JP3994327B2 - Electronic component mounting method and anti-contamination chip used therefor - Google Patents

Electronic component mounting method and anti-contamination chip used therefor Download PDF

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Publication number
JP3994327B2
JP3994327B2 JP2002150244A JP2002150244A JP3994327B2 JP 3994327 B2 JP3994327 B2 JP 3994327B2 JP 2002150244 A JP2002150244 A JP 2002150244A JP 2002150244 A JP2002150244 A JP 2002150244A JP 3994327 B2 JP3994327 B2 JP 3994327B2
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Prior art keywords
chip
contamination
electronic component
mounting
circuit board
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JP2003347493A (en
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徹 野村
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Denso Corp
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Denso Corp
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は電子部品の実装方法及び汚染防止用チップに関するもので、特に、回路基板上の導体に対して直接ワイヤボンデイングを行い、半導体チップ等の電子部品の接続を行う実装方法において、ワイヤボンデイングの接合性を向上させるための方法及び汚染防止用チップに関する。
【０００２】
【従来の技術】
従来、厚膜回路基板とパワー素子との電気的接続や、外部端子への取り出しのための樹脂ケースとターミナルとの電気的接続を図るために、Ａｌワイヤを用いて超音波接合（ワイヤボンディング）する方法が行われている。そして、厚膜回路基板の導体上へ直接Ａｌワイヤを接合する際、導体表面が汚染されたり付着物が存在しているとＡｌワイヤの接合性が劣化するという問題がある。特に、回路基板上に電子部品を接合するためのはんだリフロー時には、導体上にはんだ材料中のフラックスによる汚染やはんだ粉の付着が生じるため、Ａｌワイヤの導体への接合信頼性を大きく劣化させる等の問題が発生する。
【０００３】
このような問題点に鑑みて、従来、はんだリフロー工程を実行する前に、Ａｌワイヤが接合される導体上に樹脂材料をコートして、フラックスの汚染やはんだ粉の付着を防止する方法が提案されている（特開平９−２９３７４４号公報）。
【０００４】
すなわち、同公報に記載された従来の方法では、アルミナ基板５１上に配線・部品搭載ランド用導体５２及びワイヤボンディング用パッド導体（以下、パッド導体と略記する）５３をそれぞれ表面上に形成した厚膜回路基板７０において（図６参照）、まず、パッド導体５３を完全に覆うように樹脂コート５４をディスペンサー等を用いて塗布し硬化させる（図７）。その後、図８に示すように、はんだ接合ペーストを用い、印刷等の工法で配線・部品搭載ランド用導体５２上に所定パターンのはんだ層５５を形成する。その後、パワー素子５６やＩＣ等のチップ部品５７を搭載し、約２３０℃で、はんだをリフローすることにより、パワー素子５６やＩＣ等のチップ部品５７のはんだ付けを行う。この際に、はんだペースト中のフラックスが分離して流出したり、はんだ粉が飛散するが、パッド導体５３は樹脂コート５４により覆われているためフラックス汚染やはんだ粉の付着が生じることが防止される。そして、厚膜回路基板７０表面の洗浄を行い、樹脂コート５４を除去した後、Ａｌ等からなるワイヤ５９を用いてパッド導体５３とパワーＩＣ５６とをワイヤボンディングし、これらの電気的接続を行う。さらに、接着剤６１により厚膜回路基板７０を金属ベース６０に接着した後、金属ベース６０とパッド導体５３とをワイヤボンディングし、これらの電気的接続を行うようにする。
【０００５】
【発明が解決しようとする課題】
しかしながら、図６乃至図９に示された従来の電子部品の実装方法においては、パッド導体５３のフラックス汚染やはんだ粉の付着を防止するために、樹脂材料を印刷し硬化させて樹脂コート５４を形成する工程、及びはんだリフロー工程後に樹脂コート５４を剥離する工程を必要とする。このため、多くの工数を要するという問題があると共に、樹脂材料のダレが配線・部品搭載ランド用導体５２に付着して、はんだ濡れ不良が生じるという不具合が発生するという問題がある。
【０００６】
本発明は、上述した問題点に鑑み、既存設備を使用し且つ少ない工数で基板上の回路要素の汚染を防止しつつ電子部品の実装が可能な電子部品の実装方法、及びワイヤボンデイングの接合性を向上させることができる電子部品の実装方法、並びにこれらに使用される汚染防止用チップを提供することを解決すべき課題とする。
【０００７】
【課題を解決するための手段】
この目的を達成するために、請求項１に記載の電子部品の実装方法は、回路基板上へ電子部品を実装する方法であって、前記回路基板上に設けられた導体及び電子部品等の所定の回路要素の少なくとも一部を覆うように汚染防止用チップを搭載する汚染防止用チップ搭載工程と、前記回路基板上の少なくとも一部を汚染する可能性のある所定の処理工程と、前記所定の回路要素より前記汚染防止用チップを取り外して回収する汚染防止用チップ回収工程と、を備え、前記汚染防止用チップは、少なくとも一つの面が弾性材料により構成され、前記汚染防止用チップ搭載工程では、前記弾性材料を前記所定の回路要素の少なくとも一部の表面へ密着させるように前記汚染防止用チップを搭載することを特徴とする。
【０００８】
従って、回路基板上に設けられた導体及び電子部品等の所定の回路要素の少なくとも一部を覆った状態で、回路基板上の少なくとも一部を汚染する可能性のある所定の処理工程を実行するので、前記所定の回路要素が前記所定の処理工程において汚染されることを確実に防止することができる。ここで、汚染防止用チップは、少なくとも一つの面が弾性材料により構成され、汚染防止用チップ搭載工程では、汚染防止用チップの弾性材料からなる面を所定の回路要素に対して当接させ、加圧することにより容易且つ確実に汚染防止用チップを搭載することができる。また、所定の処理工程では、汚染防止用チップの弾性材料が所定の回路要素の少なくとも一部の表面に密着されているので、当該部分を確実に汚染から防止することができる。そして、前記所定の処理工程終了後、所定の回路要素より汚染防止用チップを取り外して回収し、前記所定の回路要素の汚染が防止された部分に対して所望の処理を良好に施すことができる。
