JP2003188521A - Hybrid mounting method for parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hybrid mounting method for parts wherein mounting density of each of a plurality of kinds of parts onto a circuit forming structure can be increased, and hence miniaturization of the circuit forming structure is ensured in a hybrid mounting method for parts for mixing and mounting the plurality of kinds of the parts. <P>SOLUTION: In a hybrid mounting method for parts, in which first parts 1 and second parts are mounted at respective mounting positions in a circuit forming structure 4 for hybrid mounting for the first parts and the second parts, a protective member 8 is deposited freely to be separated to cover respective electrodes at the second parts mounting position of the circuit forming structure, and then at the first parts mounting position 11 of the circuit forming structure a joint member 5 is supplied to the electrodes 4a, and thereafter the electrodes of the first parts are joined with the electrodes while intervening the foregoing joint member, and at the second mounting position 12 the foregoing protective member 8 is separated from the electrodes, and the foregoing junction electrodes of the second parts 2 are joined with the respective electrodes. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mixed mounting method for mounting a plurality of types of components on a circuit-formed body in a mixed manner.

[0002]

2. Description of the Related Art Conventionally, various mounting methods have been known for this type of component mixed mounting method.

For example, in a component mixed mounting method in which two types of components, a chip component and a bare IC chip, are mixedly mounted on a circuit board as components to be mounted on the circuit board, the bonding surface of the bare IC chip and the circuit board Bear I on the surface
Since a large number of electrodes are formed at a narrow pitch at the mounting position of the C chip, this occurs when applying cream solder for mounting the chip component at the mounting position on the mounting surface of the bare IC chip and the surface of the circuit board. There is a problem that foreign matter such as scraps of cream solder easily adheres, and the adhesion of the foreign matter causes defective bonding between the bare IC chip and the circuit board. Therefore, in the above component mixed mounting method, it is necessary to consider such foreign matter adhesion prevention, and a conventional component mixed mounting method in which such consideration is performed will be described.

First, as one mounting method, the chip components are mounted on the upper surface of the circuit board and the bare I is mounted on the lower surface of the circuit board.
This is a mixed mounting method for mounting a C chip. In such a mixed mounting method, the mounting area of each of the two types of components is divided into an upper surface and a lower surface of the circuit board, and the cream solder is applied only on the upper surface, which is one surface of the circuit board. It is possible to prevent foreign matters from adhering to the lower surface of the circuit board due to the application of cream solder. However, in such a mixed mounting method, since the types of components to be mounted on each surface of the circuit board are limited, the arrangement of the components is restricted in the circuit design, which makes the circuit design difficult. There is a problem.

As another mounting method for solving such a difficulty in circuit design, the above-mentioned two types of components are both mounted on the upper surface of the circuit board. This is a component mixed mounting method in which coating is performed to bond chip components, and then the bare IC chip, the chip component, and the circuit board are heated to mount both the bare IC chip and the chip component on the circuit board.
The procedure of the conventional component mixed mounting method will be described below with reference to FIG.

In FIG. 9 (A), a rectangular plate-shaped circuit board 4 has a plurality of chip component mounting positions 11 on which the chip components 1 can be mounted, and bare IC chip mounting on which bare IC chips 2 can be mounted. Position 12 and.
At each chip component mounting position 11, a plurality of electrodes 4a that can be joined to the electrodes of the chip component 1 are formed.
A plurality of electrodes 4b that can be joined to the electrodes of the bare IC chip 2 are formed at the chip mounting position 12. Further, in the plate-shaped bare IC chip 2, solder bumps 3 are formed as bonding electrodes on a plurality of electrodes 2a provided on the lower surface which is a bonding surface to the circuit board 4. First, the bare IC chip 2 and the circuit board 4 are aligned so that the solder bumps 3 of the bare IC chip 2 are located above the electrodes 4b of the circuit board 4, and then the solder bumps of the bare IC chip 2 are aligned. 3 is pressed against each electrode 4b of the circuit board 4 to bond each solder bump 3 of the bare IC chip 2 to each electrode 4b of the circuit board 4.

Next, as shown in FIG. 9B, the plate-shaped metal mask 6 has a plurality of solder supply openings 6a corresponding to the electrodes 4a at the chip component mounting positions 11 of the circuit board 4. And the cream solder 5 can be supplied from each solder supply opening 6a, and the bare IC
At the chip mounting position 12, a concave embossed portion 6b capable of covering the upper surface and the side surface of the bare IC chip 2 bonded to the circuit board 4 is provided, and the bare IC chip 2 is further provided.
At the same time, it is possible to cover the entire upper surface of the circuit board 4. Each solder supply opening 6 is provided so that the cream solder 5 can be supplied onto each electrode 4a at each chip component mounting position 11 from each solder supply opening 6a of the metal mask 6.
The metal mask 6 is placed on the circuit board 4 by aligning a with each electrode 4a. At this time, the bare IC chip 2 is
The metal mask 6 is covered with the embossed portion 6 b without coming into contact with the metal mask 6.

After that, the tip of the squeegee 7 is applied to the upper surface of the metal mask 6 and is moved by sliding to the left in the drawing while avoiding the embossed portion 6b, so that the solder paste openings 6a are filled with the cream solder 5. The cream solder 5 is placed on each electrode 4a at each chip component mounting position 11 on the circuit board 4.
Is applied and supplied to form a plurality of solder portions 5a. Then, the metal mask 6 on the circuit board 4 is removed from the circuit board 4.

Next, as shown in FIG. 9C, the chip component 1 is bonded onto each electrode 4a at each chip component mounting position 11 on the circuit board 4 with the solder portion 5a interposed therebetween. Thereafter, the entire circuit board 4 to which the chip components 1 and the bare IC chip 2 are bonded is heated to melt the solder portions 5a and the solder bumps 3, and then to be cooled and solidified. As a result, as shown in FIG. 9D, in the circuit board 4, the bonding with the chip component 1 at each chip component mounting position 11 and the bonding with the bare IC chip 2 at the bare IC chip 2 mounting position 12 are maintained. Will be implemented.

