JP4067164B2 - 研磨方法及び研磨装置 - Google Patents

研磨方法及び研磨装置 Download PDF

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Publication number
JP4067164B2
JP4067164B2 JP06434498A JP6434498A JP4067164B2 JP 4067164 B2 JP4067164 B2 JP 4067164B2 JP 06434498 A JP06434498 A JP 06434498A JP 6434498 A JP6434498 A JP 6434498A JP 4067164 B2 JP4067164 B2 JP 4067164B2
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Japan
Prior art keywords
polishing
polished
torque
uniformity
wafer
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Expired - Fee Related
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JP06434498A
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English (en)
Japanese (ja)
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JPH11251272A (ja
JPH11251272A5 (https=
Inventor
潔 三浦
清逸 栗田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP06434498A priority Critical patent/JP4067164B2/ja
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Publication of JPH11251272A5 publication Critical patent/JPH11251272A5/ja
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Publication of JP4067164B2 publication Critical patent/JP4067164B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP06434498A 1998-02-27 1998-02-27 研磨方法及び研磨装置 Expired - Fee Related JP4067164B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06434498A JP4067164B2 (ja) 1998-02-27 1998-02-27 研磨方法及び研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06434498A JP4067164B2 (ja) 1998-02-27 1998-02-27 研磨方法及び研磨装置

Publications (3)

Publication Number Publication Date
JPH11251272A JPH11251272A (ja) 1999-09-17
JPH11251272A5 JPH11251272A5 (https=) 2005-08-25
JP4067164B2 true JP4067164B2 (ja) 2008-03-26

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JP06434498A Expired - Fee Related JP4067164B2 (ja) 1998-02-27 1998-02-27 研磨方法及び研磨装置

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001138219A (ja) * 1999-11-19 2001-05-22 Disco Abrasive Syst Ltd 研磨装置
JP4827292B2 (ja) * 2000-11-01 2011-11-30 アプライド マテリアルズ インコーポレイテッド 研磨装置
JP3456642B2 (ja) * 2000-11-10 2003-10-14 茂徳科技股▲ふん▼有限公司 化学機械研磨法において平坦化したいフィルムの厚さを決定する方法
JP2003318140A (ja) * 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
JP4664617B2 (ja) * 2004-04-27 2011-04-06 富士通セミコンダクター株式会社 研磨装置及び方法
US20100099342A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Pad conditioner auto disk change
SG10202111784SA (en) * 2016-10-18 2021-12-30 Ebara Corp System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program
JP6817778B2 (ja) * 2016-10-18 2021-01-20 株式会社荏原製作所 局所研磨装置、局所研磨方法およびプログラム
KR102525737B1 (ko) * 2016-11-16 2023-04-26 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
CN118268990B (zh) * 2024-06-03 2024-08-16 合肥晶合集成电路股份有限公司 晶圆化学机械抛光方法、系统、设备及介质

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JPH11251272A (ja) 1999-09-17

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