JP2003188521A5 - - Google Patents

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JP2003188521A5
JP2003188521A5 JP2001384502A JP2001384502A JP2003188521A5 JP 2003188521 A5 JP2003188521 A5 JP 2003188521A5 JP 2001384502 A JP2001384502 A JP 2001384502A JP 2001384502 A JP2001384502 A JP 2001384502A JP 2003188521 A5 JP2003188521 A5 JP 2003188521A5
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component
electrodes
bonding
mounting position
electrode
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JP2001384502A
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JP4099329B2 (en
JP2003188521A (en
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Priority claimed from JP2001384502A external-priority patent/JP4099329B2/en
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Publication of JP2003188521A5 publication Critical patent/JP2003188521A5/ja
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Claims (11)

複数の電極を備える第１部品が実装される第１部品実装位置、及び接合電極が形成された複数の電極を備える第２部品が実装される第２部品実装位置の夫々において、複数の電極を備える回路形成体に、上記第１部品及び上記第２部品を上記夫々の実装位置に実装して、上記第１部品及び上記第２部品の混載実装を行う部品混載実装方法において、
上記回路形成体の上記第１部品実装位置において上記各電極に接合材を供給した後、上記接合材を介在させて上記各電極に上記第１部品の上記各電極を接合し、
上記回路形成体の上記第２部品実装位置において上記電極のクリーニング処理を行い、
上記第２実装位置において上記各電極に上記第２部品の上記各接合電極を接合し、
上記第１部品及び上記第２部品を上記回路形成体に実装することを特徴とする部品混載実装方法。The first component mounting position where the first component comprising a plurality of electrodes are mounted, and second component mounting position where the second part comprising a plurality of electrodes bonding electrode is formed is mounted in respectively a plurality of electrodes the circuit forming body having, the first component and the second component and mounted on the mounting position of said respective, in the component-embedded mounting method for performing hybrid implementation of the first component and the second component,
After supplying a bonding material to each of the electrodes at the first component mounting position of the circuit forming body, the electrodes of the first component are bonded to the electrodes by interposing the bonding material,
The electrode is cleaned at the second component mounting position of the circuit formed body,
Bonding the bonding electrodes of the second component to the electrodes at the second mounting position ;
Component hybrid mounting method on SL first component and the second component, characterized in that mounted on the circuit forming body. 上記クリーニング処理は、プラズマによる上記電極表面の洗浄処理である請求項１に記載の部品混載実装方法。2. The component mixed mounting method according to claim 1 , wherein the cleaning process is a cleaning process of the electrode surface with plasma. 複数の電極を備える第１部品が実装される第１部品実装位置、及び接合電極が形成された複数の電極を備える第２部品が実装される第２部品実装位置の夫々において、複数の電極を備える回路形成体に、上記第１部品及び上記第２部品を上記夫々の実装位置に実装して、上記第１部品及び上記第２部品の混載実装を行う部品混載実装方法において、
上記回路形成体の上記第２部品実装位置において上記各電極を覆うように保護部材を剥離可能に被着させ、
その後、上記回路形成体の上記第１部品実装位置において上記各電極に接合材を供給した後、上記接合材を介在させて上記各電極に上記第１部品の上記各電極を接合し、
上記第２実装位置において上記保護部材を上記各電極より剥離して、上記各電極に上記第２部品の上記各接合電極を接合し、
上記接合材及び上記各接合電極を加熱して溶融固化させることにより上記夫々の接合を維持して、上記第１部品及び上記第２部品を上記回路形成体に実装することを特徴とする部品混載実装方法。The first component mounting position where the first component comprising a plurality of electrodes are mounted, and second component mounting position where the second part comprising a plurality of electrodes bonding electrode is formed is mounted in respectively a plurality of electrodes the circuit forming body having, the first component and the second component and mounted on the mounting position of said respective, in the component-embedded mounting method for performing hybrid implementation of the first component and the second component,
A protective member is releasably attached so as to cover each electrode at the second component mounting position of the circuit formed body,
Then, after supplying a bonding material to each electrode at the first component mounting position of the circuit forming body, the electrodes of the first component are bonded to the electrodes via the bonding material,
The protective member is peeled from the electrodes at the second mounting position, and the bonding electrodes of the second component are bonded to the electrodes.
The component mixed mounting characterized in that the bonding material and the bonding electrodes are heated and melted and solidified to maintain the respective bonding, and the first component and the second component are mounted on the circuit forming body. Implementation method. 上記保護部材は、上記第２部品実装位置における上記各電極を覆って保護可能かつ剥離可能に被着可能な材料により構成されるフィルム状の部材である請求項３に記載の部品混載実装方法。4. The component mixed mounting method according to claim 3 , wherein the protective member is a film-like member made of a material that covers each electrode at the second component mounting position and can be protected and peeled off. 複数の電極を備える第１部品が実装される第１部品実装位置、及び接合電極が形成された複数の電極を備える第２部品が実装される第２部品実装位置の夫々において、複数の電極を備える回路形成体に、上記第１部品及び上記第２部品を上記夫々の実装位置に実装して、上記第１部品及び上記第２部品の混載実装を行う部品混載実装方法において、
