JP3953716B2 - 基板洗浄装置 - Google Patents

基板洗浄装置 Download PDF

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Publication number
JP3953716B2
JP3953716B2 JP2000233251A JP2000233251A JP3953716B2 JP 3953716 B2 JP3953716 B2 JP 3953716B2 JP 2000233251 A JP2000233251 A JP 2000233251A JP 2000233251 A JP2000233251 A JP 2000233251A JP 3953716 B2 JP3953716 B2 JP 3953716B2
Authority
JP
Japan
Prior art keywords
contact pressure
substrate
cleaning
cleaned
control panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000233251A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002050602A (ja
JP2002050602A5 (https=
Inventor
浩司 阿藤
文利 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000233251A priority Critical patent/JP3953716B2/ja
Priority to US09/918,570 priority patent/US20020029431A1/en
Publication of JP2002050602A publication Critical patent/JP2002050602A/ja
Publication of JP2002050602A5 publication Critical patent/JP2002050602A5/ja
Application granted granted Critical
Publication of JP3953716B2 publication Critical patent/JP3953716B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2000233251A 2000-08-01 2000-08-01 基板洗浄装置 Expired - Lifetime JP3953716B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000233251A JP3953716B2 (ja) 2000-08-01 2000-08-01 基板洗浄装置
US09/918,570 US20020029431A1 (en) 2000-08-01 2001-08-01 Substrate cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000233251A JP3953716B2 (ja) 2000-08-01 2000-08-01 基板洗浄装置

Publications (3)

Publication Number Publication Date
JP2002050602A JP2002050602A (ja) 2002-02-15
JP2002050602A5 JP2002050602A5 (https=) 2005-07-21
JP3953716B2 true JP3953716B2 (ja) 2007-08-08

Family

ID=18725796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000233251A Expired - Lifetime JP3953716B2 (ja) 2000-08-01 2000-08-01 基板洗浄装置

Country Status (2)

Country Link
US (1) US20020029431A1 (https=)
JP (1) JP3953716B2 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60033811T2 (de) * 2000-09-08 2007-11-15 Qimonda Dresden Gmbh & Co. Ohg Wafer-Reinigungsvorrichtung
US7007333B1 (en) * 2002-06-28 2006-03-07 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
JP4152853B2 (ja) * 2003-09-30 2008-09-17 株式会社 日立ディスプレイズ 表面処理装置、および、液晶表示装置の製造方法
US8608858B2 (en) * 2004-09-28 2013-12-17 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
US7823241B2 (en) * 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
US8356376B2 (en) 2008-06-18 2013-01-22 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and storage medium
JP4976342B2 (ja) * 2008-06-18 2012-07-18 東京エレクトロン株式会社 基板洗浄装置および基板洗浄方法、ならびに記憶媒体
JP5229702B2 (ja) * 2008-12-11 2013-07-03 株式会社レヨーン工業 クリーンローラ装置
DE102009014006A1 (de) * 2009-03-19 2010-09-23 Sms Siemag Aktiengesellschaft Verfahren und Vorrichtung zur Reinigung eines Metallbandes
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP2012138498A (ja) * 2010-12-27 2012-07-19 Toshiba Corp 洗浄方法
JP5937456B2 (ja) * 2012-08-07 2016-06-22 東京エレクトロン株式会社 基板洗浄装置および基板洗浄ユニット
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6262983B2 (ja) 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
CN103953209B (zh) * 2012-12-12 2017-06-09 保利集团澳门有限公司 水池系统及建造使用方法
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
JP6279276B2 (ja) * 2013-10-03 2018-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US10141205B2 (en) * 2014-09-26 2018-11-27 Acm Research (Shanghai) Inc. Apparatus and method for cleaning semiconductor wafer
JP6646460B2 (ja) * 2016-02-15 2020-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6767834B2 (ja) 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6758247B2 (ja) * 2017-05-10 2020-09-23 株式会社荏原製作所 洗浄装置および基板処理装置、洗浄装置のメンテナンス方法、並びにプログラム
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
JP7653785B2 (ja) * 2020-12-28 2025-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN115882781A (zh) * 2022-12-13 2023-03-31 华能大理风力发电有限公司洱源分公司 一种基于力矩传感的光伏板清洗控制方法及系统
CN116984758A (zh) * 2023-08-30 2023-11-03 宁波锦世弘机械设备有限公司 一种玻璃打孔倒角一体机

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328426B2 (ja) * 1994-05-12 2002-09-24 東京エレクトロン株式会社 洗浄装置

Also Published As

Publication number Publication date
US20020029431A1 (en) 2002-03-14
JP2002050602A (ja) 2002-02-15

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