JP4079206B2 - 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置 - Google Patents

基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置 Download PDF

Info

Publication number
JP4079206B2
JP4079206B2 JP2000381715A JP2000381715A JP4079206B2 JP 4079206 B2 JP4079206 B2 JP 4079206B2 JP 2000381715 A JP2000381715 A JP 2000381715A JP 2000381715 A JP2000381715 A JP 2000381715A JP 4079206 B2 JP4079206 B2 JP 4079206B2
Authority
JP
Japan
Prior art keywords
substrate
signal
container
wafer
stored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000381715A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002184839A (ja
JP2002184839A5 (show.php
Inventor
裕二 上川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000381715A priority Critical patent/JP4079206B2/ja
Publication of JP2002184839A publication Critical patent/JP2002184839A/ja
Publication of JP2002184839A5 publication Critical patent/JP2002184839A5/ja
Application granted granted Critical
Publication of JP4079206B2 publication Critical patent/JP4079206B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2000381715A 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置 Expired - Fee Related JP4079206B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000381715A JP4079206B2 (ja) 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000381715A JP4079206B2 (ja) 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置

Publications (3)

Publication Number Publication Date
JP2002184839A JP2002184839A (ja) 2002-06-28
JP2002184839A5 JP2002184839A5 (show.php) 2005-06-16
JP4079206B2 true JP4079206B2 (ja) 2008-04-23

Family

ID=18849672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000381715A Expired - Fee Related JP4079206B2 (ja) 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置

Country Status (1)

Country Link
JP (1) JP4079206B2 (show.php)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072374A (ja) * 2003-08-26 2005-03-17 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4036238B2 (ja) * 2004-07-02 2008-01-23 新東工業株式会社 アルミニウム鋳物粗材の後処理方法およびその設備
JP2006140418A (ja) * 2004-11-15 2006-06-01 Kaijo Corp 被処理基板の検出システム
JP4863985B2 (ja) 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置
JP5059054B2 (ja) 2009-05-25 2012-10-24 東京エレクトロン株式会社 基板処理システム、基板検出装置および基板検出方法
JP5579796B2 (ja) * 2012-07-23 2014-08-27 東京エレクトロン株式会社 基板処理システム、基板検出装置および基板検出方法
JP6128941B2 (ja) 2013-05-10 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び半導体製造装置
CN109817509A (zh) * 2017-11-20 2019-05-28 顶程国际股份有限公司 晶圆侦测装置及晶圆清洗机
WO2021202029A1 (en) * 2020-04-02 2021-10-07 Applied Materials, Inc. Inspection system
CN119229627B (zh) * 2024-11-29 2025-02-28 艾庞半导体科技(四川)有限公司 用于处理半导体晶片的控制系统

Also Published As

Publication number Publication date
JP2002184839A (ja) 2002-06-28

Similar Documents

Publication Publication Date Title
US5940175A (en) Method and apparatus for surface inspection in a chamber
JP4313824B2 (ja) 基板移載装置及び基板移載方法並びに記憶媒体
TWI540668B (zh) 基板處理裝置、基板裝置之運用方法及記憶媒體
US11664260B2 (en) Systems and methods for orientator based wafer defect sensing
US6776173B2 (en) Liquid processing apparatus
CN102810497B (zh) 断裂晶片回收系统
JP4079206B2 (ja) 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置
JP4100466B2 (ja) 液処理装置
WO2007136066A1 (ja) 基板の変形検出システムおよび変形検出方法
CN101661874A (zh) 热处理装置和热处理方法
US12482682B2 (en) Systems and methods for inspection stations
JPS62181440A (ja) ウェーハ処理方法
US20060087647A1 (en) Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
JP2009524047A (ja) 基板の破損及び移動中の基板のずれを動的に検出するセンサ
US7832353B2 (en) Semiconductor manufacturing apparatus equipped with wafer inspection device and inspection techniques
KR100920463B1 (ko) 반도체 제조 설비
JP2002016123A (ja) 試料処理装置および処理方法
JP3922881B2 (ja) 液処理装置
JP4223504B2 (ja) 液処理装置
CN221766692U (zh) 离子注入机的传送机构
JP4906824B2 (ja) 液処理装置
JP4791379B2 (ja) 基板処理装置、基板搬送方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP4766467B2 (ja) 液処理装置および液処理方法
JP2001335931A (ja) 真空処理装置および処理方法
WO2024210135A1 (ja) 基板搬送装置の監視方法、および、基板処理装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040916

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040916

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070724

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070920

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080129

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110215

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110215

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140215

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees