) * 2013-12-03 2015-06-04 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
JP6785092B2 (ja) * 2016-08-19 2020-11-18 株式会社Ｓｃｒｅｅｎホールディングス 変位検出装置、変位検出方法および基板処理装置
CN106514095B (zh) * 2016-12-07 2018-02-06 深圳爱克莱特科技股份有限公司 外墙景光灯自动焊接治具及焊接方法
CN110325318B (zh) * 2017-03-02 2021-03-02 三菱电机株式会社 重叠位置校正装置及重叠位置校正方法
JP2019061130A (ja) * 2017-09-27 2019-04-18 株式会社ジャパンディスプレイ 表示装置および表示装置の製造方法
JP6863946B2 (ja) * 2018-10-31 2021-04-21 ファナック株式会社 画像処理装置
US11540399B1 (en) * 2020-04-09 2022-12-27 Hrl Laboratories, Llc System and method for bonding a cable to a substrate using a die bonder
TWI744999B (zh) * 2020-07-23 2021-11-01 和碩聯合科技股份有限公司 焊點檢測模型訓練方法、焊點檢測方法及焊點檢測裝置
CN113514031A (zh) * 2021-04-15 2021-10-19 石家庄铁道大学 基于机器视觉的建筑物倾斜检测装置及方法
JP2024062780A (ja) * 2022-10-25 2024-05-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

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JPS6356764A (ja) 1986-08-28 1988-03-11 Toshiba Corp 画像処理装置
JP2953116B2 (ja) * 1991-06-11 1999-09-27 日本電気株式会社 ワイヤーボンディング装置
US6205259B1 (en) * 1992-04-09 2001-03-20 Olympus Optical Co., Ltd. Image processing apparatus
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JP3243894B2 (ja) * 1993-06-04 2002-01-07 オムロン株式会社 濃淡画像処理装置
JP2991593B2 (ja) * 1993-08-19 1999-12-20 株式会社東京精密 ダイシング装置の半導体ウェハ形状認識装置
DE69529501T2 (de) * 1994-04-18 2003-12-11 Micron Technology, Inc. Verfahren und vorrichtung zum automatischen positionieren elektronischer würfel in bauteilverpackungen
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US5498767A (en) * 1994-10-11 1996-03-12 Motorola, Inc. Method for positioning bond pads in a semiconductor die layout
JP3143038B2 (ja) * 1994-11-18 2001-03-07 株式会社日立製作所 自動焦点合わせ方法及び装置並びに三次元形状検出方法及びその装置
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JPH11163047A (ja) * 1997-11-27 1999-06-18 Toshiba Corp 半導体装置の製造方法及びその装置
JPH11218412A (ja) * 1998-02-02 1999-08-10 Shinkawa Ltd ボンディング装置
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置
JP3732082B2 (ja) * 2000-09-25 2006-01-05 株式会社新川 ボンディング装置およびボンディング方法
JP4446609B2 (ja) * 2001-01-11 2010-04-07 株式会社新川 画像処理方法および装置
JP2002319028A (ja) * 2001-04-20 2002-10-31 Shinkawa Ltd 画像処理方法、同装置、およびボンディング装置
JP4571763B2 (ja) * 2001-07-18 2010-10-27 株式会社新川 画像処理装置、およびボンディング装置
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
JP4128513B2 (ja) * 2003-10-07 2008-07-30 株式会社新川 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム

Also Published As

Publication number Publication date
US7330582B2 (en) 2008-02-12
US20070036425A1 (en) 2007-02-15
US7324684B2 (en) 2008-01-29
US7209583B2 (en) 2007-04-24
JP2005116766A (ja) 2005-04-28
US20050167471A1 (en) 2005-08-04
US20070041632A1 (en) 2007-02-22

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