【０００９】
また、請求項２に記載の電子部品の実装方法は、前記所定の処理工程が、はんだリフロー工程であることを特徴とする。
【００１０】
従って、はんだリフロー工程では、回路基板上に、はんだフラックスの流出による汚染やはんだ粉の付着による汚染等が生じる可能性があるが、所定の回路要素の少なくとも一部が汚染防止用チップにより覆われた状態で、はんだリフロー工程が実行されるので、前記所定の回路要素がはんだリフロー工程における汚染から確実に防止される。
【００１１】
また、請求項３に記載の電子部品の実装方法は、回路基板上に形成された配線導体に電子部品をはんだ付けするとともに、前記回路基板上に形成されたパッド導体に対してワイヤボンディングを行うようにした電子部品の実装方法であって、前記回路基板上にはんだ材料からなるはんだ層を形成するはんだ層形成工程と、前記はんだ層上に電子部品を搭載する電子部品搭載工程と、前記パッド導体の少なくとも一部を覆うように汚染防止用チップを搭載する汚染防止用チップ搭載工程と、前記パッド導体に前記汚染防止用チップが搭載された状態で、前記電子部品が搭載された前記はんだ層を所定の加熱条件下でリフローし、前記電子部品を前記配線導体に接合するはんだリフロー工程と、そのはんだリフロー工程後に前記汚染防止用チップを取り外して回収する汚染防止用チップ回収工程と、前記汚染防止用チップを取り外した前記パッド導体に対してワイヤボンディングを行うワイヤボンディング工程と、を備え、前記汚染防止用チップは、少なくとも一つの面が弾性材料により構成され、前記汚染防止用チップ搭載工程では、前記弾性材料を前記パッド導体の少なくとも一部の表面へ密着させるように前記汚染防止用チップを搭載することを特徴とする。
【００１２】
従って、回路基板上にはんだ材料からなるはんだ層を形成し、はんだ層上に電子部品を搭載し、パッド導体の少なくとも一部を覆うように汚染防止用チップを搭載する。ここで、汚染防止用チップは、少なくとも一つの面が弾性材料により構成され、汚染防止用チップ搭載工程では、弾性材料をパッド導体の少なくとも一部の表面へ密着させるように汚染防止用チップを搭載する。そして、パッド導体に汚染防止用チップが搭載された状態で、電子部品が搭載されたはんだ層を所定の加熱条件下でリフローし、電子部品を配線導体に接合する。よって、汚染防止用チップ搭載工程では、汚染防止用チップの弾性材料からなる面をパッド導体に対して当接させ、加圧することにより容易且つ確実に搭載することができる。また、はんだフラックスやはんだ粉等の汚染が生じ易いはんだリフロー工程において、パッド導体の少なくとも一部が汚染防止用チップにより覆われると共に、汚染防止用チップの弾性材料が表面に密着されていることにより、汚染から確実に防止される。そして、はんだリフロー工程後に汚染防止用チップを取り外して回収し、パッド導体の汚染が防止された部分に対して良好にワイヤボンディングを行うことができる。
【００１３】
また、請求項４に記載の電子部品の実装方法は、前記電子部品搭載工程と前記汚染防止用チップ搭載工程とは、同時に行われることを特徴とする。
【００１４】
従って、電子部品搭載工程と汚染防止用チップ搭載工程とを同時に行うことにより、電子部品の実装に要する工数を大幅に低減することができる。
【００１５】
また、請求項５に記載の電子部品の実装方法は、前記弾性材料が、耐熱性ゴムからなることを特徴とする。
【００１６】
従って、弾性材料が耐熱性ゴムからなるので、はんだリフロー工程等の加熱を伴う処理工程においても変形等が生じることがない。
【００１７】
また、請求項６に記載の電子部品の実装方法は、前記汚染防止用チップ搭載工程は、電子部品を回路基板上に搭載するための部品搭載機を用いて行われることを特徴とする。
【００１８】
従って、既存の部品搭載機をそのまま使用することが可能であり、生産工程を大きく変えることなく、汚染防止を図りつつ電子部品の実装を行うことができる。また、電子部品搭載工程と汚染防止用チップ搭載工程とで同一の部品搭載機を使用することにより、両工程を同時に実行することも可能となる。
【００１９】
また、請求項７に記載の汚染防止用チップは、回路基板上に設けられた導体及び電子部品等の回路要素上に着脱可能に搭載されて前記回路要素の汚染を防止するための電子部品の実装方法に使用される汚染防止用チップであって、パッド状チップの少なくとも一つの面に弾性材料を貼り付けてなることを特徴とする。
【００２０】
従って、汚染防止用チップは、金属材料又は樹脂材料等の材質からなるパッド状チップの少なくとも一つの面に、柔軟性のある弾性材料が貼り付けられているので、汚染防止対象の回路要素を傷つけることなく密着状に搭載可能であり、前記回路要素をはんだフラックスやはんだ粉の付着等の種々の汚染から確実に防止することができる。また、弾性材料が回路要素に密着することにより搭載されるので、汚染防止用チップを容易に回路要素から取外し、回収することができる。
【００２１】
また、請求項８に記載の汚染防止用チップは、前記弾性材料が、耐熱性ゴムからなることを特徴とする。
【００２２】
従って、弾性材料が耐熱性ゴムからなるので、はんだリフロー工程等の加熱を伴う処理工程においても変形等が生じることがない。
【００２３】
また、請求項９に記載の汚染防止用チップは、前記回路要素の搭載面よりも大きく形成されたことを特徴とする。
【００２４】
従って、汚染防止用チップが、回路要素の搭載面よりも大きく形成されているので、回路要素の搭載面全体を確実に覆い、その回路要素全体をはんだリフロー工程等の汚染を伴う処理工程における汚染から確実に防止することができる。
【００２９】
【発明の実施の形態】
以下、本発明の電子部品の実装方法及び汚染防止用チップを具体化した一実施形態について、図面を参照しつつ説明する。
【００３０】
図１は、本実施形態における電子部品の実装方法を採用した混成集積回路装置２１の製造工程の全体の流れを示すフローチャートである。図２、３、４は各工程を具体的に示す図であり、それぞれ（ａ）は側面図、（ｂ）は平面図である。
【００３１】
まず、配線・部品搭載ランド２及びワイヤ接合用導体３をアルミナ基板１上に形成した厚膜回路基板２０を用意する（図２参照）。
【００３２】
ここで、配線・部品搭載ランド２は、Ｃｕ、Ａｇ等の導体からなり、回路基板１０上に搭載される半導体チップ等の電子部品を搭載し、電気的接続を図るために設けられる配線導体である。尚、配線・部品搭載ランド２では、幅広の平面視長方形の部分に電子部品が搭載され、これらが線状の配線パターンにより接続されている。
【００３３】
一方、ワイヤボンディング用パッド導体（以下、パッド導体と略記する）３は、Ａｇ、Ａｇ−Ｐｄ、Ａｕ等の導体からなり、パワーＩＣ５や金属ベース９との間でＡｌ又はＡｕ等のワイヤが超音波接合、すなわちワイヤボンディングが行われる導体である。
【００３４】
以上の構成を有する厚膜回路基板２０上に、ペースト状のはんだ材料を所定のパターンで配線・部品搭載ランド２上に印刷し、はんだ層４を形成する（はんだ層形成工程Ｓ１、図１参照）。はんだ層４の形成は、スクリーン印刷等の公知の種々の印刷方法により行うことができる。
【００３５】
次に、パワーＩＣ５やチップコンデンサ等の素子６等の電子部品をはんだ層４上に搭載するとともに（部品搭載工程Ｓ２）、汚染防止用チップ７をパッド導体３の上面を覆うように搭載する（汚染防止用チップ搭載工程Ｓ３）。部品搭載工程Ｓ２及び汚染防止用チップ搭載工程Ｓ３は、電子部品を厚膜回路基板２０に搭載するための公知の部品搭載機（チップマウンタ）を使用して同時に実施される。すなわち、部品搭載工程Ｓ２と汚染防止用チップ搭載工程Ｓ３とは、図１のフローチャートでは分けて記載しているが、部品搭載機を用いて搭載がおこなわれる部品が電子部品であるか汚染防止用チップ７であるかが異なるのみであり、同一の装置を用いて同時に実施されるものである。
【００３６】
ここで、汚染防止用チップ７は、図５に示すように、鉄等の金属材料又は樹脂材料等により作製されたパッド状チップ７ｂの両面に、薄板状のゴム７ａをＳｉ系接着剤等により貼り付けたものであり、搭載されるパッド導体３の上面全体を覆うことができるようにパッド導体３上面より一回り大きいサイズに加工されている。また、ゴム７ａは、柔軟性を有し且つはんだリフロー温度（約２３０℃〜約２７０℃）において溶融が生じない程度の耐熱性を有するフッ素系又はＳｉ系等の耐熱性ゴムからなる。より好ましくは、ゴム７ａの熱変形温度は、３００℃以上である。
【００３７】
汚染防止用チップ７は、柔軟性を有するゴム７ａ側をパッド導体３側に向けて当接させ且つ加圧することにより、ゴム７ａがパッド導体３の上面へ密着状に搭載される。
【００３８】
次に、約２３０℃〜約２７０℃の加熱条件の下で、はんだ層４のリフローを行い、パワーＩＣ５やチップコンデンサ等の素子６を、溶融したはんだ材料により配線・部品搭載ランド２へ固着させる（はんだリフロー工程Ｓ４）。この時、はんだペースト中のフラックスが分離して流出したり、はんだ粉が飛散したりするが、汚染防止用チップ７がゴム７ａ側がパッド導体３上面に密着しパッド導体３を覆うように搭載されているので、パッド導体３を、はんだフラックスやはんだ粉付着による汚染から確実に防止することができる。尚、汚染防止用チップ７のゴム７ａは、はんだリフロー温度（約２３０℃〜約２７０℃）に対して耐熱性を有するので、はんだリフロー工程Ｓ４において変形が生じることがない。
【００３９】
その後、汚染防止用チップ７のみを取り除いて回収する（汚染防止用チップ回収工程Ｓ５）。汚染防止用チップ７は、ゴム７ａがパッド導体３に密着することにより搭載されているので、容易に取り外して回収することができる。続いて、厚膜回路基板２０を洗浄する（洗浄工程Ｓ６）。
【００４０】
そして、Ａｌ又はＡｕ等のワイヤ１０を用いて、パッド導体３とパワーＩＣ５とを超音波接合（ワイヤボンディング）することにより、これらを電気的に接続する（ワイヤボンディング工程（基板内）Ｓ７）。ここで、パッド導体３は、はんだリフロー工程Ｓ４において汚染防止用チップ７により覆われ、はんだフラックスやはんだ粉付着による汚染から防止されて清浄が保たれているので、接合信頼性が劣化することなく良好にワイヤボンディングを行うことができる。
【００４１】
さらに、厚膜回路基板２０を、接着剤８を用いて金属ベース９に接着する（金属ベース接着工程Ｓ８）。
【００４２】
最後に、Ａｌ又はＡｕ等のワイヤ１０を用いて、パッド導体３と金属ベース９とを超音波接合（ワイヤボンディング）することにより、これらを電気的に接続する（ワイヤボンディング工程（基板−金属ベース間）Ｓ９）。ワイヤボンディング工程（基板−金属ベース間）Ｓ９においても、上述したワイヤボンディング工程（基板内）Ｓ７と同様に、パッド導体３が、はんだリフロー工程Ｓ４において汚染防止用チップ７により覆われ、はんだフラックスやはんだ粉付着による汚染から防止されて清浄が保たれているので、接合信頼性が劣化することなく良好にワイヤボンディングを行うことができる。
【００４３】
以上の各工程を経て厚膜回路基板２０における電子部品の実装が完了し、混成集積回路装置２１が完成する。
【００４４】
上述したことから明らかなように、本実施形態によれば、汚染防止用チップ７でパッド導体３を覆った状態において、はんだリフロー工程Ｓ４が実行されるので、パッド導体３をはんだフラックスやはんだ粉の付着等による汚染から確実に防止することができる。
【００４５】
また、はんだリフロー工程Ｓ４前の汚染防止用チップ搭載工程Ｓ３は部品搭載工程Ｓ２と同時に行うことができるので、部品搭載工程とパッド導体への樹脂コーティングとを別工程で行う必要がある従来方法と比べて、工数を大幅に低減することが可能である。
【００４６】
また、汚染防止用チップ搭載工程Ｓ３は、部品搭載工程Ｓ２において使用される部品搭載機を利用して実行することができるので、既存の設備をそのまま活用することにより、生産工程の大幅な変更なく、パッド導体３の汚染対策を図ることができる。さらに、樹脂等のダレが生じて配線・部品搭載ランド２に付着し、はんだ濡れ不良が発生する等の不具合が生じることもない。
【００４７】
また、汚染防止用チップ回収工程Ｓ５において回収された使用済みの汚染防止用チップ７は再使用可能であるので、材料の無駄がないという利点がある。
【００４８】
尚、本発明は上述した各実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲で種々の変更を施すことが可能である。
【００４９】
例えば、前記実施形態では、パッド導体３よりも当接面のサイズが大きい汚染防止用チップ７を用いてパッド導体３の上面全体を覆うようにしたが、パッド導体３の少なくとも一部分（例えば、ワイヤ１０が接合される表面の一部分のみ）を汚染防止用チップ７により覆うようにしてもよい。
【００５０】
また、図５に示す汚染防止用チップ７ではパッド状チップ７ｂの両面にゴム７ａを貼り付ける構成としたが、片面のみに貼り付けてもよい。要するに、少なくともパッド導体３に当接する面にゴム７ａを貼り付ければよいのである。
【００５１】
また、前記実施形態では、ワイヤボンディングが行われるパッド導体３に汚染防止用チップ７を搭載してはんだリフロー工程Ｓ４における汚染を防止する例を示したが、これには限られない。要するに、回路基板上へ電子部品を実装する方法であって、前記回路基板上に設けられた導体及び電子部品等の所定の回路要素の少なくとも一部を覆うように汚染防止用チップを搭載する汚染防止用チップ搭載工程と、前記回路基板上の少なくとも一部を汚染する可能性のある所定の処理工程と、前記所定の回路要素より前記汚染防止用チップを取り外して回収する汚染防止用チップ回収工程と、を備えていればよいのである。そして、この電子部品の実装方法によれば、回路基板上に設けられた導体及び電子部品等の所定の回路要素の少なくとも一部を覆った状態で、回路基板上の少なくとも一部を汚染する可能性のある所定の処理工程を実行するので、前記所定の回路要素が前記所定の処理工程において汚染されることを確実に防止することができる。また、前記所定の処理工程終了後、所定の回路要素より汚染防止用チップを取り外して回収し、前記所定の回路要素の汚染が防止された部分に対して所望の処理を良好に施すことができる。
【００５２】
【発明の効果】
以上述べたように本発明の請求項１，２，５又は６のいずれかに記載の電子部品の実装方法によれば、汚染防止用チップ搭載工程において、汚染防止用チップの弾性材料からなる面を所定の回路要素に対して当接させ、加圧することにより容易且つ確実に汚染防止用チップを搭載することができるという効果、及び汚染を伴う可能性のある所定の処理工程において、汚染防止用チップの弾性材料が所定の回路要素の少なくとも一部の表面に密着されているので、当該部分を確実に汚染から防止し、所定の回路要素の汚染が防止された部分に対して所望の処理を良好に施すことができるという効果を奏する。
【００５３】
また、請求項３乃至６のいずれかに記載の電子部品の実装方法によれば、汚染防止用チップ搭載工程において、汚染防止用チップの弾性材料からなる面を所定の回路要素に対して当接させ、加圧することにより容易且つ確実に汚染防止用チップを搭載することができるという効果、及びはんだフラックスやはんだ粉により汚染が生じ易いはんだリフロー工程において、パッド導体の少なくとも一部が汚染防止用チップにより覆われると共に、汚染防止用チップの弾性材料が表面に密着されていることにより、汚染から確実に防止され、パッド導体に対するワイヤボンディングの接合性を向上させることができるという効果を奏する。
【００５４】
また、請求項７乃至９のいずれかに記載の汚染防止用チップによれば、汚染防止対象の回路要素を傷つけることなく密着させることができるので、回路要素への搭載及び取外しが容易であり、回路要素をはんだフラックスやはんだ粉の付着等による汚染から確実に防止することができるという効果を奏する。
【図面の簡単な説明】
【図１】 本発明の一実施形態の電子部品の実装方法における工程の流れを示すフローチャートである。
【図２】 厚膜回路基板を示す図である。
【図３】 汚染防止用チップが搭載された厚膜回路基板を示す図である。
【図４】 電子部品の実装が完了した混成集積回路装置を示す図である。
【図５】 汚染防止用チップの構造を示す図である。
【図６】 従来例における厚膜回路基板を示す図である。
【図７】 従来例におけるパッド導体に樹脂がコーティングされた厚膜回路基板を示す図である。
【図８】 従来例におけるチップ部品等が搭載された厚膜回路基板を示す図である。
【図９】 従来例における電子部品の実装が完了した混成集積回路装置を示す図である。
【符号の説明】
２…配線・部品搭載ランド（配線導体）、３…ワイヤボンディング用パッド導体（パッド導体）、４…はんだ層、５…パワーＩＣ（電子部品）、６…コンデンサ（電子部品）、７…汚染防止用チップ、７ａ…ゴム、７ｂ…パッド状チップ、２０…厚膜回路基板（回路基板）、Ｓ１…はんだ層形成工程、Ｓ２…部品搭載工程、Ｓ３…汚染防止用チップ搭載工程、Ｓ４…はんだリフロー工程、Ｓ５…汚染防止用チップ回収工程、Ｓ７…ワイヤボンディング工程（基板内）、Ｓ９…ワイヤボンディング工程（基板−金属ベース間）。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method and a contamination prevention chip. In particular, in a mounting method in which wire bonding is performed directly on a conductor on a circuit board and an electronic component such as a semiconductor chip is connected. The present invention relates to a method for improving bondability and a contamination prevention chip.
[0002]
[Prior art]
Conventionally, ultrasonic bonding (wire bonding) using Al wire to achieve electrical connection between the thick film circuit board and the power element, and between the resin case and the terminal for taking out to the external terminal. The way to be done. When bonding the Al wire directly onto the conductor of the thick film circuit board, there is a problem that the bonding property of the Al wire deteriorates if the surface of the conductor is contaminated or adhering. In particular, during solder reflow for joining electronic components on a circuit board, contamination due to the flux in the solder material and adhesion of solder powder occurs on the conductor, greatly reducing the reliability of joining the Al wire to the conductor, etc. Problems occur.
[0003]
In view of such problems, conventionally, before executing the solder reflow process, a method for preventing the contamination of the flux and the adhesion of the solder powder by coating the resin material on the conductor to which the Al wire is bonded has been proposed. (Japanese Patent Laid-Open No. 9-293744).
