JP4039594B2 - 無鉛はんだ用添加合金 - Google Patents
無鉛はんだ用添加合金 Download PDFInfo
- Publication number
- JP4039594B2 JP4039594B2 JP15860198A JP15860198A JP4039594B2 JP 4039594 B2 JP4039594 B2 JP 4039594B2 JP 15860198 A JP15860198 A JP 15860198A JP 15860198 A JP15860198 A JP 15860198A JP 4039594 B2 JP4039594 B2 JP 4039594B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- alloy
- lead
- weight
- free solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 82
- 229910045601 alloy Inorganic materials 0.000 title claims description 52
- 239000000956 alloy Substances 0.000 title claims description 52
- 239000000654 additive Substances 0.000 title claims description 25
- 230000000996 additive effect Effects 0.000 title claims description 25
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 47
- 229910052759 nickel Inorganic materials 0.000 description 20
- 229910052718 tin Inorganic materials 0.000 description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 16
- 230000008018 melting Effects 0.000 description 16
- 238000002844 melting Methods 0.000 description 16
- 239000013078 crystal Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15860198A JP4039594B2 (ja) | 1998-05-22 | 1998-05-22 | 無鉛はんだ用添加合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15860198A JP4039594B2 (ja) | 1998-05-22 | 1998-05-22 | 無鉛はんだ用添加合金 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11333589A JPH11333589A (ja) | 1999-12-07 |
| JPH11333589A5 JPH11333589A5 (https=) | 2004-11-11 |
| JP4039594B2 true JP4039594B2 (ja) | 2008-01-30 |
Family
ID=15675271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15860198A Expired - Lifetime JP4039594B2 (ja) | 1998-05-22 | 1998-05-22 | 無鉛はんだ用添加合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4039594B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100464930C (zh) | 2002-01-10 | 2009-03-04 | 千住金属工业株式会社 | 用于补充焊料浴的无铅焊料合金 |
| WO2007013433A1 (ja) * | 2005-07-26 | 2007-02-01 | Nihon Superior Sha Co., Ltd. | 鉛フリーはんだ中の銅析出方法、（CuＸ）６Sn５系化合物の造粒方法および分離方法ならびに錫回収方法 |
| JP2007038228A (ja) * | 2005-07-29 | 2007-02-15 | Nihon Almit Co Ltd | はんだ合金 |
| JP4890221B2 (ja) * | 2006-12-06 | 2012-03-07 | 株式会社日本スペリア社 | ダイボンド材 |
| CN101952081B (zh) | 2008-02-22 | 2016-01-13 | 日本斯倍利亚社股份有限公司 | 含有Ni的无铅焊料的Ni浓度调节方法 |
| CN101417374B (zh) * | 2008-11-28 | 2011-05-18 | 广州瀚源电子科技有限公司 | 一种无铅焊料减渣方法 |
-
1998
- 1998-05-22 JP JP15860198A patent/JP4039594B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11333589A (ja) | 1999-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2288817C (en) | Lead free solder alloy | |
| US6296722B1 (en) | Lead-free solder alloy | |
| EP3666453B1 (en) | Solder alloy, solder paste, solder ball, resin-flux cored solder, and solder joint | |
| JP2000094181A (ja) | はんだ合金組成物 | |
| JP2016106033A (ja) | はんだ継手 | |
| WO2009131178A1 (ja) | 引け巣が抑制された鉛フリーはんだ合金 | |
| US11607752B2 (en) | Solder alloy, solder joint material, and electronic circuit board | |
| CA3093091C (en) | Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint | |
| JP3786251B2 (ja) | 無鉛半田合金 | |
| JP2021502259A (ja) | 高信頼性用途のための標準的なｓａｃ合金への低銀スズ系代替はんだ合金 | |
| JP4135268B2 (ja) | 無鉛はんだ合金 | |
| JP4039594B2 (ja) | 無鉛はんだ用添加合金 | |
| TWI744907B (zh) | 焊料合金、焊料膏、預成形焊料、焊料球、線焊料、樹脂心焊料、焊料接頭、電子回路基板及多層電子回路基板 | |
| JPH10166178A (ja) | Ｐｂフリーはんだ材料及びそれを用いた電子機器 | |
| JPH106075A (ja) | 無鉛ハンダ合金 | |
| JP2001047276A (ja) | はんだ材料 | |
| KR20250140630A (ko) | 땜납 합금, 땜납 볼, 땜납 페이스트 및 땜납 조인트 | |
| CN1262638A (zh) | 无铅软钎焊料合金 | |
| JP2910527B2 (ja) | 高温はんだ | |
| KR100814977B1 (ko) | 고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 | |
| KR100904652B1 (ko) | 웨이브 및 디핑용 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
| EP0168674A1 (en) | Tin base alloy for soldering, having high resistance to the oxidation in the molten state | |
| JPWO2014142153A1 (ja) | はんだ接合物及びはんだ接合方法 | |
| JP3166826B2 (ja) | はんだ合金 | |
| KR100443230B1 (ko) | 납땜용 무연합금 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041018 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041026 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041227 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050412 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050610 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20050805 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20050909 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071102 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101116 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101116 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111116 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121116 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131116 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |