JP4035121B2 - 内蔵型キャパシター用ポリマー/セラミック複合ペースト及びこれを利用したキャパシターの製造方法{Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using the same} - Google Patents
内蔵型キャパシター用ポリマー/セラミック複合ペースト及びこれを利用したキャパシターの製造方法{Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using the same} Download PDFInfo
- Publication number
- JP4035121B2 JP4035121B2 JP2004235245A JP2004235245A JP4035121B2 JP 4035121 B2 JP4035121 B2 JP 4035121B2 JP 2004235245 A JP2004235245 A JP 2004235245A JP 2004235245 A JP2004235245 A JP 2004235245A JP 4035121 B2 JP4035121 B2 JP 4035121B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- polymer
- ceramic composite
- composite paste
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 48
- 239000000919 ceramic Substances 0.000 title claims description 47
- 229920000642 polymer Polymers 0.000 title claims description 43
- 239000002131 composite material Substances 0.000 title claims description 34
- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000003960 organic solvent Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000002518 antifoaming agent Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 3
- 238000004062 sedimentation Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Inorganic Insulating Materials (AREA)
Description
又、前記の技術的課題を解決するために、本発明の内蔵型キャパシターの製造方法は、上述した内蔵型キャパシター用ポリマー/セラミック複合ペーストと下部電極層が蒸着された基板を備える段階と、前記ポリマー/セラミック複合ペーストを前記下部電極層上にスクリーン-プリンティング法によって塗布する段階と、塗布された前記ポリマー/セラミック複合ペーストに加熱及び加圧することによって、前記ポリマー/セラミック複合ペーストを硬化させながら平坦化させる段階を含むことを特徴とする。
30;誘電体層40;上部電極層
100;ペースト 111,112;セラミック粉末
120;ポリマー
Claims (1)
- セラミック粉末を分散させるための有機溶媒と、粘度を低下させるための別途の有機溶媒とを含有する有機溶媒と;前記有機溶媒に分散された粒径が10nm〜10μmであり、誘電率が4以上であるセラミック粉末と;ポリマー及び潜在性硬化剤と;分散剤、消泡剤、及びカップリング剤を含み、前記分散剤、消泡剤、カップリング剤、及び粘度を低下させるための別途の有機溶媒の含量が0.01wt%〜50wt%である内蔵型キャパシター用ポリマー/セラミック複合ペースト(但し、高誘電率充填剤と、該高誘電率充填剤よりも沈降速度が小さい充填剤とを含む樹脂組成物を除く)と下部電極層が蒸着された基板を備える段階と、
パターニングされたマスクを利用して前記ポリマー/セラミック複合ペーストを前記下部電極層上にスクリーン-プリンティング法で塗布する段階と、
前記塗布された前記ポリマー/セラミック複合ペーストに180〜200℃の温度で加熱し、3.4〜13.6atmの圧力で加圧して、前記ポリマー/セラミック複合ペーストを硬化させながら平坦化させる段階を含む内蔵型キャパシターの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030056851A KR20050019214A (ko) | 2003-08-18 | 2003-08-18 | 내장형 커패시터용 폴리머/세라믹 복합 페이스트 및 이를이용한 커패시터 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005154255A JP2005154255A (ja) | 2005-06-16 |
JP4035121B2 true JP4035121B2 (ja) | 2008-01-16 |
Family
ID=34420492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004235245A Expired - Fee Related JP4035121B2 (ja) | 2003-08-18 | 2004-08-12 | 内蔵型キャパシター用ポリマー/セラミック複合ペースト及びこれを利用したキャパシターの製造方法{Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using the same} |
Country Status (3)
Country | Link |
---|---|
US (1) | US7381468B2 (ja) |
JP (1) | JP4035121B2 (ja) |
KR (1) | KR20050019214A (ja) |
Families Citing this family (21)
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US20070100048A1 (en) * | 2003-12-05 | 2007-05-03 | Korea Institute Of Science & Technology | Composite dielectric film including polymer and pyrochlore ceramic and method of forming the same |
US7875347B2 (en) | 2003-12-29 | 2011-01-25 | General Electric Company | Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom |
CN101258560B (zh) * | 2005-09-06 | 2011-07-20 | 东丽株式会社 | 糊剂组合物及其制造方法 |
US7923497B2 (en) * | 2005-11-23 | 2011-04-12 | General Electric Company | Antiferroelectric polymer composites, methods of manufacture thereof, and articles comprising the same |
US7465497B2 (en) * | 2005-11-23 | 2008-12-16 | General Electric Company | High dielectric constant nanocomposites, methods of manufacture thereof, and articles comprising the same |
US7989530B2 (en) * | 2005-11-23 | 2011-08-02 | General Electric Company | Nonlinear polymer composites and methods of making the same |
US7741396B2 (en) * | 2005-11-23 | 2010-06-22 | General Electric Company | Composites having tunable dielectric constants, methods of manufacture thereof, and articles comprising the same |