In such a component mixed mounting method,
At the time of applying and supplying the cream solder to each chip component mounting position 11 of the circuit board 4, the bare IC chip 2 already joined is covered and protected by the embossed portion 6b of the metal mask 6. IC chip 2 and bare IC
It is possible to prevent the problem of foreign matter adhering to the chip mounting position 12.

[0011]

In recent years, products having a built-in electronic circuit assembly formed by mounting a plurality of types of components on a circuit board in this way are becoming smaller and smaller due to market demands. Is desired. Therefore, the electronic circuit assembly itself is naturally required to be downsized, and it is necessary to increase the number of components that can be mounted on the circuit board, that is, to increase the mounting density of the components.

However, in the above mounting method,
In order to cover the bare IC chip previously bonded to the circuit board 4, it is necessary to provide the metal plate 6 with the embossed portion 6b. In the vicinity of the end of the embossed portion 6b, the metal plate 6 forms a step. Therefore, the solder supply opening 6a cannot be provided, and the squeegee 7 cannot be slid and moved. Therefore, this part corresponds to this part shown in FIGS. 9B and 9D. In the space R on the circuit board 4 to be used, the chip component 1 cannot be mounted even though there is an additional space for mounting the chip component 1. There is a problem that it has become. For example, there may be a space R of about 2 mm in the lateral direction from the end of the bare IC chip.
4 can be mounted. Also, this space R
May exist all around the bare IC chip 2 depending on the mounting position of the bare IC chip 2 on the circuit board 4. In such a case, a large number of chip components 1 can be mounted in the space R. Nevertheless, they cannot be mounted, which is a factor that prevents the mounting density of components on the circuit board from being increased.

Therefore, an object of the present invention is to solve the above-mentioned problem, and in a component mixed mounting method for mounting a plurality of types of components in a mixed manner, increasing the mounting density of each of the above-mentioned components on a circuit-formed body. Accordingly, it is an object of the present invention to provide a component-mixing mounting method that enables downsizing of the circuit-formed body.

[0014]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the first component mounting position at which the first component having a plurality of electrodes is mounted and the second component having a plurality of electrodes on which the bonding electrodes are formed are mounted. The first component and the second component are mounted by mounting the first component and the second component at the respective mounting positions on a circuit forming body having a plurality of electrodes at each of the second component mounting positions.
In a component mixed mounting method for performing component mixed mounting, a protective member is detachably attached to cover the electrodes at the second component mounting position of the circuit formed body, and thereafter,
After supplying a bonding material to the electrodes at the mounting position of the first component of the circuit-formed body, the electrodes of the first component are bonded to the electrodes with the bonding material interposed, and the second mounting is performed. The protective member is peeled off from the electrodes at the position, the bonding electrodes of the second component are bonded to the electrodes, and the bonding material and the bonding electrodes are heated and melted and solidified, respectively. There is provided a component-mixing mounting method, characterized in that the first component and the second component are mounted on the circuit-formed body while maintaining the above-mentioned joining.

According to a second aspect of the present invention, the protective member is a film-like member made of a material that covers each of the electrodes at the second component mounting position and that can be protected and peelably attached. The mixed-component mounting method according to the first aspect is provided.

According to the third aspect of the present invention, the first component mounting position at which the first component having a plurality of electrodes is mounted, and the second component having a plurality of electrodes on which the bonding electrodes are formed are mounted. The first component and the second component are mounted by mounting the first component and the second component at the respective mounting positions on a circuit forming body having a plurality of electrodes at each of the second component mounting positions.
In the component mixed mounting method for performing component mixed mounting, an insulating resin sheet or resin paste having conductive particles distributed at the second component mounting position of the circuit forming body is applied to cover the electrodes. After that, after supplying a bonding material to the electrodes at the first component mounting position of the circuit formed body, the electrodes of the first component are bonded to the electrodes with the bonding material interposed therebetween, At the second mounting position, the bonding electrodes of the second component are bonded to the electrodes with the conductive particles interposed therebetween, and the bonding material and the resin sheet or the resin paste are heated to bond the bonding material. The first component and the second component are mounted on the circuit-formed body by melting and solidifying and thermosetting the resin sheet or the resin paste to maintain the respective joints. Providing component hybrid mounting method characterized by.

According to a fourth aspect of the present invention, there is provided the component mixed mounting method according to the third aspect, wherein the bonding electrode is a bump formed of a metal material or a bump formed of a conductive resin.

According to the fifth aspect of the present invention, the first component mounting position at which the first component having a plurality of electrodes is mounted and the second component having a plurality of electrodes on which the bonding electrodes are formed are mounted. The first component and the second component are mounted by mounting the first component and the second component at the respective mounting positions on a circuit forming body having a plurality of electrodes at each of the second component mounting positions.
In a component mixed mounting method for performing component mixed mounting, after a bonding material is supplied to the electrodes at the first component mounting position of the circuit formed body, the first component is provided to the electrodes with the bonding material interposed. The electrodes are joined, the electrodes are cleaned at the second component mounting position of the circuit forming body, and the joining electrodes of the second component are joined to the electrodes at the second mounting position. A component for mounting the first component and the second component on the circuit-formed body while maintaining the respective joints by heating and melting and solidifying the joint material and each joint electrode. Provide a mixed mounting method.

According to a sixth aspect of the present invention, there is provided the component-mixing mounting method according to the fifth aspect, wherein the cleaning treatment is a cleaning treatment of the electrode surface with plasma.

According to a seventh aspect of the present invention, there is provided the component-mixing mounting method according to any one of the first, second, fifth or sixth aspects, wherein the bonding electrode is a solder bump. To do.

According to an eighth aspect of the present invention, the first component is a chip component or a leaded component, and the second component is a bare IC chip according to any one of the first to seventh aspects. A method for mounting components together is provided.

According to a ninth aspect of the present invention, there is provided the component-mixing mounting method according to any one of the first to eighth aspects, wherein the joining material is solder.

According to the tenth aspect of the present invention, the component mounting method for mounting the first component to be joined by the solder material and the bare IC chip having the protruding electrode on one circuit-formed body in a mixed manner. And the bare I on the circuit forming body
In a state in which a peelable protective member is attached so as to cover the electrode on which the C chip is mounted, the first member on the circuit formed body is attached.
A component mixed mounting method in which a solder material is supplied to an electrode on which a component is mounted to mount the first component, and then the protective member is peeled from the electrode on the circuit forming body to mount the bare IC chip. I will provide a.

According to an eleventh aspect of the present invention, there is provided the mixed component mounting method according to the tenth aspect, wherein the first component is a chip component or a leaded component.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

In the component mixed mounting method according to the first embodiment of the present invention, the first component is mounted at the first component mounting position and the second component is mounted at the second component on the circuit board 4 which is an example of the circuit forming body. This is a component mixed mounting method in which two types of components, that is, the first component and the second component are mixedly mounted on the circuit board 4 and mounted at a position, and the procedure of this component mixed mounting method is shown in FIG.

Here, the circuit-formed body means a circuit board such as a resin board, a paper-phenol board, a ceramic board, a glass / epoxy (glass epoxy) board, a film board, a single-layer board or a multi-layer board. ,parts,
It means an object on which a circuit is formed, such as a housing or a frame.

The above-mentioned first component is a single component such as a resistor made into a small size, a rectangular parallelepiped capacitor or the like, which is used alone in leadless, or QFP, SOP, SO.
In the following embodiments, the chip component 1 is an example of a leaded component such as J. The second component is referred to as a bare IC chip such as a semiconductor element or a semiconductor chip not housed in a package. In the following embodiments, the bare IC chip 2 is used as an example. In this case, the first component mounting position on the circuit board 4 is the chip component mounting position 11, and the second component mounting position is the bare IC chip mounting position 12.

In the first embodiment, the circuit board 4
After the chip component 1 is bonded to the chip component, the bare IC chip is bonded, and then the chip component 1, the bare IC chip, and the circuit board 4 are heated so that the chip component 1 and the bare IC chip 2 are both attached to the circuit substrate 4. This is a mixed component mounting method of mounting, but measures are taken to prevent foreign matter from adhering to the bare IC chip 2 and the bare IC chip mounting position 12 by supplying a bonding material to the chip component mounting position 11 for bonding the chip component 1. Has been done. The detailed procedure will be described below with reference to FIG. In the following description, the chip component 1, the bare IC chip 2, the circuit board 4, and the parts (electrodes, solder bumps, mounting positions, etc.) attached to these used in the conventional mixed component mounting method shown in FIG. 9 will be described. Have the same configuration, the following description will be given using the same reference numerals.

First, as shown in FIG. 1A, in a circuit board 4 having a plurality of chip component mounting positions 11 and bare IC chip mounting positions 12, a protective seal 8 which is an example of a protective member is attached to a bare IC chip. It is attached to the circuit board 4 so as to cover each electrode 4b at the mounting position 12. here,
The protective seal 8 covers the electrodes 4b so that the electrodes 4b
The function of protecting b and preventing the intrusion of foreign matter, and each electrode 4
It is composed of a film-shaped member having a function of being detachably attached to b and an insulating property. For example, as the material of the protective seal 8, polyimide or the like is used, and the protective seal 8 is used. The thickness is about 5 to 20 μm. Here, the foreign matter is, for example, solder scrap or the like generated when cream solder is supplied to the electrodes on the circuit board 4. Further, the protective seal 8 may be provided with heat resistance. Supply of bonding material and chip component 1 described below
This is because, in the case of joining, etc., when heat is generated, and when the generated heat is further transmitted to the protective seal 8, the heat can be endured. Further, by virtue of the above-mentioned peeling and adhesion properties of the protective seal 8, the protective seal 8 can be easily attached by disposing the lower surface of the protective seal 8 on the circuit board 4, and the end of the attached protective seal 8 By grasping and pulling up the portion, it can be easily peeled off from the circuit board 4, and even when an adhesive or the like is used for the protective seal 8, the protective seal 8 can be removed. The adhesive or the like does not remain on the circuit board 4 after being peeled off.

Further, the protective seal 8 covers the electrodes 4b at the bare IC chip mounting position 12 of the circuit board 4 and the surface portion of the circuit board 4 between the electrodes 4b so that foreign matter does not enter and adhere. It is shaped to have the smallest possible size. For example, 0.5 m from the end of the electrode 4b at the end of the bare IC chip mounting position 12
In some cases, the size may cover the outside. The protective seal 8 may be cut in this shape in advance, or, for example, immediately before the attaching operation to the circuit board 4,
There may be a case where a protective sheet roll wound in a roll shape is used after being cut into a required size.

Next, as shown in FIG. 1B, cream solder 5, which is an example of a bonding material, is supplied onto each electrode 4a at the chip component mounting position 11 of the circuit board 4. A sectional view of the circuit board 4 in the state of FIG. 1 (B) is shown in FIG. As shown in FIG. 2, the rectangular plate-shaped metal mask 9 capable of covering the entire upper surface of the circuit board 4 is
Each solder supply part 9a is provided with a plurality of solder supply openings 9a.
More cream solder 5 can be supplied. Each chip component mounting position 1 from each solder supply portion 9a of the metal mask 9
The solder supply openings 9a are aligned with the electrodes 4a so that the cream solder 5 can be supplied onto the electrodes 4a in FIG. 1, and the metal mask 9 is placed on the upper surface of the circuit board 4. The bare I of the circuit board 4 in the metal mask 9
No opening is provided in the portion corresponding to the C-chip mounting position 12.

Thereafter, the tip of the squeegee 7 is brought into contact with the upper surface of the metal mask 9 and slid to move the cream solder 5 into the solder supply openings 9a to mount the chip components on the circuit board 4. The cream solder 5 is applied and supplied onto each electrode 4a in 11 to form a plurality of solder portions 5a. At this time, since the bare IC chip mounting position 12 on the circuit board 4 is covered and protected by the protective seal 8, it does not come into direct contact with the metal mask 9, and when the cream solder 5 is applied and supplied. No foreign matter will be attached. After that, the metal mask 9 on the circuit board 4 is moved upward.