[0004]
That is, according to the conventional method described in the publication, a wiring / component mounting land conductor 52 and a wire bonding pad conductor (hereinafter abbreviated as pad conductor) 53 are formed on the surface of an alumina substrate 51, respectively. In the membrane circuit board 70 (see FIG. 6), first, a resin coat 54 is applied and cured using a dispenser or the like so as to completely cover the pad conductor 53 (FIG. 7). Thereafter, as shown in FIG. 8, a solder layer 55 having a predetermined pattern is formed on the wiring / component mounting land conductor 52 by a method such as printing using a solder bonding paste. Thereafter, the power component 56 and a chip component 57 such as an IC are mounted, and the solder is reflowed at about 230 ° C. to solder the power component 56 and the chip component 57 such as an IC. At this time, the flux in the solder paste separates and flows out, or the solder powder scatters. However, since the pad conductor 53 is covered with the resin coat 54, it is possible to prevent flux contamination and adhesion of the solder powder. The Then, after the surface of the thick film circuit board 70 is cleaned and the resin coat 54 is removed, the pad conductor 53 and the power IC 56 are wire-bonded using a wire 59 made of Al or the like to make an electrical connection therebetween. Further, after the thick film circuit board 70 is bonded to the metal base 60 with the adhesive 61, the metal base 60 and the pad conductor 53 are wire-bonded to make electrical connection therebetween.
[0005]
[Problems to be solved by the invention]
However, in the conventional electronic component mounting method shown in FIGS. 6 to 9, in order to prevent flux contamination of the pad conductor 53 and adhesion of solder powder, the resin material is printed and cured to form the resin coat 54. The process of forming and the process of peeling the resin coat 54 after a solder reflow process are required. For this reason, there is a problem that many man-hours are required, and there is a problem that a dripping of the resin material adheres to the wiring / component mounting land conductor 52 and a problem of poor solder wetting occurs.
[0006]
In view of the above-described problems, the present invention provides an electronic component mounting method capable of mounting electronic components while using existing equipment and preventing contamination of circuit elements on a substrate with a small number of man-hours, and bondability of wire bonding. It is an object to be solved to provide a method for mounting an electronic component that can improve the quality of the chip, and a contamination-preventing chip used in these methods.
[0007]
[Means for Solving the Problems]
In order to achieve this object, the electronic component mounting method according to claim 1 is a method of mounting an electronic component on a circuit board, and includes a predetermined conductor such as a conductor and an electronic component provided on the circuit board. A contamination-preventing chip mounting step for mounting a contamination-preventing chip so as to cover at least a part of the circuit element, a predetermined processing step that may contaminate at least a part on the circuit board, and the predetermined A contamination prevention chip collecting step for removing the contamination prevention chip from the circuit element and collecting the contamination prevention chip , wherein the contamination prevention chip is made of an elastic material at least one surface, and in the contamination prevention chip mounting step, The anti-contamination chip is mounted so that the elastic material is in close contact with at least a part of the surface of the predetermined circuit element .
[0008]
Therefore, a predetermined processing step that may contaminate at least a part of the circuit board is performed while covering at least a part of the predetermined circuit elements such as conductors and electronic components provided on the circuit board. Therefore, it is possible to reliably prevent the predetermined circuit element from being contaminated in the predetermined processing step. Here, the contamination prevention chip has at least one surface made of an elastic material, and in the contamination prevention chip mounting step, the surface made of the elastic material of the contamination prevention chip is brought into contact with a predetermined circuit element, By applying pressure, the anti-contamination chip can be mounted easily and reliably. In the predetermined processing step, since the elastic material of the anti-contamination chip is in close contact with at least a part of the surface of the predetermined circuit element, the part can be reliably prevented from being contaminated. Then, after completion of the predetermined processing step, the anti-contamination chip is removed from the predetermined circuit element and collected, and desired processing can be satisfactorily performed on the portion where the predetermined circuit element is prevented from being contaminated. .
[0009]
The electronic component mounting method according to claim 2 is characterized in that the predetermined processing step is a solder reflow step.
[0010]
Therefore, in the solder reflow process, contamination due to outflow of solder flux or adhesion of solder powder may occur on the circuit board, but at least a part of the predetermined circuit element is covered with the contamination prevention chip. In this state, since the solder reflow process is performed, the predetermined circuit element is reliably prevented from being contaminated in the solder reflow process.
[0011]
The electronic component mounting method according to claim 3 solders the electronic component to a wiring conductor formed on the circuit board, and performs wire bonding to the pad conductor formed on the circuit board. An electronic component mounting method, comprising: a solder layer forming step of forming a solder layer made of a solder material on the circuit board; an electronic component mounting step of mounting an electronic component on the solder layer; and the pad A contamination-preventing chip mounting step of mounting a contamination-preventing chip so as to cover at least a part of the conductor, and the solder layer on which the electronic component is mounted in a state where the contamination-preventing chip is mounted on the pad conductor A solder reflow process for reflowing the electronic component to the wiring conductor and a chip for preventing contamination after the solder reflow process. A contamination prevention chip collecting step for removing and collecting, and a wire bonding step for wire bonding to the pad conductor from which the contamination prevention chip has been removed, wherein the contamination prevention chip has at least one surface The anti-contamination chip mounting step comprises mounting the anti-contamination chip so that the elastic material is in close contact with at least a part of the surface of the pad conductor .
[0012]
Therefore, a solder layer made of a solder material is formed on the circuit board, an electronic component is mounted on the solder layer, and a contamination prevention chip is mounted so as to cover at least a part of the pad conductor. Here, the contamination prevention chip has at least one surface made of an elastic material, and in the contamination prevention chip mounting process, the contamination prevention chip is mounted so that the elastic material is in close contact with at least a part of the surface of the pad conductor. To do. Then, with the anti-contamination chip mounted on the pad conductor, the solder layer on which the electronic component is mounted is reflowed under a predetermined heating condition to join the electronic component to the wiring conductor. Therefore, in the contamination prevention chip mounting step, the surface made of the elastic material of the contamination prevention chip can be brought into contact with the pad conductor and can be mounted easily and reliably. Further, in a solder reflow process in which contamination such as solder flux or solder powder easily occurs, at least a part of the pad conductor is covered with the anti-contamination chip and the elastic material of the anti-contamination chip is in close contact with the surface. , Reliably prevented from contamination. Then, after the solder reflow process, the anti-contamination chip can be removed and recovered, and wire bonding can be satisfactorily performed on the portion where the contamination of the pad conductor is prevented.
[0013]
The electronic component mounting method according to claim 4 is characterized in that the electronic component mounting step and the contamination prevention chip mounting step are performed simultaneously .
[0014]
Therefore, by simultaneously performing the electronic component mounting step and the contamination prevention chip mounting step, the number of steps required for mounting the electronic component can be greatly reduced.
