JP4009918B2 - ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板 - Google Patents

ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板 Download PDF

Info

Publication number
JP4009918B2
JP4009918B2 JP20865898A JP20865898A JP4009918B2 JP 4009918 B2 JP4009918 B2 JP 4009918B2 JP 20865898 A JP20865898 A JP 20865898A JP 20865898 A JP20865898 A JP 20865898A JP 4009918 B2 JP4009918 B2 JP 4009918B2
Authority
JP
Japan
Prior art keywords
dianhydride
polyimide film
polyimide
component
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20865898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1180390A (ja
JPH1180390A5 (https=
Inventor
孔一 沢崎
賢治 鵜原
道弘 久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Du Pont Toray Co Ltd
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Priority to JP20865898A priority Critical patent/JP4009918B2/ja
Publication of JPH1180390A publication Critical patent/JPH1180390A/ja
Publication of JPH1180390A5 publication Critical patent/JPH1180390A5/ja
Application granted granted Critical
Publication of JP4009918B2 publication Critical patent/JP4009918B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP20865898A 1997-07-18 1998-07-07 ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板 Expired - Lifetime JP4009918B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20865898A JP4009918B2 (ja) 1997-07-18 1998-07-07 ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP20994997 1997-07-18
JP9-209949 1997-07-18
JP20865898A JP4009918B2 (ja) 1997-07-18 1998-07-07 ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板

Publications (3)

Publication Number Publication Date
JPH1180390A JPH1180390A (ja) 1999-03-26
JPH1180390A5 JPH1180390A5 (https=) 2005-04-28
JP4009918B2 true JP4009918B2 (ja) 2007-11-21

Family

ID=26516971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20865898A Expired - Lifetime JP4009918B2 (ja) 1997-07-18 1998-07-07 ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板

Country Status (1)

Country Link
JP (1) JP4009918B2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323078A (ja) * 2000-03-10 2001-11-20 Mitsubishi Plastics Ind Ltd 配線基板の金属箔担体用絶縁フィルムおよび配線基板
JP2003064182A (ja) * 2001-08-28 2003-03-05 Hitachi Chem Co Ltd 光部品用ポリイミド樹脂及びこれを用いた光部品
US6949296B2 (en) * 2002-12-31 2005-09-27 E. I. Du Pont De Nemours And Company Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
WO2006033267A1 (ja) * 2004-09-24 2006-03-30 Kaneka Corporation 新規なポリイミドフィルム並びにそれを用いて得られる接着フィルム、フレキシブル金属張積層板
JP2006137868A (ja) * 2004-11-12 2006-06-01 Du Pont Toray Co Ltd ポリイミドフィルムおよびフレキシブル回路基板
JP5110242B2 (ja) * 2004-12-03 2012-12-26 宇部興産株式会社 ポリイミド、ポリイミドフィルム及び積層体
JP4974068B2 (ja) * 2005-08-02 2012-07-11 東レ・デュポン株式会社 ポリイミドフィルム、その製造方法およびフレキシブル回路基板
JP5374817B2 (ja) * 2005-11-16 2013-12-25 東レ・デュポン株式会社 ポリイミドフィルムおよびその製造方法
KR101277602B1 (ko) 2006-05-17 2013-06-21 가부시키가이샤 피아이 기쥬츠 켄큐쇼 금속 복합 필름 및 그 제조 방법
WO2008010409A1 (fr) * 2006-07-18 2008-01-24 Kaneka Corporation Film de polyimide
JP5126734B2 (ja) * 2006-12-11 2013-01-23 東レ・デュポン株式会社 銅張り板
JP5362752B2 (ja) * 2011-01-26 2013-12-11 Ｊｆｅケミカル株式会社 ポリアミド酸組成物、ポリイミドおよびポリイミドフィルムならびにそれらの製造方法
JP2020100822A (ja) * 2018-12-21 2020-07-02 Jnc株式会社 ポリアミック酸ブロックポリマーの製造方法、液晶配向剤の製造方法、液晶配向剤、液晶配向膜、および液晶表示素子
JP7706829B2 (ja) * 2021-03-25 2025-07-14 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板

Also Published As

Publication number Publication date
JPH1180390A (ja) 1999-03-26

Similar Documents

Publication Publication Date Title
EP0879839B1 (en) Polyimide copolymer, polyimide copolymer resin molded products and their preparation
EP1182222B1 (en) Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
JP4009918B2 (ja) ポリイミドフィルム、その製造方法およびそれを基材とした金属積層板
JP5362752B2 (ja) ポリアミド酸組成物、ポリイミドおよびポリイミドフィルムならびにそれらの製造方法
US6908685B2 (en) Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
KR20020016552A (ko) 폴리이미드 필름, 그의 제조 방법 및 폴리이미드 필름기재를 사용한 금속 상호접속 판
KR100714952B1 (ko) 박리 강도가 개선된 폴리이미드 조성물
JP4665373B2 (ja) ポリイミドフィルム
JP5270865B2 (ja) 接着剤並びにその用途
JP3687044B2 (ja) 共重合ポリイミドフィルムおよびその製造方法
EP0892004B1 (en) A polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate
EP1313795B1 (en) Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
KR101077405B1 (ko) 배선기판용 적층체
JP2024098071A (ja) ポリイミドフィルムの製造方法
JP4401893B2 (ja) ポリイミド前駆体樹脂組成物
TW202237705A (zh) 聚醯亞胺、金屬包覆層疊板及電路基板
JP3676073B2 (ja) ポリイミドフィルムとその製造方法
JP3143891B2 (ja) ポリアミック酸およびポリアミック酸を脱水閉環した重合体の製造方法
JP2910779B2 (ja) フレキシブルプリント基板
JP2002210903A (ja) ボンディングシート
JP2002146306A (ja) アルカリエッチング性に優れた耐熱性ボンドプライ
JP4361423B2 (ja) 樹脂シート構造物およびそれを用いた多層配線板の製造方法
JP2006104371A (ja) ポリイミド前駆体樹脂組成物
JP2007099843A (ja) 新規なポリイミド樹脂
JPH03275724A (ja) 低熱膨張フレキシブルプリント回路用基板

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20040322

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20040322

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040622

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040622

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060419

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060509

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060704

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060912

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061019

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061225

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20070227

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070821

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070823

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100914

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110914

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110914

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120914

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130914

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140914

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term