WO2008008977A2 (en) * | 2006-07-13 | 2008-01-17 | Nanoscale Corporation | Nanocrystalline materials for electronic applications |
US8557208B2 (en) * | 2008-05-23 | 2013-10-15 | Board Of Regents Of The Nevada System Of Higher Education, On Behalf Of The University Of Nevada, Reno | Combustion synthesis method and boron-containing materials produced therefrom |
US8247484B2 (en) * | 2008-06-12 | 2012-08-21 | General Electric Company | High temperature polymer composites and methods of making the same |
US20090309259A1 (en) * | 2008-06-12 | 2009-12-17 | General Electric Company | High temperature polymer composites comprising antiferroelectric particles and methods of making the same |
US9390857B2 (en) * | 2008-09-30 | 2016-07-12 | General Electric Company | Film capacitor |
KR101037695B1 (ko) * | 2008-12-10 | 2011-05-30 | 주식회사 하이닉스반도체 | 캐패시터를 갖는 동박적층판 및 이를 이용한 인쇄회로기판 및 이를 이용한 반도체 패키지 |
US20100240804A1 (en) * | 2009-03-17 | 2010-09-23 | General Electric Company | In-situ polymerized nanocomposites |
KR101101347B1 (ko) * | 2010-04-06 | 2012-01-02 | 한국세라믹기술원 | 무소결 mim 커패시터 및 그 제조 방법 |
CA2830269A1 (en) * | 2011-03-23 | 2012-10-26 | The Curators Of The University Of Missouri | High dielectric constant composite materials and methods of manufacture |
CN103172369A (zh) * | 2011-12-26 | 2013-06-26 | 深圳光启高等理工研究院 | 陶瓷复合基板加工方法和多层陶瓷复合基板加工方法 |
CN105140028A (zh) * | 2015-09-25 | 2015-12-09 | 安捷利(番禺)电子实业有限公司 | 一种高介电常数的埋入式电容的制备方法 |
CN109233263A (zh) * | 2018-10-15 | 2019-01-18 | 上海安费诺永亿通讯电子有限公司 | 陶瓷树脂复合材料及制备方法及提纯陶瓷粉体的方法 |
US10964476B2 (en) | 2018-12-27 | 2021-03-30 | Industrial Technology Research Institute | Capacitor with multiple dielectric layers having dielectric powder and polyimide |
CN112670662B (zh) * | 2020-12-02 | 2022-12-23 | 乐凯胶片股份有限公司 | 聚合物包覆陶瓷颗粒的方法及其应用 |
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US3975492A (en) * | 1975-08-21 | 1976-08-17 | John Z. Delorean Corporation | Method to produce 3-dimensional matrix surface |
JP3761915B2 (ja) | 1994-12-28 | 2006-03-29 | 京セラ株式会社 | セラミック成形用組成物 |
TW327690B (en) * | 1996-12-06 | 1998-03-01 | Philips Eloctronics N V | Multi-layer capacitor |
US5843534A (en) * | 1997-01-24 | 1998-12-01 | Industrial Technology Research Institute | Screen printing of surface layers |
KR100546471B1 (ko) | 1997-03-06 | 2006-01-26 | 샤프 가부시키가이샤 | 금속 다층 회로 기판상의 두꺼운 세라믹 |
JP2000203928A (ja) | 1998-12-28 | 2000-07-25 | Tdk Corp | 積層セラミック電子部品用セラミックグリ―ンペ―ストの製造方法 |
US6470545B1 (en) * | 1999-09-15 | 2002-10-29 | National Semiconductor Corporation | Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
US6475555B2 (en) * | 1999-10-29 | 2002-11-05 | International Business Machines Corporation | Process for screening features on an electronic substrate with a low viscosity paste |
US6562179B1 (en) | 1999-11-04 | 2003-05-13 | Mitsubishi Gas Chemical Company, Inc. | High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these |
JP2001233669A (ja) | 2000-02-24 | 2001-08-28 | Ngk Spark Plug Co Ltd | 高誘電率複合材料及びそれを用いたプリント配線板並びに多層プリント配線板 |
JP2001347600A (ja) | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | 積層板 |
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US20060159927A1 (en) * | 2003-04-04 | 2006-07-20 | Yoshitake Hara | Paste composition and dielectric composition using the same |
-
2003
- 2003-08-18 KR KR1020030056851A patent/KR20050019214A/ko not_active Application Discontinuation
-
2004
- 2004-08-12 JP JP2004235245A patent/JP4035121B2/ja not_active Expired - Fee Related
- 2004-08-18 US US10/920,456 patent/US7381468B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20050080175A1 (en) | 2005-04-14 |
US7381468B2 (en) | 2008-06-03 |
JP2005154255A (ja) | 2005-06-16 |
KR20050019214A (ko) | 2005-03-03 |
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