[0015]
The electronic component mounting method according to claim 5 is characterized in that the elastic material is made of heat-resistant rubber .
[0016]
Therefore, since the elastic material is made of heat-resistant rubber, deformation or the like does not occur even in a processing step involving heating such as a solder reflow step.
[0017]
The electronic component mounting method according to claim 6 is characterized in that the contamination-preventing chip mounting step is performed using a component mounting machine for mounting the electronic component on a circuit board .
[0018]
Therefore, an existing component mounting machine can be used as it is, and electronic components can be mounted while preventing contamination without greatly changing the production process. Also, by using the same component mounting machine in the electronic component mounting process and the contamination prevention chip mounting process, both processes can be executed simultaneously.
[0019]
The anti-contamination chip according to claim 7 is an electronic component that is detachably mounted on a circuit element such as a conductor and an electronic component provided on the circuit board to prevent contamination of the circuit element. A chip for preventing contamination used in a mounting method, characterized in that an elastic material is attached to at least one surface of a pad-shaped chip.
[0020]
Therefore, since the anti-contamination chip has a flexible elastic material affixed to at least one surface of a pad-like chip made of a metal material or a resin material, the circuit element to be anti-contaminated is damaged. The circuit elements can be mounted in close contact with each other, and the circuit elements can be reliably prevented from various contaminations such as adhesion of solder flux and solder powder. Further, since the elastic material is mounted by being in close contact with the circuit element, the anti-contamination chip can be easily removed from the circuit element and collected.
[0021]
In the contamination prevention chip according to claim 8, the elastic material is made of heat-resistant rubber.
[0022]
Therefore, since the elastic material is made of heat-resistant rubber, deformation or the like does not occur even in a processing step involving heating such as a solder reflow step.
[0023]
According to a ninth aspect of the present invention , the contamination prevention chip is formed larger than the mounting surface of the circuit element .
[0024]
Therefore, since the contamination prevention chip is formed larger than the mounting surface of the circuit element, the entire mounting surface of the circuit element is surely covered, and the entire circuit element is contaminated in a processing step involving contamination such as a solder reflow process. Can be surely prevented.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment in which an electronic component mounting method and a contamination prevention chip according to the present invention are embodied will be described with reference to the drawings.
[0030]
FIG. 1 is a flowchart showing the overall flow of the manufacturing process of the hybrid integrated circuit device 21 employing the electronic component mounting method of the present embodiment. 2, 3, and 4 are diagrams specifically illustrating each process, in which (a) is a side view and (b) is a plan view.
[0031]
First, a thick film circuit board 20 in which wiring / component mounting lands 2 and wire bonding conductors 3 are formed on an alumina substrate 1 is prepared (see FIG. 2).
[0032]
Here, the wiring / component mounting land 2 is made of a conductor such as Cu or Ag, and is a wiring conductor provided for mounting an electronic component such as a semiconductor chip mounted on the circuit board 10 to achieve electrical connection. is there. In the wiring / component mounting land 2, electronic components are mounted on a wide rectangular portion in plan view, and these are connected by a linear wiring pattern.
[0033]
On the other hand, the wire bonding pad conductor (hereinafter abbreviated as “pad conductor”) 3 is made of a conductor such as Ag, Ag—Pd, or Au, and a wire such as Al or Au is excessively connected to the power IC 5 or the metal base 9. It is a conductor on which sonic bonding, that is, wire bonding is performed.
[0034]
On the thick film circuit board 20 having the above configuration, a paste-like solder material is printed in a predetermined pattern on the wiring / component mounting land 2 to form a solder layer 4 (see solder layer forming step S1, FIG. 1). ). The solder layer 4 can be formed by various known printing methods such as screen printing.
[0035]
Next, electronic components such as the power IC 5 and the element 6 such as a chip capacitor are mounted on the solder layer 4 (component mounting step S2), and the anti-contamination chip 7 is mounted so as to cover the upper surface of the pad conductor 3 ( Contamination prevention chip mounting step S3). The component mounting step S2 and the contamination prevention chip mounting step S3 are simultaneously performed using a known component mounting machine (chip mounter) for mounting electronic components on the thick film circuit board 20. That is, the component mounting step S2 and the contamination prevention chip mounting step S3 are described separately in the flowchart of FIG. 1, but whether the component to be mounted using the component mounting machine is an electronic component or not is used for contamination prevention. The only difference is whether the chip 7 is used or not, and the same apparatus is used at the same time.
[0036]
Here, as shown in FIG. 5, the anti-contamination chip 7 has a thin rubber plate 7a formed on both surfaces of a pad-shaped chip 7b made of a metal material such as iron or a resin material by using an Si-based adhesive or the like. It is affixed and processed into a size slightly larger than the upper surface of the pad conductor 3 so that the entire upper surface of the pad conductor 3 to be mounted can be covered. Further, the rubber 7a is made of a heat-resistant rubber such as fluorine-based or Si-based which has flexibility and heat resistance that does not cause melting at a solder reflow temperature (about 230 ° C. to about 270 ° C.). More preferably, the heat distortion temperature of the rubber 7a is 300 ° C. or higher.
[0037]
The anti-contamination chip 7 is mounted in close contact with the upper surface of the pad conductor 3 by bringing the flexible rubber 7a side into contact with the pad conductor 3 and pressurizing it.
[0038]
Next, reflow of the solder layer 4 is performed under a heating condition of about 230 ° C. to about 270 ° C., and the element 6 such as the power IC 5 or the chip capacitor is fixed to the wiring / component mounting land 2 with the molten solder material. (Solder reflow process S4). At this time, the flux in the solder paste is separated and flows out or the solder powder is scattered, but the anti-contamination chip 7 is mounted so that the rubber 7a side is in close contact with the upper surface of the pad conductor 3 and covers the pad conductor 3. Therefore, the pad conductor 3 can be reliably prevented from contamination due to solder flux and solder powder adhesion. Note that the rubber 7a of the anti-contamination chip 7 has heat resistance to the solder reflow temperature (about 230 ° C. to about 270 ° C.), so that deformation does not occur in the solder reflow step S4.
[0039]
Thereafter, only the contamination prevention chip 7 is removed and collected (contamination prevention chip collection step S5). Since the contamination preventing chip 7 is mounted by the rubber 7a being in close contact with the pad conductor 3, it can be easily removed and collected. Subsequently, the thick film circuit board 20 is cleaned (cleaning step S6).
