JP4004765B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4004765B2 JP4004765B2 JP2001313318A JP2001313318A JP4004765B2 JP 4004765 B2 JP4004765 B2 JP 4004765B2 JP 2001313318 A JP2001313318 A JP 2001313318A JP 2001313318 A JP2001313318 A JP 2001313318A JP 4004765 B2 JP4004765 B2 JP 4004765B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor film
- film
- light source
- crystalline semiconductor
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313318A JP4004765B2 (ja) | 2000-10-10 | 2001-10-10 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-309887 | 2000-10-10 | ||
| JP2000309887 | 2000-10-10 | ||
| JP2001313318A JP4004765B2 (ja) | 2000-10-10 | 2001-10-10 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002190452A JP2002190452A (ja) | 2002-07-05 |
| JP2002190452A5 JP2002190452A5 (enExample) | 2005-06-23 |
| JP4004765B2 true JP4004765B2 (ja) | 2007-11-07 |
Family
ID=26601827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001313318A Expired - Fee Related JP4004765B2 (ja) | 2000-10-10 | 2001-10-10 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4004765B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100962054B1 (ko) | 2000-12-05 | 2010-06-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제조 방법 |
| JP5130463B2 (ja) * | 2001-03-28 | 2013-01-30 | 独立行政法人産業技術総合研究所 | 薄膜半導体素子の製造方法 |
| KR101025444B1 (ko) * | 2003-10-28 | 2011-03-30 | 엘지디스플레이 주식회사 | 급속열처리장치 및 이를 이용한 이온활성화 방법 |
| JP5294231B2 (ja) * | 2007-03-26 | 2013-09-18 | 国立大学法人 奈良先端科学技術大学院大学 | 薄膜トランジスタの製造方法 |
| JP5465828B2 (ja) * | 2007-10-01 | 2014-04-09 | 株式会社日立国際電気 | 基板処理装置及び半導体デバイスの製造方法 |
| JP5374109B2 (ja) * | 2008-10-17 | 2013-12-25 | 株式会社アルバック | 加熱真空処理方法 |
| WO2010098427A1 (ja) | 2009-02-27 | 2010-09-02 | 株式会社アルバック | 真空加熱装置、真空加熱処理方法 |
| KR101729724B1 (ko) * | 2014-12-26 | 2017-04-25 | 주식회사 비아트론 | 복수 열원을 포함하는 코팅층 열처리 장치 및 이를 이용한 열처리 방법 |
-
2001
- 2001-10-10 JP JP2001313318A patent/JP4004765B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002190452A (ja) | 2002-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6599818B2 (en) | Semiconductor device manufacturing method, heat treatment apparatus, and heat treatment method | |
| US7575985B2 (en) | Method of fabricating semiconductor device | |
| JP4718700B2 (ja) | 半導体装置の作製方法 | |
| US7052943B2 (en) | Method of manufacturing a semiconductor device | |
| JP4850858B2 (ja) | 半導体装置の作製方法 | |
| TWI280818B (en) | Light emitting device, method of manufacturing the same, and manufacturing apparatus therefor | |
| CN101202300B (zh) | 半导体器件 | |
| US8642406B2 (en) | Semiconductor device and method for manufacturing the same | |
| US6713323B2 (en) | Semiconductor device and method of manufacturing the same | |
| JP4230160B2 (ja) | 半導体装置の作製方法 | |
| JP2002190452A (ja) | 半導体装置の作製方法並びに熱処理装置及び熱処理方法 | |
| JP4860055B2 (ja) | 半導体装置の作製方法 | |
| JP4176362B2 (ja) | 半導体装置の作製方法 | |
| JP4212844B2 (ja) | 半導体装置の作製方法 | |
| JP4044360B2 (ja) | 半導体装置およびその作製方法 | |
| JP4439775B2 (ja) | 半導体装置の作製方法 | |
| JP4053256B2 (ja) | 半導体装置の作製方法並びに半導体製造装置 | |
| JP4357811B2 (ja) | 半導体装置の作製方法 | |
| JP2002083773A (ja) | 半導体装置の作製方法 | |
| JP2002359251A (ja) | 半導体装置の作製方法 | |
| JP2002246327A (ja) | 熱処理装置並びに半導体装置の作製方法 | |
| JP2003332342A (ja) | 半導体装置の作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041007 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041007 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070215 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070313 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070508 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070821 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070822 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4004765 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100831 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100831 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100831 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110831 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110831 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120831 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120831 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130831 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |