JP4079992B2 - 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法 - Google Patents

導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法 Download PDF

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Publication number
JP4079992B2
JP4079992B2 JP51399296A JP51399296A JP4079992B2 JP 4079992 B2 JP4079992 B2 JP 4079992B2 JP 51399296 A JP51399296 A JP 51399296A JP 51399296 A JP51399296 A JP 51399296A JP 4079992 B2 JP4079992 B2 JP 4079992B2
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Japan
Prior art keywords
wafer
gas
platen
mounting member
electrode
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JP51399296A
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Japanese (ja)
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JPH11504760A (ja
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ホワイト，ニコラス・アール
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バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド
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    • H10P72/0434—
    • H10P72/0432—
    • H10P72/72—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP51399296A 1994-10-17 1995-10-17 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法 Expired - Lifetime JP4079992B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32376494A 1994-10-17 1994-10-17
US08/323,764 1994-10-17
PCT/US1995/013158 WO1996013058A2 (en) 1994-10-17 1995-10-17 Apparatus and method for temperature control of workpieces in vacuum

Publications (2)

Publication Number Publication Date
JPH11504760A JPH11504760A (ja) 1999-04-27
JP4079992B2 true JP4079992B2 (ja) 2008-04-23

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JP51399296A Expired - Lifetime JP4079992B2 (ja) 1994-10-17 1995-10-17 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法

Country Status (5)

Country Link
US (1) US5822172A (OSRAM)
EP (1) EP0871843B1 (OSRAM)
JP (1) JP4079992B2 (OSRAM)
DE (1) DE69530801T2 (OSRAM)
WO (1) WO1996013058A2 (OSRAM)

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US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
US20040066601A1 (en) * 2002-10-04 2004-04-08 Varian Semiconductor Equipment Associates, Inc. Electrode configuration for retaining cooling gas on electrostatic wafer clamp
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US7283346B2 (en) * 2002-12-26 2007-10-16 Mitsubishi Heavy Industries, Ltd. Electrostatic chuck and its manufacturing method
US6934595B1 (en) * 2003-02-26 2005-08-23 National Semiconductor Corp. Method and system for reducing semiconductor wafer breakage
US7357115B2 (en) * 2003-03-31 2008-04-15 Lam Research Corporation Wafer clamping apparatus and method for operating the same
US7151658B2 (en) * 2003-04-22 2006-12-19 Axcelis Technologies, Inc. High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
JP5630935B2 (ja) 2003-12-19 2014-11-26 マトソン テクノロジー、インコーポレイテッド 工作物の熱誘起運動を抑制する機器及び装置
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US7126091B1 (en) 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
JP5967859B2 (ja) 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド 熱処理中の被加工物を支持するシステムおよび方法
TWI459851B (zh) * 2007-09-10 2014-11-01 日本碍子股份有限公司 heating equipment
EP2095946A1 (en) 2008-02-27 2009-09-02 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A system for patterning flexible foils
US9558980B2 (en) 2008-04-30 2017-01-31 Axcelis Technologies, Inc. Vapor compression refrigeration chuck for ion implanters
US9036326B2 (en) * 2008-04-30 2015-05-19 Axcelis Technologies, Inc. Gas bearing electrostatic chuck
US9070590B2 (en) 2008-05-16 2015-06-30 Mattson Technology, Inc. Workpiece breakage prevention method and apparatus
JP2010123810A (ja) * 2008-11-20 2010-06-03 Ulvac Japan Ltd 基板保持装置及び基板温度制御方法
US8004817B2 (en) * 2009-06-18 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method of platen fabrication to allow electrode pattern and gas cooling optimization
FR2974251B1 (fr) 2011-04-18 2013-11-01 Ecole Polytech Dispositif pour la gestion thermique d'un élément optique et procédé de gestion thermique associe.
JP5550602B2 (ja) * 2011-04-28 2014-07-16 パナソニック株式会社 静電チャックおよびこれを備えるドライエッチング装置
KR20140053323A (ko) * 2011-08-19 2014-05-07 울박, 인크 진공 처리 장치 및 진공 처리 방법
JP5505667B2 (ja) * 2011-09-30 2014-05-28 Ｔｏｔｏ株式会社 交流駆動静電チャック
US10032601B2 (en) * 2014-02-21 2018-07-24 Varian Semiconductor Equipment Associates, Inc. Platen support structure
KR101877452B1 (ko) * 2016-05-19 2018-08-09 한국기계연구원 도전 물질의 패터닝 장치 및 방법
JP7020951B2 (ja) * 2018-02-09 2022-02-16 東京エレクトロン株式会社 プラズマ処理システムおよびプラズマ処理方法
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
JP7183223B2 (ja) * 2020-08-28 2022-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US11417557B2 (en) 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck

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US5474614A (en) * 1994-06-10 1995-12-12 Texas Instruments Incorporated Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp

Also Published As

Publication number Publication date
EP0871843A4 (OSRAM) 1998-10-21
WO1996013058A3 (en) 1996-06-27
EP0871843B1 (en) 2003-05-14
DE69530801T2 (de) 2004-03-11
DE69530801D1 (de) 2003-06-18
US5822172A (en) 1998-10-13
JPH11504760A (ja) 1999-04-27
EP0871843A2 (en) 1998-10-21
WO1996013058A2 (en) 1996-05-02

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