[0040]
Then, the pad conductor 3 and the power IC 5 are ultrasonically bonded (wire bonding) using a wire 10 such as Al or Au to electrically connect them (wire bonding step (inside the substrate) S7). Here, since the pad conductor 3 is covered with the anti-contamination chip 7 in the solder reflow step S4 and is kept clean by being prevented from contamination due to solder flux or solder powder adhesion, the bonding reliability is not deteriorated. Wire bonding can be performed satisfactorily.
[0041]
Further, the thick film circuit board 20 is bonded to the metal base 9 using the adhesive 8 (metal base bonding step S8).
[0042]
Finally, the pad conductor 3 and the metal base 9 are ultrasonically bonded (wire bonding) using a wire 10 such as Al or Au to electrically connect them (wire bonding process (substrate-metal base Between) S9). Also in the wire bonding step (between the substrate and the metal base) S9, the pad conductor 3 is covered with the anti-contamination chip 7 in the solder reflow step S4 in the same manner as the wire bonding step (inside the substrate) S7 described above. Since it is prevented from contamination due to solder powder adhesion and is kept clean, wire bonding can be performed satisfactorily without deteriorating the bonding reliability.
[0043]
Through the above steps, the mounting of the electronic components on the thick film circuit board 20 is completed, and the hybrid integrated circuit device 21 is completed.
[0044]
As is apparent from the above, according to the present embodiment, the solder reflow step S4 is performed in a state where the pad conductor 3 is covered with the anti-contamination chip 7, so that the pad conductor 3 is replaced with solder flux or solder powder. It can be surely prevented from contamination due to the adhesion of water.
[0045]
In addition, since the anti-contamination chip mounting step S3 before the solder reflow step S4 can be performed simultaneously with the component mounting step S2, the component mounting step and the resin coating on the pad conductor must be performed in separate steps. Compared to this, the number of man-hours can be greatly reduced.
[0046]
Further, the contamination prevention chip mounting step S3 can be executed by using the component mounting machine used in the component mounting step S2, so that the existing process can be used as it is without significant change in the production process. Measures against contamination of the pad conductor 3 can be achieved. Further, there is no possibility that a sag of resin or the like occurs and adheres to the wiring / component mounting land 2 to cause a solder wetting defect.
[0047]
Moreover, since the used anti-contamination chip 7 collected in the anti-contamination chip collection step S5 can be reused, there is an advantage that there is no waste of material.
[0048]
In addition, this invention is not limited to each embodiment mentioned above, A various change is possible in the range which does not deviate from the main point of this invention.
[0049]
For example, in the above-described embodiment, the entire upper surface of the pad conductor 3 is covered using the anti-contamination chip 7 having a contact surface size larger than that of the pad conductor 3, but at least a part of the pad conductor 3 (for example, a wire) Only a part of the surface to which 10 is bonded may be covered with the anti-contamination chip 7.
[0050]
Further, in the anti-contamination chip 7 shown in FIG. 5, the rubber 7a is attached to both sides of the pad-like chip 7b, but it may be attached only to one side. In short, it is only necessary to attach the rubber 7a to at least the surface that contacts the pad conductor 3.
[0051]
Moreover, although the said embodiment showed the example which mounts the chip | tip 7 for pollution prevention on the pad conductor 3 in which wire bonding is performed, and prevents the contamination in solder reflow process S4, it is not restricted to this. In short, a method for mounting an electronic component on a circuit board, in which a contamination prevention chip is mounted so as to cover at least a part of a predetermined circuit element such as a conductor and an electronic component provided on the circuit board. Anti-chip mounting step, a predetermined processing step that may contaminate at least a part of the circuit board, and a anti-contamination chip collecting step of removing and collecting the anti-contamination chip from the predetermined circuit element As long as it is provided. According to this electronic component mounting method, it is possible to contaminate at least part of the circuit board while covering at least part of predetermined circuit elements such as conductors and electronic parts provided on the circuit board. Therefore, the predetermined circuit element can be reliably prevented from being contaminated in the predetermined processing step. In addition, after the predetermined processing step is finished, the anti-contamination chip is removed from the predetermined circuit element and collected, and desired processing can be satisfactorily performed on the portion where the predetermined circuit element is prevented from being contaminated. .
[0052]
【The invention's effect】
As described above, according to the electronic component mounting method according to any one of claims 1 , 2, 5, and 6 of the present invention, in the contamination prevention chip mounting step, the surface made of the elastic material of the contamination prevention chip. The effect that the anti-contamination chip can be easily and surely mounted by abutting against the predetermined circuit element and pressurizing, and for the anti-contamination in the predetermined processing step possibly involving the contamination Since the elastic material of the chip is in close contact with the surface of at least a part of the predetermined circuit element, the part is reliably prevented from being contaminated, and a desired treatment is performed on the part where the contamination of the predetermined circuit element is prevented. There is an effect that it can be applied satisfactorily.
[0053]
According to the electronic component mounting method according to any one of claims 3 to 6 , in the contamination prevention chip mounting step, the surface made of the elastic material of the contamination prevention chip is brought into contact with a predetermined circuit element. In the solder reflow process in which contamination is easily caused by solder flux or solder powder , and at least a part of the pad conductor is contaminated. the covered Rutotomoni, by an elastic material of the infection preventive chip is adhered to the surface, is reliably prevented from contamination, an effect that it is possible to improve the bonding of the wire bonding for the pad conductors.
[0054]
In addition, according to the contamination prevention chip according to any one of claims 7 to 9 , since it is possible to adhere without damaging the circuit element to be prevented from contamination, it is easy to mount on and remove from the circuit element, There is an effect that the circuit element can be surely prevented from contamination due to adhesion of solder flux or solder powder.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a flow of steps in an electronic component mounting method according to an embodiment of the present invention.
FIG. 2 is a diagram showing a thick film circuit board.
FIG. 3 is a diagram showing a thick film circuit board on which a contamination prevention chip is mounted.
FIG. 4 is a diagram showing a hybrid integrated circuit device in which mounting of electronic components is completed.
FIG. 5 is a diagram showing a structure of a contamination prevention chip.
FIG. 6 is a view showing a thick film circuit board in a conventional example.
FIG. 7 is a view showing a thick film circuit board in which a pad conductor in a conventional example is coated with a resin.
FIG. 8 is a view showing a thick film circuit board on which chip parts and the like in a conventional example are mounted.
FIG. 9 is a diagram showing a hybrid integrated circuit device in which mounting of electronic components in a conventional example is completed.