上記回路形成体の上記第２部品実装位置において導電性粒子が分布された絶縁性の樹脂シート若しくは樹脂ペーストを、上記各電極を覆うように被着させ、
その後、上記回路形成体の上記第１部品実装位置において上記各電極に接合材を供給した後、上記接合材を介在させて上記各電極に上記第１部品の上記各電極を接合し、
上記第２実装位置において上記各電極に上記第２部品の上記各接合電極を、上記導電性粒子を介在させて接合し、
上記接合材及び上記樹脂シート又は上記樹脂ペーストを加熱して、上記接合材を溶融固化させるとともに、上記樹脂シート又は上記樹脂ペーストを熱硬化させて、夫々の接合を維持することにより、上記第１部品及び上記第２部品を上記回路形成体に実装することを特徴とする部品混載実装方法。The first component mounting position where the first component comprising a plurality of electrodes are mounted, and second component mounting position where the second part comprising a plurality of electrodes bonding electrode is formed is mounted in respectively a plurality of electrodes the circuit forming body having, the first component and the second component and mounted on the mounting position of said respective, in the component-embedded mounting method for performing hybrid implementation of the first component and the second component,
An insulating resin sheet or a resin paste in which the conductive particles are distributed in the second component mounting position of the circuit forming body, it is deposited so as to cover the respective electrodes,
Then, after supplying a bonding material to each electrode at the first component mounting position of the circuit forming body, the electrodes of the first component are bonded to the electrodes via the bonding material,
Bonding the bonding electrodes of the second component to the electrodes at the second mounting position with the conductive particles interposed,
The bonding material and the resin sheet or the resin paste are heated to melt and solidify the bonding material, and the resin sheet or the resin paste is thermoset to maintain the respective bondings. A component mounting method comprising mounting the component and the second component on the circuit forming body. 上記接合電極は、金属材料で形成されたバンプ、又は導電性樹脂で形成されたバンプである請求項５に記載の部品混載実装方法。The component-mounting mounting method according to claim 5 , wherein the bonding electrode is a bump formed of a metal material or a bump formed of a conductive resin. 上記接合電極は、半田バンプである請求項１から４のいずれか１つに記載の部品混載実装方法。5. The component mixed mounting method according to claim 1, wherein the bonding electrode is a solder bump. 上記第１部品はチップ部品又はリード付部品であり、上記第２部品はベアＩＣチップである請求項１から７のいずれか１つに記載の部品混載実装方法。  8. The component mixed mounting method according to claim 1, wherein the first component is a chip component or a leaded component, and the second component is a bare IC chip. 上記接合材は、半田である請求項１から８のいずれか１つに記載の部品混載実装方法。  The component mounting method according to claim 1, wherein the bonding material is solder. １枚の回路形成体上に、半田材料により接合される第１部品と突起電極を有するベアＩＣチップとを混載して実装する部品混載実装方法であって、
上記回路形成体上の上記ベアＩＣチップが実装される電極を覆うように剥離可能な保護部材を被着させた状態で、上記回路形成体上の上記第１部品が実装される電極に半田材料を供給して上記第１部品を実装し、
その後、上記保護部材を上記回路形成体上の上記電極から剥離して上記ベアＩＣチップを実装する部品混載実装方法。A component mixed mounting method for mounting a first component to be bonded by a solder material and a bare IC chip having a protruding electrode on a single circuit forming body,
A solder material is applied to the electrode on which the first component on the circuit forming body is mounted in a state where a peelable protective member is attached so as to cover the electrode on which the bare IC chip is mounted on the circuit forming body. To mount the first component,
Thereafter, a component-mounting mounting method in which the bare IC chip is mounted by peeling the protective member from the electrode on the circuit forming body. 上記第１部品はチップ部品又はリード付部品である請求項１０に記載の部品混載実装方法。11. The component mixed mounting method according to claim 10, wherein the first component is a chip component or a leaded component.
JP2001384502A 2001-12-18 2001-12-18 Component mixed mounting method Expired - Fee Related JP4099329B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001384502A JP4099329B2 (en) 2001-12-18 2001-12-18 Component mixed mounting method

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Application Number Priority Date Filing Date Title
JP2001384502A JP4099329B2 (en) 2001-12-18 2001-12-18 Component mixed mounting method

Publications (3)

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JP2003188521A JP2003188521A (en) 2003-07-04
JP2003188521A5 true JP2003188521A5 (en) 2005-07-21
JP4099329B2 JP4099329B2 (en) 2008-06-11

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021843A (en) * 2006-07-13 2008-01-31 Seiko Epson Corp Method of manufacturing wiring circuit and multilayer wiring circuit board
CN107799507B (en) * 2016-08-29 2020-02-04 鸿富锦精密工业（深圳）有限公司 Backlight system and method for manufacturing the same
US10651233B2 (en) * 2018-08-21 2020-05-12 Northrop Grumman Systems Corporation Method for forming superconducting structures
CN112018143A (en) * 2019-05-28 2020-12-01 云谷（固安）科技有限公司 Micro light-emitting diode display substrate, display panel, manufacturing method of display panel and display device

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