JP3963625B2 - ポジ型フォトレジスト組成物 - Google Patents

ポジ型フォトレジスト組成物 Download PDF

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Publication number
JP3963625B2
JP3963625B2 JP37275799A JP37275799A JP3963625B2 JP 3963625 B2 JP3963625 B2 JP 3963625B2 JP 37275799 A JP37275799 A JP 37275799A JP 37275799 A JP37275799 A JP 37275799A JP 3963625 B2 JP3963625 B2 JP 3963625B2
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JP
Japan
Prior art keywords
group
general formula
acid
substituent
branched
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Expired - Lifetime
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JP37275799A
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English (en)
Japanese (ja)
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JP2001249458A (ja
JP2001249458A5 (enExample
Inventor
亨 藤森
史郎 丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP37275799A priority Critical patent/JP3963625B2/ja
Priority to US09/512,664 priority patent/US6630280B1/en
Priority to KR1020000009219A priority patent/KR100621456B1/ko
Publication of JP2001249458A publication Critical patent/JP2001249458A/ja
Publication of JP2001249458A5 publication Critical patent/JP2001249458A5/ja
Application granted granted Critical
Publication of JP3963625B2 publication Critical patent/JP3963625B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
    • C07D498/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
    • C07D498/04—Ortho-condensed systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/115—Cationic or anionic

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP37275799A 1999-02-24 1999-12-28 ポジ型フォトレジスト組成物 Expired - Lifetime JP3963625B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP37275799A JP3963625B2 (ja) 1999-02-24 1999-12-28 ポジ型フォトレジスト組成物
US09/512,664 US6630280B1 (en) 1999-02-24 2000-02-24 Positive photoresist composition
KR1020000009219A KR100621456B1 (ko) 1999-02-24 2000-02-24 포지티브 포토레지스트 조성물

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP4652499 1999-02-24
JP11-105485 1999-04-13
JP10548599 1999-04-13
JP11-46524 1999-10-20
JP29860899 1999-10-20
JP11-298608 1999-10-20
JP37275799A JP3963625B2 (ja) 1999-02-24 1999-12-28 ポジ型フォトレジスト組成物

Publications (3)

Publication Number Publication Date
JP2001249458A JP2001249458A (ja) 2001-09-14
JP2001249458A5 JP2001249458A5 (enExample) 2005-07-07
JP3963625B2 true JP3963625B2 (ja) 2007-08-22

Family

ID=27461890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37275799A Expired - Lifetime JP3963625B2 (ja) 1999-02-24 1999-12-28 ポジ型フォトレジスト組成物

Country Status (3)

Country Link
US (1) US6630280B1 (enExample)
JP (1) JP3963625B2 (enExample)
KR (1) KR100621456B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129086B2 (en) 2008-06-03 2012-03-06 Shin-Etsu Chemical Co., Ltd. Polymerizable compound, polymer, positive resist composition, and patterning process using the same
EP4325292A1 (en) 2022-08-10 2024-02-21 Shin-Etsu Chemical Co., Ltd. Chemically amplified positive resist composition and resist pattern forming process

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4177966B2 (ja) * 2001-01-25 2008-11-05 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP2002229210A (ja) * 2001-02-06 2002-08-14 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US6858370B2 (en) * 2001-02-23 2005-02-22 Fuji Photo Film Co., Ltd. Positive photosensitive composition
TW562999B (en) * 2001-05-09 2003-11-21 Fuji Photo Film Co Ltd Positive resist composition for electronic or X-rays
JP4137408B2 (ja) * 2001-05-31 2008-08-20 富士フイルム株式会社 ポジ型レジスト組成物
US6949329B2 (en) * 2001-06-22 2005-09-27 Matsushita Electric Industrial Co., Ltd. Pattern formation method
JP3890365B2 (ja) * 2001-11-01 2007-03-07 富士フイルム株式会社 ポジ型レジスト組成物
JP4414721B2 (ja) * 2002-11-22 2010-02-10 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP4115322B2 (ja) * 2003-03-31 2008-07-09 富士フイルム株式会社 ポジ型レジスト組成物
JP5054042B2 (ja) * 2008-02-08 2012-10-24 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5054041B2 (ja) * 2008-02-08 2012-10-24 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5423367B2 (ja) * 2009-01-23 2014-02-19 Ｊｓｒ株式会社 酸転写用組成物、酸転写用膜及びパターン形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777441B2 (ja) * 1989-12-21 1998-07-16 東洋合成工業株式会社 感放射線樹脂組成物及び該感放射線樹脂組成物を用いたパターン形成方法
US5072137A (en) 1990-08-17 1991-12-10 Sgs-Thomson Microelectronics, Inc. Semiconductor memory with a clocked access code for test mode entry
US5558971A (en) * 1994-09-02 1996-09-24 Wako Pure Chemical Industries, Ltd. Resist material
JP3322493B2 (ja) * 1994-12-09 2002-09-09 富士写真フイルム株式会社 湿し水不要感光性平版印刷版
US5843624A (en) * 1996-03-08 1998-12-01 Lucent Technologies Inc. Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
US6165678A (en) * 1997-09-12 2000-12-26 International Business Machines Corporation Lithographic photoresist composition and process for its use in the manufacture of integrated circuits
JP4007570B2 (ja) * 1998-10-16 2007-11-14 富士フイルム株式会社 ポジ型レジスト組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129086B2 (en) 2008-06-03 2012-03-06 Shin-Etsu Chemical Co., Ltd. Polymerizable compound, polymer, positive resist composition, and patterning process using the same
EP4325292A1 (en) 2022-08-10 2024-02-21 Shin-Etsu Chemical Co., Ltd. Chemically amplified positive resist composition and resist pattern forming process

Also Published As

Publication number Publication date
JP2001249458A (ja) 2001-09-14
US6630280B1 (en) 2003-10-07
KR100621456B1 (ko) 2006-09-13
KR20000076727A (ko) 2000-12-26

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