[Explanation of symbols]
2 ... Wiring / component mounting land (wiring conductor), 3 ... Wire bonding pad conductor (pad conductor), 4 ... Solder layer, 5 ... Power IC (electronic component), 6 ... Capacitor (electronic component), 7 ... Pollution prevention 7a ... rubber, 7b ... pad-like chip, 20 ... thick film circuit board (circuit board), S1 ... solder layer forming step, S2 ... component mounting step, S3 ... anti-contamination chip mounting step, S4 ... solder reflow Step, S5: Anti-contamination chip collection step, S7: Wire bonding step (inside the substrate), S9: Wire bonding step (between substrate and metal base).

Claims (9)

回路基板上へ電子部品を実装する方法であって、
前記回路基板上に設けられた導体及び電子部品等の所定の回路要素の少なくとも一部を覆うように汚染防止用チップを搭載する汚染防止用チップ搭載工程と、
前記回路基板上の少なくとも一部を汚染する可能性のある所定の処理工程と、
前記所定の回路要素より前記汚染防止用チップを取り外して回収する汚染防止用チップ回収工程と、
を備え、
前記汚染防止用チップは、少なくとも一つの面が弾性材料により構成され、
前記汚染防止用チップ搭載工程では、前記弾性材料を前記所定の回路要素の少なくとも一部の表面へ密着させるように前記汚染防止用チップを搭載することを特徴とする電子部品の実装方法。A method of mounting electronic components on a circuit board,
A contamination-preventing chip mounting step for mounting a contamination-preventing chip so as to cover at least a part of predetermined circuit elements such as conductors and electronic components provided on the circuit board;
Predetermined processing steps that may contaminate at least a portion of the circuit board;
A pollution prevention chip collecting step of removing and collecting the pollution prevention chip from the predetermined circuit element;
With
The anti-contamination chip has at least one surface made of an elastic material,
In the pollution prevention chip mounting step, the contamination prevention chip is mounted so that the elastic material is brought into close contact with at least a part of the surface of the predetermined circuit element . 前記所定の処理工程は、はんだリフロー工程であることを特徴とする請求項１に記載の電子部品の実装方法。  The electronic component mounting method according to claim 1, wherein the predetermined processing step is a solder reflow step. 回路基板上に形成された配線導体に電子部品をはんだ付けするとともに、前記回路基板上に形成されたパッド導体に対してワイヤボンディングを行うようにした電子部品の実装方法であって、
前記回路基板上にはんだ材料からなるはんだ層を形成するはんだ層形成工程と、
前記はんだ層上に電子部品を搭載する電子部品搭載工程と、
前記パッド導体の少なくとも一部を覆うように汚染防止用チップを搭載する汚染防止用チップ搭載工程と、
前記パッド導体に前記汚染防止用チップが搭載された状態で、前記電子部品が搭載された前記はんだ層を所定の加熱条件下でリフローし、前記電子部品を前記配線導体に接合するはんだリフロー工程と、
そのはんだリフロー工程後に前記汚染防止用チップを取り外して回収する汚染防止用チップ回収工程と、
前記汚染防止用チップを取り外した前記パッド導体に対してワイヤボンディングを行うワイヤボンディング工程と、
を備え、
前記汚染防止用チップは、少なくとも一つの面が弾性材料により構成され、
前記汚染防止用チップ搭載工程では、前記弾性材料を前記パッド導体の少なくとも一部の表面へ密着させるように前記汚染防止用チップを搭載することを特徴とする電子部品の実装方法。An electronic component mounting method for soldering an electronic component to a wiring conductor formed on a circuit board and performing wire bonding to a pad conductor formed on the circuit board,
A solder layer forming step of forming a solder layer made of a solder material on the circuit board;
An electronic component mounting step of mounting an electronic component on the solder layer;
A contamination-preventing chip mounting step of mounting a contamination-preventing chip so as to cover at least a part of the pad conductor;
A solder reflow step of reflowing the solder layer on which the electronic component is mounted under a predetermined heating condition in a state in which the anti-contamination chip is mounted on the pad conductor, and joining the electronic component to the wiring conductor; ,
The anti-contamination chip collection step of removing and collecting the anti-contamination chip after the solder reflow step,
A wire bonding step of performing wire bonding on the pad conductor from which the anti-contamination chip has been removed;
With
The anti-contamination chip has at least one surface made of an elastic material,
In the contamination prevention chip mounting step, the contamination prevention chip is mounted so that the elastic material is in close contact with at least a part of the surface of the pad conductor . 前記電子部品搭載工程と前記汚染防止用チップ搭載工程とは、同時に行われることを特徴とする請求項３に記載の電子部品の実装方法。 4. The electronic component mounting method according to claim 3, wherein the electronic component mounting step and the contamination prevention chip mounting step are performed simultaneously . 前記弾性材料は、耐熱性ゴムからなることを特徴とする請求項１乃至４のいずれかに記載の電子部品の実装方法。 5. The electronic component mounting method according to claim 1, wherein the elastic material is made of heat resistant rubber . 前記汚染防止用チップ搭載工程は、電子部品を回路基板上に搭載するための部品搭載機を用いて行われることを特徴とする請求項１乃至５のいずれかに記載の電子部品の実装方法。 6. The electronic component mounting method according to claim 1, wherein the contamination prevention chip mounting step is performed using a component mounting machine for mounting the electronic component on the circuit board . 回路基板上に設けられた導体及び電子部品等の回路要素上に着脱可能に搭載されて前記回路要素の汚染を防止するための電子部品の実装方法に使用される汚染防止用チップであって、A chip for preventing contamination used in a mounting method for electronic components for detachably mounting on circuit elements such as conductors and electronic components provided on a circuit board and preventing contamination of the circuit elements,
パッド状チップの少なくとも一つの面に弾性材料を貼り付けてなることを特徴とする汚染防止用チップ。  An anti-contamination chip comprising an elastic material attached to at least one surface of a pad-shaped chip. 前記弾性材料は、耐熱性ゴムからなることを特徴とする請求項７に記載の汚染防止用チップ。 The anti-contamination chip according to claim 7, wherein the elastic material is made of heat-resistant rubber . 前記汚染防止用チップは、前記回路要素の搭載面よりも大きく形成されたことを特徴とする請求項７又は８に記載の汚染防止用チップ。 The contamination prevention chip according to claim 7 or 8, wherein the contamination prevention chip is formed larger than a mounting surface of the circuit element .
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