Next, as shown in FIG. 1C, the chip component 1 is bonded onto each electrode 4a at each chip component mounting position 11 on the circuit board 4 with the solder portion 5a interposed therebetween. Here, this joining means that the joining of the component and the circuit board 4 can be released without destroying the component and the circuit board 4 by applying an external force to the component such as the chip component 1 or the circuit board 4. Shows possible joints.

Then, in FIG. 1D, the circuit board 4
The protective seal 8 is peeled from the upper surface of the circuit board 4 by grasping one end of the protective seal 8 attached to the bare IC chip mounting position 12 and pulling the protective seal 8 upward.
At this time, even if foreign matter or the like adheres to the upper surface of the protective seal 8 when the cream solder 5 is applied and supplied, the foreign matter or the like is removed together with the protective seal 8 by peeling off the protective seal 8. The bare IC chip mounting position after the protective seal 8 is peeled off is kept in a clean state without any foreign matter or the like adhering thereto.

FIG. 3 shows the chip component 1, the bare IC chip 2, and the bare IC chip 2 after the bare IC chip 2 is bonded onto the circuit board 4.
3 is a cross-sectional view of the circuit board 4 and, as shown in FIG.
On each electrode 2a of the bare IC chip 2, a solder bump 3 which is an example of a protruding bonding electrode (projecting electrode) is formed in advance. As shown in FIG. 1E, the bare IC chip 2
So that each solder bump 3 is located above each electrode 4b at the bare IC chip mounting position 12 of the circuit board 4,
After the bare IC chip 2 and the circuit board 4 are aligned with each other, the solder bumps 3 of the bare IC chip 2 are pressed against the electrodes 4b so that the solder bumps 3 of the bare IC chip 2 are contacted with the electrodes 4b of the circuit board 4. To join. As a result, the circuit board 4 is brought into a state as shown in FIG.

Thereafter, as shown in FIG. 1F, the entire circuit board 4 to which the chip components 1 and the bare IC chip 2 are bonded is heated to heat the solder portions 5a and the solder bumps 3. Then, the solder portions 5a and the solder bumps 3 are melted, and then cooled and solidified. As a result, as shown in FIG. 1G, in the circuit board 4, the bonding with the chip component 1 at each chip component mounting position 11 and the bonding with the bare IC chip 2 at the bare IC chip mounting position 12 are maintained. , Each chip component 1 and bare I
The C chip 2 is mounted on the circuit board 4. After that, the mounting state of each chip component 1 and the bare IC chip 2 on the circuit board 4 is inspected.

In the heating for melting the solder portions 5a and the solder bumps 3, the entire circuit board 4 to which the chip components 1 and the bare IC chip 2 are bonded as described above is heated. Instead of the case, when the circuit board 4 is heated from the lower surface of the circuit board 4, each solder portion 5
In the case where each solder portion 5a and each solder bump 3 is heated by irradiating a heat ray such as far infrared rays to the a and each solder bump 3, or the above-mentioned individual heat ray to each chip component 1 and the bare IC chip 2 The irradiation may be performed.
This is because in each case, each solder portion 5a and each solder bump 3 can be heated and melted.

According to the first embodiment, the protective seal 8 is attached to the bare chip mounting position 12 of the circuit board 4,
By applying and supplying the cream solder 5 to the chip component mounting position 11 with the bare IC chip mounting position 8 protected, foreign substances and the like generated during the coating and supplying are prevented from adhering to the bare chip mounting position 12. can do.

By using the protective seal 8, the work of bonding the bare IC chip 2 to the circuit board 4 can be performed after the application of the cream solder 5 and the protective seal 8 itself. By being made of a film-shaped material, the metal mask 9 used for applying and supplying the cream solder 5 can have a flat plate-like shape.

As a result, the embossed portion of the metal mask, which has been necessary in the past, can be eliminated, so that the size of the protective seal 8 is set to the minimum size that can cover the bare IC chip mounting position 12. The useless space R around the bare IC chip mounting position 12 on the circuit board 4 can be eliminated, the mounting density of components on the circuit board 4 can be increased, and the circuit board on which the components are mounted can be downsized. It is possible to provide a component mixed mounting method that enables the above.

Further, since the protective seal 8 can be easily attached to the circuit board 4 and can be easily peeled off, it is possible to provide a smooth component mounting method.

The present invention is not limited to the above embodiment, but can be implemented in various other modes. For example, in the component mixed mounting method according to the second embodiment of the present invention, the chip component 1 is an example of the first component and the bare IC chip 2 is an example of the second component as in the first embodiment.
Is a component mixed mounting method of mounting and mounting the same on the circuit board 4, instead of the protective seal 8 for covering the bare IC chip mounting position 12 used in the first embodiment,
The difference is that a resin sheet or resin paste in which conductive particles are distributed is used. This will be described below with reference to FIG. 4 showing the procedure of this component mixed mounting method.

First, as shown in FIG. 4A, in a circuit board 4 having a plurality of chip component mounting positions 11 and bare IC chip mounting positions 12, an example of a resin sheet in which the conductive particles are distributed will be described. An anisotropic conductive film 18 is attached to the circuit board 4 so as to cover each electrode 4b at the bare IC chip mounting position 12. Here, the anisotropic conductive film 18
As shown in FIG. 5, a large number of conductive particles 18a are dispersed and mixed in an insulating resin sheet. When the anisotropic conductive film 18 is pressure-contacted so as to be sandwiched between the electrodes, the resin portion having an insulating property is pushed away between the electrodes, and the respective electrodes are electrically conductive particles 18a.
Can be interposed. Instead of using the resin sheet in which the conductive particles are distributed, a case in which a resin paste in which the conductive particles are distributed may be used.

Next, as shown in FIG. 4B, from the solder supply portions 9a of the metal mask 9 to the chip component mounting positions 1
The solder supply openings 9a are aligned with the electrodes 4a so that the cream solder 5 can be supplied onto the electrodes 4a in FIG. 1, and the metal mask 9 is placed on the upper surface of the circuit board 4.

Thereafter, the tip of the squeegee is attached to the metal mask 9
The cream solder 5 is filled in each solder supply opening 9a by sliding on the upper surface of the substrate and moving the same, and the cream solder 5 is applied on each electrode 4a at each chip component mounting position 11 of the circuit board 4. It is supplied to form a plurality of solder portions 5a. At this time, since the bare IC chip mounting position 12 on the circuit board 4 is covered and protected by the anisotropic conductive film 18, it does not come into direct contact with the metal mask 9, and the cream solder 5 is applied and supplied. No foreign matter or the like generated at the time of adhesion is attached. After that, the metal mask 9 on the circuit board 4 is moved upward.

Next, as shown in FIG. 4C, the chip component 1 is bonded onto each electrode 4a at each chip component mounting position 11 on the circuit board 4 with the solder portion 5a interposed therebetween.

FIG. 5 shows a partial sectional view of the bare IC chip mounting position 12 of the circuit board 4 before the bare IC chip 2 is joined. As shown in FIGS. 4D and 5, Au bumps 13, which are an example of a protruding bonding electrode, are formed in advance on each electrode 2 a of the bare IC chip 2. The bare IC chip 2 and the circuit board 4 are aligned so that the Au bumps 13 of the bare IC chip 2 are located above the electrodes 4b at the bare IC chip mounting position 12 of the circuit board 4. After that, the bare IC chip 2 and the circuit board 4 of FIG.
As shown in the cross-sectional view of FIG. 1, each Au bump 13 of the bare IC chip 2 is pressed against each electrode 4b through the anisotropic conductive film 18, and each Au bump 13 causes the resin portion in the anisotropic conductive film 18 to be removed. Push away, each Au bump 1 of bare IC chip 2
3 is bonded to each electrode 4b of the circuit board 4 with the conductive particles 18a in the anisotropic conductive film 18 interposed. Bear I
Instead of the case where the Au bump 13 is formed on each electrode 2a of the C chip 2, for example, the case where the Au bump 13 is formed of another metal material such as a Cu bump or a solder bump, or
It may be a bump formed of a conductive resin.

Thereafter, as shown in FIG. 4 (E), the entire circuit board 4 to which the respective chip components 1 and the bare IC chip 2 are bonded is heated, thereby heating the respective solder portions 5a and the respective solders. The part 5a is melted and then cooled to be solidified, and the anisotropic conductive film 18 is heated and thermoset.
As a result, as shown in FIG. 4F, the chip component 1 at each chip component mounting position 11 on the circuit board 4
And the bare I at the bare IC chip mounting position 12
The chip component 1 and the bare IC chip 2 are mounted on the circuit board 4 while maintaining the bonding with the C chip 2. afterwards,
The mounting state of each chip component 1 and the bare IC chip 2 on the circuit board 4 is inspected.

According to the second embodiment, the bare IC chip mounting position 12 is protected by using the anisotropic conductive film 18 instead of the protective sheet 8 in the first embodiment. The same effect as that of the embodiment can be obtained, and the useless space R can be eliminated around the bare IC chip mounting position 12 on the circuit board 4,
It is possible to increase the mounting density of components on the circuit board 4, and to provide a component mixed mounting method that enables miniaturization of a circuit board on which components are mounted.

In addition, since the bare IC chip mounting position 12 is protected by using the anisotropic conductive film 18, when the bare IC chip 2 is mounted at the bare IC chip mounting position 12, the anisotropic conductive film 18 is anisotropic. It is possible to provide a component mixed mounting method that can eliminate the need to peel off the conductive film 18 and can further shorten the work process as compared with the component mixed mounting method in the first embodiment.

Further, in the component mixed mounting method according to the third embodiment of the present invention, the chip component 1 and the second component as an example of the first component are used as in the first and second embodiments. As an example, there is a component mixed mounting method in which the bare IC chip 2 is mixedly mounted on the circuit board 4, and the bare IC chip mounting position 12 is not covered with a protective member or the like, but the bare I
The difference is that a cleaning process is performed on the bare IC chip mounting position 12 immediately before the bonding operation of the C chip 2. FIG. 7 showing the procedure of this component mixed mounting method, and component mixed mounting apparatus 101 for performing this component mixed mounting method.
This will be described below with reference to FIG. 8 showing a perspective view of FIG.

First, as shown in FIG. 8, the component mixed mounting apparatus 101 is provided with a plurality of working devices, and by printing the cream solder 5 at the chip component mounting position 11 of the circuit board 4 in order from the right side of the drawing. A printing device 31 for applying and supplying, and a mounter 3 for joining the chip component 1 to the chip component mounting position 11 to which the cream solder 5 is applied and supplied.
2 and 33, and a bare IC chip mounting position 1 on the circuit board 4
A cleaning device 34 for performing the cleaning process 2;
Bare IC chip mounting position 1 after cleaning process
The IC bonding device 35 for bonding the bare IC chip 2 to 2 and the circuit board 4 to which the chip component 1 and the bare IC chip 2 are bonded are heated to reflow the solder,
A reflow device 36 for mounting the chip component 1 and the bare IC chip 2 on the circuit board 4 is provided. Further, each of these working devices included in the component mixed mounting apparatus 101 includes a transfer device capable of individually transferring the circuit board 4, and
Each of these transfer devices is connected to each other, and one transfer line is formed as the component mixed mounting apparatus 101.
From the printing device 31 to the reflow device 36, the circuit board 4 is sequentially transported into each working device by this transport line, whereby each working device performs a predetermined work on each circuit substrate 4, A mixed mounting work of the component 1 and the bare IC chip 2 on the circuit board 4 is performed.

Next, such a component mixed mounting apparatus 101
The procedure of the component mixed mounting method using is explained.

First, in the component mixed mounting apparatus 101,
The circuit board 4 including the plurality of chip component mounting positions 11 and the bare IC chip mounting positions 12 is supplied to the printing device 31. In the printing device 31, as shown in FIG.
Each solder supply opening 9a and each electrode 4a so that the cream solder 5 can be supplied from each solder supply portion 9a of the metal mask 9 onto each electrode 4a at each chip component mounting position 11.
Are aligned and the metal mask 9 is placed on the upper surface of the circuit board 4.

Then, the tip of the squeegee is attached to the metal mask 9
The cream solder 5 is filled in the solder supply openings 9a by sliding on the upper surface of the circuit board 4 and moved, and the cream solder 5 is applied and supplied onto the electrodes 4a at the chip component mounting positions 11 of the circuit board 4. Then, a plurality of solder portions 5a are formed. At this time, since the bare IC chip mounting position 12 on the circuit board 4 is not covered with a protective member or the like and is not in a protected state, when foreign matter or the like generated when applying and supplying the cream solder 5 is attached. There is also. afterwards,
After the metal mask 9 on the circuit board 4 is moved upward,
The circuit board 4 is transported to the mounter 32, which is the next working device, by the transport device in the printing device 31.

After the circuit board 4 has been conveyed from the printing device 31, as shown in FIG. 7B, the mounter 32 has solder parts on the electrodes 4a at the chip component mounting positions 11 of the circuit board 4. Chip component 1 is joined with 5a interposed. In addition, when a plurality of types of chip components 1 are bonded to the circuit board 4, the same work is performed in the mounter 33 to bond the chip components 1 of each type to the circuit board 4. Work is done. Then, the circuit board 4 is carried to the cleaning device 34 which is the next working device by the carrying device in the mounter 33.

After the circuit board 4 is conveyed to the cleaning device 34, the cleaning device 34 is operated as shown in FIG.
As shown in (C), a cleaning process is performed on the bare IC chip mounting position 12 on the circuit board 4. This cleaning process is performed by cleaning the surface of each electrode 4b at the bare IC chip mounting position 12 with plasma, and it is possible to remove foreign substances and the like attached to the surface of each electrode 4b. Since the cleaning process by the plasma cleaning is performed only on the bare IC chip mounting position 12 on the circuit board 4, the bonding of each chip component 1 at the chip component mounting position 11 and the main body of each chip component 1 are affected. Never give. After this cleaning process is performed to remove foreign matters and the like attached to the bare IC chip mounting position 12, the IC joining device 35, which is the next working device, is moved by the carrying device in the cleaning device 34.
The circuit board 4 is conveyed to. Note that this cleaning process is performed on the surfaces of the electrodes 4b that require cleaning at the bare IC chip mounting position 12, instead of being performed on the surfaces of all the electrodes 4b at the bare IC chip mounting position 12. This may be the case. In the case where the bare IC chip mounting position 12 occupies a wider area than the chip component mounting position 11 on the circuit board 4, by supplying the cream solder 5 to the chip component mounting position 11 or the like. This is also because there may be a part of the electrode that obviously does not cause foreign matter to adhere.

After the circuit board 4 is conveyed to the IC bonding apparatus 35, in the IC bonding apparatus 35, as shown in FIG. 7D, each solder bump 3 of the bare IC chip 2 has a bare IC on the circuit board 4. Each electrode 4b at the chip mounting position 12
After the bare IC chip 2 and the circuit board 4 are aligned so as to be located above, the solder bumps 3 of the bare IC chip 2 are pressed against the electrodes 4b, and the solder of the bare IC chip 2 is soldered. The bump 3 is bonded to each electrode 4b of the circuit board 4. Then, the circuit board 4 is transferred to the reflow device 36, which is the next working device, by the transfer device in the IC bonding device 35.
Is transported.

In the reflow apparatus, as shown in FIG. 7E, the entire circuit board 4 to which the chip components 1 and the bare IC chip 2 are bonded is heated, so that the solder portions 5a and the solder bumps 3 is heated, and each solder part 5a
And each solder bump 3 is melted and then cooled and solidified. As a result, as shown in FIG. 7F, in the circuit board 4, the bonding with the chip component 1 at each chip component mounting position 11 and the bonding with the bare IC chip 2 at the bare IC chip mounting position 12 are maintained. The chip components 1 and the bare IC chip 2 are mounted on the circuit board 4.

According to the third embodiment, the bare IC chip mounting position 12 is protected and the bare IC chip mounting position 1 is protected by using the protective member or the like as in the first embodiment.
2 does not prevent foreign matters from adhering to the bare IC chip 2, but by performing a cleaning process by plasma cleaning between the bonding work of the chip component 1 and the bonding work of the bare IC chip 2, Even if foreign matter or the like adheres to 12, it can be removed by washing.

Therefore, the same effects as those of the first embodiment can be obtained, and the IC on the circuit board 4 can be obtained.
It is possible to eliminate a wasteful space R around the mounting position 12, increase the density of mounting the components on the circuit board 4, and reduce the size of the circuit board on which the components are mounted. Can be provided.

Further, in addition to the work process of sticking the protective member and the like to the circuit board 4 and the work process of peeling the stuck protective member and the like from the circuit board 4, a work of performing a cleaning process. Since the steps are performed, it is possible to provide the component mixed mounting method which can further shorten the work process as compared with the component mixed mounting method in the first embodiment.

It is to be noted that, by properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0066]

According to the first aspect of the present invention, a protective member is attached to the mounting position of the second component of the circuit path forming member to protect the mounting position of the second component while the first component is protected. By supplying the bonding material to the mounting position, it is possible to prevent foreign matters or the like generated when the bonding material is supplied from adhering to the second component mounting position.

Further, by using this protective member, the operation of joining the second component to the circuit forming body can be performed after the supply of the joining material to the first component mounting position, The metal mask used for supplying the bonding material can have a flat plate shape.

Since the embossed portion of the metal mask, which is conventionally required, can be eliminated, the size of the protection member is set to the minimum size that can cover the mounting position of the second component. It is possible to eliminate useless space around the second component mounting position in the circuit forming body, increase the mounting density of components on the circuit forming body, and reduce the size of the circuit forming body on which the components are mounted. It is possible to provide a component mixed mounting method that enables the above.

According to the second aspect of the present invention, the protective member can surely cover and protect the electrodes at the second component mounting position, and can be easily attached to the circuit-formed body. Since it can be peeled off easily, it is possible to provide a smooth component mixed mounting method.

According to the third aspect of the present invention, the first aspect
In place of the protective member in the aspect, an insulating resin sheet or resin paste in which conductive particles are distributed is used to protect the second component mounting position,
It is possible to obtain the same effects as the effects of the first aspect, eliminate unnecessary space around the second component mounting position in the circuit forming body, and increase the mounting density of components on the circuit forming body. Therefore, it is possible to provide a component mixed mounting method that enables downsizing of a circuit formed body on which components are mounted.

In addition, since the second component mounting position is protected by using the resin sheet or the resin paste, the resin sheet is mounted when the second component is mounted at the second component mounting position. Alternatively, it is possible to provide a component mixed mounting method that can eliminate the need to peel off the resin paste and can further shorten the work process as compared with the component mixed mounting method in the first aspect.

According to the fourth aspect of the present invention, the second aspect
Even if the bonding electrode in the component is a bump formed of a metal material or a bump formed of a conductive resin,
It is possible to provide the component mixed mounting method according to the third aspect.

According to the fifth or sixth aspect of the present invention, the second component mounting position is protected by using the protective member or the like as in the first aspect, and the second component mounting position is protected. Rather than preventing foreign substances from adhering to the surface, the work of cleaning the electrode surface with plasma at the second component mounting position between the work of joining the first component and the work of joining the second component. By performing the above, even if a foreign matter or the like is attached to the second component mounting position, it can be washed and removed.

Therefore, it is possible to obtain the same effect as that of the first aspect, it is possible to eliminate a wasteful space around the mounting position of the second component in the circuit forming body, and the component to the circuit forming body can be eliminated. It is possible to provide a component-mixing mounting method that can increase the mounting density and reduce the size of the circuit-formed body on which the components are mounted.

In addition, instead of the work process of applying the protective member to the circuit forming body and the work process of peeling the adhered protective member from the circuit forming body, the cleaning process is performed. Since the work process of performing the component mounting process is performed, it is possible to provide the component mixed mounting method that can further shorten the work process compared to the component mixed mounting method in the first aspect.

According to the seventh aspect of the present invention, the second aspect
Even when the bonding electrode in the component is a solder bump, the first aspect, the second aspect, the fifth aspect or the sixth aspect
The component mixed mounting method according to any one of the aspects can be provided.

According to the eighth aspect of the present invention, the first
Since the component is a chip component or a leaded component and the second component is a bare IC chip, the chip component and the bare IC chip are mixedly mounted on the circuit forming body while obtaining the effects of the above aspects. Thus, it is possible to provide a component mixed mounting method that can be mounted as a package.

According to the ninth aspect of the present invention, the first aspect
Even when the bonding material supplied onto the electrodes at the component mounting position is solder, it is possible to provide the component mixed mounting method in each of the above aspects.

According to the tenth aspect of the present invention, the protection member is attached to cover the electrode on which the bare IC chip of the circuit path forming member is mounted, and the electrode is protected in the first state.
By supplying the solder material to the electrode on which the component is mounted, it is possible to prevent foreign matters or the like generated during the supply of the solder material from adhering to the electrode on which the bare IC chip is mounted.

By using the protective member, the work of mounting the bare IC chip on the circuit forming body is performed after the solder material is supplied to the electrode on which the first component is mounted. Therefore, the metal mask used for supplying the solder material can have a flat plate shape.

Since the embossed portion of the metal mask, which is conventionally required, can be eliminated, the protective member has a minimum size that can cover the electrode on which the bare IC chip is mounted. By doing so, it is possible to eliminate a wasteful space around the bare IC chip in the circuit forming body, increase the mounting density of components on the circuit forming body, and the circuit on which the components are mounted. It is possible to provide a component mixed mounting method that enables miniaturization of a formed body.

According to the eleventh aspect of the present invention, since the first component is the chip component or the leaded component, the circuit component has the chip component or the lead component while the effect of the tenth aspect is obtained. It is possible to provide a component mixed mounting method capable of mounting the leaded component and the bare IC chip in a mixed manner.

[Brief description of drawings]

FIG. 1 is a diagram showing a procedure of a component mixed mounting method according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the circuit board in a state where cream solder is being supplied in the component mixed mounting method according to the first embodiment.

FIG. 3 is a cross-sectional view of the circuit board in the state where the chip component and the bare IC chip are joined in the component mixed mounting method of the first embodiment.

FIG. 4 is a diagram showing a procedure of a component mixed mounting method according to the second embodiment of the present invention.

FIG. 5 is a cross-sectional view of the bare IC chip and the circuit board immediately before the bare IC chip is joined in the component mixed mounting method of the second embodiment.

FIG. 6 is a cross-sectional view of the bare IC chip and the circuit board after the bare IC chips have been joined in the component mixed mounting method according to the second embodiment.

FIG. 7 is a diagram showing a procedure of a component mixed mounting method according to a third embodiment of the present invention.

FIG. 8 is a perspective view of a component mixed mounting apparatus for performing the component mixed mounting method according to the third embodiment.

FIG. 9 is a diagram showing a procedure of a conventional component mixed mounting method.

[Explanation of symbols]

1 ... Chip component, 1a ... Electrode, 2 ... Bare IC chip, 2
a ... Electrode, 3 ... Solder bump, 4 ... Circuit board, 4a ... Electrode, 4b ... Electrode, 5 ... Cream solder, 5a ... Solder part, 6
... metal plate, 6a ... solder supply opening, 6b ... embossed portion, 7 ... squeegee, 8 ... protective seal, 9 ... metal plate, 9a ... solder supply opening, 11 ... chip component mounting position, 12 ... bare IC Chip mounting position, 13 ... Au
Bumps, 18 ... anisotropic conductive film, 18a ... conductive particles, 3
1 ... Printing device, 32 ... Mounter, 33 ... Mounter,
34 ... Cleaning device, 35 ... IC joining device, 36 ...
Reflow apparatus, 101 ... Component mixed mounting apparatus.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Minoru Yamamoto             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Yuichi Honkawa             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5E319 AA03 AA06 AB01 AB05 AC01                       AC11 BB05 BB11 CC33 CD01                       CD29                 5E336 AA04 AA09 AA12 BB01 BB03                       BC31 CC34 CC51 CC58 DD28                       DD30 DD32 EE03 GG05 GG09

Claims (11)

[Claims] 1. A first component mounting position (11) on which a first component (1) having a plurality of electrodes (1a) is mounted, and a plurality of electrodes (2a) having bonding electrodes (3) formed thereon. Second component mounting position (12) where the second component (2) is mounted
The first component (1) and the second component (2) are mounted at the respective mounting positions (11, 12) on the circuit formed body (4) having a plurality of electrodes (4a, 4b) in each of the above. In the component mixed mounting method for performing mixed mounting of the first component (1) and the second component (2), the second component mounting position (12) of the circuit formed body (4)
In order to cover each of the electrodes (4b), the protective member (8) is detachably attached, and then, in the first component mounting position (11) of the circuit formed body (4), the electrodes (4a) are attached. Bonding material (5a)
Of the electrode (1), the electrode (1) of the first part (1) is inserted into the electrode (4a) through the bonding material (5a).
a) are joined together, and the protective member (8) is attached at the second mounting position (12).
From the electrodes (4b),
b) is joined to each of the joining electrodes (3) of the second component (2), and the joining material (5a) and each of the joining electrodes (3) are heated to be melted and solidified so that the respective joining is performed. A component-mixing mounting method comprising maintaining and mounting the first component (1) and the second component (2) on the circuit-formed body (4). 2. The protective member (8) is in the form of a film, made of a material that covers the electrodes (4b) at the second component mounting position (12) and can be protected and peelably attached. The component mixed mounting method according to claim 1, which is a member. 3. A first component mounting position (11) on which a first component (1) having a plurality of electrodes (1a) is mounted, and a plurality of electrodes (2a) having bonding electrodes (13) formed thereon. Second component mounting position (1
In the circuit forming body (4) including a plurality of electrodes (4a, 4b) in each of 2), the first component (1) and the second
In the component mixed mounting method for mounting the component (2) at the respective mounting positions (11, 12) to perform the mixed mounting of the first component (1) and the second component (2), the circuit forming body ( 4) The second component mounting position (12)
Insulating resin sheet (18) or resin paste in which conductive particles (18a) are distributed is applied so as to cover the electrodes (4b), and then the first of the circuit-formed body (4). A bonding material (5a) is attached to each of the electrodes (4a) at the component mounting position (11).
Of the electrode (1), the electrode (1) of the first part (1) is inserted into the electrode (4a) through the bonding material (5a).
a) are joined together, and the electrodes (4b) are placed at the second mounting position (12).
The bonding electrodes (13) of the second component (2) are bonded to each other via the conductive particles (18a), and the bonding material (5a) and the resin sheet (18) or the resin paste are heated. Then, the bonding material (5a) is melted and solidified, and the resin sheet (18) or the resin paste is heat-cured to maintain the respective bonding, whereby the first component (1) and the first component (1) 2 parts (2)
Is mounted on the circuit-formed body (4). 4. The component mixed mounting method according to claim 3, wherein the bonding electrode (13) is a bump made of a metal material or a bump made of a conductive resin. 5. A first component mounting position (11) for mounting a first component (1) having a plurality of electrodes (1a), and a plurality of electrodes (2a) having bonding electrodes (3) formed thereon. Second component mounting position (12) where the second component (2) is mounted
The first component (1) and the second component (2) are mounted at the respective mounting positions (11, 12) on the circuit formed body (4) having a plurality of electrodes (4a, 4b) in each of the above. In the component mixed mounting method for performing mixed mounting of the first component (1) and the second component (2), the first component mounting position (11) of the circuit formed body (4)
After supplying the bonding material (5a) to the electrodes (4a), the electrodes (4) are inserted through the bonding material (5a).
The electrodes (1a) of the first component (1) are joined to a), and the second component mounting position (12) of the circuit formed body (4).
At the second mounting position (12), the electrodes (4b) are cleaned at the second mounting position (12).
The bonding electrodes (3) of the second component (2) are bonded to the above, and the bonding material (5a) and the bonding electrodes (3) are heated and melted and solidified to maintain the respective bonding. Then, the first component (1) and the second component (2) are mounted on the circuit formed body (4). 6. The component mixed mounting method according to claim 5, wherein the cleaning process is a cleaning process of the surface of the electrode (4b) with plasma. 7. The component mixed mounting method according to claim 1, 2, 5 or 6, wherein the bonding electrode (3) is a solder bump. 8. The first component (1) is a chip component (1).
Alternatively, it is a leaded component, and the second component (2) is bare I.
The component mixed mounting method according to any one of claims 1 to 7, which is a C chip (2). 9. The component mixed mounting method according to claim 1, wherein the joining material (5a) is solder. 10. A bare IC chip (2) having a protrusion electrode (3) and a first component (1) joined by a solder material (5) is mixedly mounted on one circuit forming body (4). A component mixed mounting method for mounting by mounting a protective member (8) which can be peeled off so as to cover an electrode (4b) on which the bare IC chip (2) is mounted on the circuit formed body (4). In this state, the solder material (5) is supplied to the electrode (4a) on which the first component (1) is mounted on the circuit formed body (4) to mount the first component (1), Then, the component mixed mounting method of mounting the bare IC chip (2) by peeling off the protection member (8) from the electrode (4b) on the circuit formed body (4). 11. The component mixed mounting method according to claim 10, wherein the first component (1) is a chip component or a component with leads.