JP4059222B2 - 温度センサ及び温度センサの製造方法 - Google Patents
温度センサ及び温度センサの製造方法 Download PDFInfo
- Publication number
- JP4059222B2 JP4059222B2 JP2004099740A JP2004099740A JP4059222B2 JP 4059222 B2 JP4059222 B2 JP 4059222B2 JP 2004099740 A JP2004099740 A JP 2004099740A JP 2004099740 A JP2004099740 A JP 2004099740A JP 4059222 B2 JP4059222 B2 JP 4059222B2
- Authority
- JP
- Japan
- Prior art keywords
- tube
- protective tube
- temperature sensor
- housing
- support tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 230000001681 protective effect Effects 0.000 claims description 47
- 238000005219 brazing Methods 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
ハウジング80内には電気絶縁性を有するPPSが充填されて、コネクタハウジング部91が射出成形される。90は射出成形により形成された樹脂モールド部である。
Claims (3)
- 温度に応じた電気信号を出力する感温素子(10)が有底筒状の保護管(20)に収納され、前記保護管(20)の一端がハウジング(80)に挿入されて固定された温度センサにおいて、
前記保護管(20)の外周に装着されるととも前記保護管(20)に接合された支持管(30)を備え、前記支持管(30)の肉厚は、前記保護管(20)の肉厚よりも大きく、
前記保護管(20)と前記支持管(30)がろう付けにて接合され、前記支持管(30)と前記ハウジング(80)がレーザー溶接にて接合されていることを特徴とする温度センサ。 - ろう材(25)はニッケルであることを特徴とする請求項1に記載の温度センサ。
- 温度に応じた電気信号を出力する感温素子(10)を有底筒状の保護管(20)に収納し、前記保護管(20)の一端をハウジング(80)に挿入し固定する温度センサの製造方法において、
前記保護管(20)の外周に前記保護管(20)の肉厚よりも肉厚が大きい支持管(30)をろう付けにて接合した後、前記支持管(30)を前記ハウジング(80)に挿入し、前記支持管(30)と前記ハウジング(80)とをレーザー溶接にて接合することを特徴とする温度センサの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004099740A JP4059222B2 (ja) | 2004-03-30 | 2004-03-30 | 温度センサ及び温度センサの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004099740A JP4059222B2 (ja) | 2004-03-30 | 2004-03-30 | 温度センサ及び温度センサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005283425A JP2005283425A (ja) | 2005-10-13 |
JP4059222B2 true JP4059222B2 (ja) | 2008-03-12 |
Family
ID=35181967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004099740A Expired - Lifetime JP4059222B2 (ja) | 2004-03-30 | 2004-03-30 | 温度センサ及び温度センサの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4059222B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101168580B1 (ko) * | 2009-12-29 | 2012-07-25 | 주식회사 우진 | 수차 발전기 내의 측온 응답속도가 향상된 내진동 측온저항 온도감지기 조립체 |
JP5718842B2 (ja) * | 2012-03-22 | 2015-05-13 | 日本特殊陶業株式会社 | センサ及びその製造方法 |
JP5719793B2 (ja) * | 2012-03-26 | 2015-05-20 | 日本特殊陶業株式会社 | センサの製造方法 |
JP5969413B2 (ja) * | 2013-03-08 | 2016-08-17 | 日本特殊陶業株式会社 | 温度センサ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5719610Y2 (ja) * | 1977-09-08 | 1982-04-26 | ||
JPS6385323A (ja) * | 1986-09-30 | 1988-04-15 | Toshiba Corp | シ−ス熱電対装置の製造方法 |
JP3062429B2 (ja) * | 1996-03-25 | 2000-07-10 | 鐘紡株式会社 | 温度検出装置 |
JP2001173559A (ja) * | 2000-11-09 | 2001-06-26 | Toshiba Kyaria Kk | コンプレッサ |
JP3788363B2 (ja) * | 2001-03-23 | 2006-06-21 | 株式会社デンソー | 温度センサ |
-
2004
- 2004-03-30 JP JP2004099740A patent/JP4059222B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005283425A (ja) | 2005-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004317499A (ja) | 温度センサ | |
US9207130B2 (en) | Sensor and method for manufacturing the same | |
US8256956B2 (en) | Temperature sensor | |
JP2009139147A (ja) | 温度センサ | |
KR20090117658A (ko) | 온도센서 | |
JP5814991B2 (ja) | 温度センサ | |
JP2009175129A (ja) | 温度センサおよびその製造方法 | |
JP4289273B2 (ja) | グロープラグ | |
JP3589206B2 (ja) | セラミックスヒータ型グロープラグおよびその製造方法。 | |
JP4059222B2 (ja) | 温度センサ及び温度センサの製造方法 | |
JP2007240341A (ja) | 温度センサ | |
JP2009300237A (ja) | 温度センサおよびその製造方法 | |
JP6245716B2 (ja) | セラミックスヒータ型グロープラグの製造方法及びセラミックスヒータ型グロープラグ | |
JP4829007B2 (ja) | 温度センサ | |
JP3826095B2 (ja) | 温度センサ | |
JP4143450B2 (ja) | 温度センサの製造方法 | |
JP5519590B2 (ja) | 温度センサの製造方法及び温度センサ | |
JP4143449B2 (ja) | 温度センサ | |
JP2006126067A (ja) | 温度センサの製造方法 | |
JP4678820B2 (ja) | 温度センサ | |
JP6406786B2 (ja) | ガスセンサ | |
JP5123344B2 (ja) | 温度センサ | |
JP2018112513A (ja) | 温度センサ | |
JP5651550B2 (ja) | 温度センサ及び温度センサの製造方法 | |
JP2017015504A (ja) | 温度センサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060516 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070604 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070612 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070810 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071127 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071210 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101228 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4059222 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111228 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121228 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131228 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |