JP3953821B2 - 膜厚測定方法および膜厚測定装置 - Google Patents

膜厚測定方法および膜厚測定装置 Download PDF

Info

Publication number
JP3953821B2
JP3953821B2 JP2002009304A JP2002009304A JP3953821B2 JP 3953821 B2 JP3953821 B2 JP 3953821B2 JP 2002009304 A JP2002009304 A JP 2002009304A JP 2002009304 A JP2002009304 A JP 2002009304A JP 3953821 B2 JP3953821 B2 JP 3953821B2
Authority
JP
Japan
Prior art keywords
substrate
thin film
current value
film thickness
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002009304A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003214831A5 (enExample
JP2003214831A (ja
Inventor
洋輔 板垣
恵三 山田
健雄 牛木
Original Assignee
ファブソリューション株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ファブソリューション株式会社 filed Critical ファブソリューション株式会社
Priority to JP2002009304A priority Critical patent/JP3953821B2/ja
Priority to TW091138099A priority patent/TW580560B/zh
Priority to US10/336,766 priority patent/US6683308B2/en
Priority to KR10-2003-0001380A priority patent/KR100526668B1/ko
Publication of JP2003214831A publication Critical patent/JP2003214831A/ja
Publication of JP2003214831A5 publication Critical patent/JP2003214831A5/ja
Application granted granted Critical
Publication of JP3953821B2 publication Critical patent/JP3953821B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2814—Measurement of surface topography
    • H01J2237/2815—Depth profile

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
JP2002009304A 2002-01-17 2002-01-17 膜厚測定方法および膜厚測定装置 Expired - Fee Related JP3953821B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002009304A JP3953821B2 (ja) 2002-01-17 2002-01-17 膜厚測定方法および膜厚測定装置
TW091138099A TW580560B (en) 2002-01-17 2002-12-31 Method and apparatus for measuring thickness of thin film
US10/336,766 US6683308B2 (en) 2002-01-17 2003-01-06 Method and apparatus for measuring thickness of thin film
KR10-2003-0001380A KR100526668B1 (ko) 2002-01-17 2003-01-09 박막두께측정방법 및 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002009304A JP3953821B2 (ja) 2002-01-17 2002-01-17 膜厚測定方法および膜厚測定装置

Publications (3)

Publication Number Publication Date
JP2003214831A JP2003214831A (ja) 2003-07-30
JP2003214831A5 JP2003214831A5 (enExample) 2005-08-04
JP3953821B2 true JP3953821B2 (ja) 2007-08-08

Family

ID=19191506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002009304A Expired - Fee Related JP3953821B2 (ja) 2002-01-17 2002-01-17 膜厚測定方法および膜厚測定装置

Country Status (4)

Country Link
US (1) US6683308B2 (enExample)
JP (1) JP3953821B2 (enExample)
KR (1) KR100526668B1 (enExample)
TW (1) TW580560B (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3953821B2 (ja) * 2002-01-17 2007-08-08 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
JP4090303B2 (ja) * 2002-08-08 2008-05-28 株式会社日立ハイテクノロジーズ 電子ビーム計測用センサー及び電子ビーム計測方法
US7459913B2 (en) * 2004-08-13 2008-12-02 International Business Machines Corporation Methods for the determination of film continuity and growth modes in thin dielectric films
US7162133B2 (en) * 2004-08-20 2007-01-09 Agency For Science Technology And Research Method to trim and smooth high index contrast waveguide structures
CN100592028C (zh) * 2005-01-07 2010-02-24 精工电子纳米科技有限公司 薄膜样品测量方法和设备及薄膜样品制备方法和设备
JP2008034475A (ja) * 2006-07-26 2008-02-14 Renesas Technology Corp 半導体装置の製造方法
DK2251454T3 (da) 2009-05-13 2014-10-13 Sio2 Medical Products Inc Coating og inspektion af beholder
US7985188B2 (en) 2009-05-13 2011-07-26 Cv Holdings Llc Vessel, coating, inspection and processing apparatus
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
JP2011029271A (ja) * 2009-07-22 2011-02-10 Micronics Japan Co Ltd 薄膜特性測定装置及び方法、並びに、薄膜加工装置及び方法
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
JP5754296B2 (ja) * 2011-08-18 2015-07-29 Ｊｆｅスチール株式会社 膜厚均一性評価方法
JP5754297B2 (ja) * 2011-08-18 2015-07-29 Ｊｆｅスチール株式会社 膜厚均一性評価方法
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
AU2012318242A1 (en) 2011-11-11 2013-05-30 Sio2 Medical Products, Inc. Passivation, pH protective or lubricity coating for pharmaceutical package, coating process and apparatus
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
CA2890066C (en) 2012-11-01 2021-11-09 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
EP2925903B1 (en) 2012-11-30 2022-04-13 Si02 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
EP2961858B1 (en) 2013-03-01 2022-09-07 Si02 Medical Products, Inc. Coated syringe.
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
EP3693493A1 (en) 2014-03-28 2020-08-12 SiO2 Medical Products, Inc. Antistatic coatings for plastic vessels
US10203202B2 (en) * 2014-04-07 2019-02-12 John Weber Schultz Non-contact determination of coating thickness
KR101630798B1 (ko) * 2014-11-05 2016-06-15 한국표준과학연구원 코팅 두께 측정 장치 및 방법
US11077233B2 (en) 2015-08-18 2021-08-03 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
CN105470162B (zh) * 2016-01-08 2019-07-02 武汉新芯集成电路制造有限公司 一种侦测接触孔缺陷的方法
US11410830B1 (en) 2019-03-23 2022-08-09 Kla Corporation Defect inspection and review using transmissive current image of charged particle beam system
EP4099091B1 (en) 2021-06-02 2024-04-10 IMEC vzw Pattern height metrology using an e-beam system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639807A (ja) 1986-06-30 1988-01-16 Nec Corp 膜厚測定方法およびその装置
US5162240A (en) * 1989-06-16 1992-11-10 Hitachi, Ltd. Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate
JPH0817166B2 (ja) * 1991-04-27 1996-02-21 信越半導体株式会社 超薄膜ｓｏｉ基板の製造方法及び製造装置
JPH06273297A (ja) 1993-03-19 1994-09-30 Casio Comput Co Ltd イオンビームによるエッチング方法
JP3058394B2 (ja) 1994-06-23 2000-07-04 シャープ株式会社 透過電子顕微鏡用断面試料作成方法
JP3075535B2 (ja) * 1998-05-01 2000-08-14 キヤノン株式会社 電子放出素子、電子源及び画像形成装置の製造方法
JP3292159B2 (ja) 1998-12-10 2002-06-17 日本電気株式会社 膜厚測定装置および膜厚測定方法
JP3953821B2 (ja) * 2002-01-17 2007-08-08 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置

Also Published As

Publication number Publication date
KR20030063129A (ko) 2003-07-28
US20030132381A1 (en) 2003-07-17
TW200302341A (en) 2003-08-01
JP2003214831A (ja) 2003-07-30
KR100526668B1 (ko) 2005-11-08
US6683308B2 (en) 2004-01-27
TW580560B (en) 2004-03-21

Similar Documents

Publication Publication Date Title
JP3953821B2 (ja) 膜厚測定方法および膜厚測定装置
JP3913555B2 (ja) 膜厚測定方法および膜厚測定装置
KR100388690B1 (ko) 반도체장치 테스터
US7518109B2 (en) Method and apparatus of measuring thin film sample and method and apparatus of fabricating thin film sample
JP5492383B2 (ja) 走査型電子顕微鏡及びこれを用いたパターン寸法計測方法
US20070057687A1 (en) High current electron beam inspection
KR100614238B1 (ko) 기판 측정 장치 및 기판 측정 방법
JP4231798B2 (ja) 荷電粒子線装置および倍率計測法
JP3292159B2 (ja) 膜厚測定装置および膜厚測定方法
JP4095510B2 (ja) 表面電位測定方法及び試料観察方法
JPH09166428A (ja) 測長用電子顕微鏡
JP4080902B2 (ja) 半導体デバイス解析装置および解析方法
JP4060143B2 (ja) 非破壊測定装置および半導体装置製造方法
Scheithauer Quantitative lateral resolution of a Quantum 2000 X‐ray microprobe
JP3194986B2 (ja) マーク検出方法および装置並びにそれを用いた電子線描画方法およびその装置
CN101356635B (zh) 半导体测量装置及半导体测量方法
KR20060058502A (ko) 반도체장치의 검사장치 및 방법
JPH0319309A (ja) 位置合わせ方法
JP2010153208A (ja) 走査型電子顕微鏡のチャージアップ検出方法
KR20080025044A (ko) 미세 영역 촬상 장치 및 미세 영역 촬상 방법
JPS62276404A (ja) パタ−ン検出装置
JPH02106051A (ja) 電子分析方法
JPH0580133A (ja) 半導体集積回路試験装置
JPS6246057B2 (enExample)

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050106

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050106

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070123

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070326

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070417

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070425

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100511

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110511

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110511

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120511

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130511

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140511

Year of fee payment: 7

LAPS Cancellation because of no payment of annual fees