JP4067164B2 - 研磨方法及び研磨装置 - Google Patents

研磨方法及び研磨装置 Download PDF

Info

Publication number
JP4067164B2
JP4067164B2 JP06434498A JP6434498A JP4067164B2 JP 4067164 B2 JP4067164 B2 JP 4067164B2 JP 06434498 A JP06434498 A JP 06434498A JP 6434498 A JP6434498 A JP 6434498A JP 4067164 B2 JP4067164 B2 JP 4067164B2
Authority
JP
Japan
Prior art keywords
polishing
polished
torque
uniformity
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06434498A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11251272A5 (enExample
JPH11251272A (ja
Inventor
潔 三浦
清逸 栗田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP06434498A priority Critical patent/JP4067164B2/ja
Publication of JPH11251272A publication Critical patent/JPH11251272A/ja
Publication of JPH11251272A5 publication Critical patent/JPH11251272A5/ja
Application granted granted Critical
Publication of JP4067164B2 publication Critical patent/JP4067164B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP06434498A 1998-02-27 1998-02-27 研磨方法及び研磨装置 Expired - Fee Related JP4067164B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06434498A JP4067164B2 (ja) 1998-02-27 1998-02-27 研磨方法及び研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06434498A JP4067164B2 (ja) 1998-02-27 1998-02-27 研磨方法及び研磨装置

Publications (3)

Publication Number Publication Date
JPH11251272A JPH11251272A (ja) 1999-09-17
JPH11251272A5 JPH11251272A5 (enExample) 2005-08-25
JP4067164B2 true JP4067164B2 (ja) 2008-03-26

Family

ID=13255537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06434498A Expired - Fee Related JP4067164B2 (ja) 1998-02-27 1998-02-27 研磨方法及び研磨装置

Country Status (1)

Country Link
JP (1) JP4067164B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001138219A (ja) * 1999-11-19 2001-05-22 Disco Abrasive Syst Ltd 研磨装置
JP4827292B2 (ja) * 2000-11-01 2011-11-30 アプライド マテリアルズ インコーポレイテッド 研磨装置
JP3456642B2 (ja) * 2000-11-10 2003-10-14 茂徳科技股▲ふん▼有限公司 化学機械研磨法において平坦化したいフィルムの厚さを決定する方法
JP2003318140A (ja) 2002-04-26 2003-11-07 Applied Materials Inc 研磨方法及び装置
JP4664617B2 (ja) * 2004-04-27 2011-04-06 富士通セミコンダクター株式会社 研磨装置及び方法
US20100099342A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Pad conditioner auto disk change
JP6817778B2 (ja) * 2016-10-18 2021-01-20 株式会社荏原製作所 局所研磨装置、局所研磨方法およびプログラム
SG10202111787PA (en) 2016-10-18 2021-11-29 Ebara Corp Local polisher, method of a local polisher and program
KR102525737B1 (ko) * 2016-11-16 2023-04-26 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
CN118268990B (zh) * 2024-06-03 2024-08-16 合肥晶合集成电路股份有限公司 晶圆化学机械抛光方法、系统、设备及介质

Also Published As

Publication number Publication date
JPH11251272A (ja) 1999-09-17

Similar Documents

Publication Publication Date Title
US9211631B2 (en) Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
US6517414B1 (en) Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6783436B1 (en) Polishing pad with optimized grooves and method of forming same
KR100818683B1 (ko) 경면 면취 웨이퍼, 경면 면취용 연마 클로스 및 경면 면취연마장치 및 방법
TWI774805B (zh) 晶圓加工方法
JP4067164B2 (ja) 研磨方法及び研磨装置
JP2004142083A (ja) ウエハ研磨装置およびウエハ研磨方法
CN113941954B (zh) 一种大面积石英晶片研磨装置及其研磨方法
WO2000067950A1 (en) Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces
JPH09270401A (ja) 半導体ウェーハの研磨方法
WO2018083931A1 (ja) 半導体ウェーハの両面研磨方法
US9908213B2 (en) Method of CMP pad conditioning
JP2023088052A (ja) 半導体結晶ウェハの製造装置および製造方法
CN208663464U (zh) 化学机械研磨装置
JP2003151934A (ja) Ｃｍｐ装置及びｃｍｐ用研磨パッドの調整方法
JP2002066905A (ja) 半導体装置の製造方法及びその装置
CN112454161B (zh) 研削装置及研削方法
JP3706306B2 (ja) モジュール制御プラテン製作システム及び方法
US20240009792A1 (en) Grinding method for slice wafer
TW200527525A (en) Method for CMP removal rate compensation
JPH10315124A (ja) 研磨方法および研磨装置
JP2000202758A (ja) 研磨布コンディショナを備えたウェハ研磨装置
JP3847500B2 (ja) 半導体ウェハ平坦化加工方法および平坦化加工装置
JPH10202508A (ja) 研磨方法
JP3019849B1 (ja) 化学的機械的研磨装置

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050202

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050215

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050215

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20050202

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080108

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080108

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110118

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees