JP3944743B2 - 駆動用ic - Google Patents
駆動用ic Download PDFInfo
- Publication number
- JP3944743B2 JP3944743B2 JP2003308809A JP2003308809A JP3944743B2 JP 3944743 B2 JP3944743 B2 JP 3944743B2 JP 2003308809 A JP2003308809 A JP 2003308809A JP 2003308809 A JP2003308809 A JP 2003308809A JP 3944743 B2 JP3944743 B2 JP 3944743B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- signal
- liquid crystal
- electrodes
- scan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
Description
ただし、かかる実施形態は、本発明の一態様を示すものであり、この発明を限定するものではなく、本発明の範囲内で任意に変更することが可能である。
これらの結果、全ての信号電極Psi及び走査電極Psoに所定の検査用電圧を印加でき、よって、液晶パネルの全ての表示エリアに関して表示特性の良否を検査できる。
そして、下ケース27には、例えば図1に示した液晶装置1と、スピーカ33と、そして回路基板34とが設けられる。
2a,2b 透明基板
3 シール部材
4 液晶
5 液晶パネル
6 偏光板
7 スペーサ
8 導電材
9 ACF
11 駆動用IC
Bsi 信号電極用バンプ(信号電極用電極端子)
Bso 走査電極用バンプ(走査電極用電極端子)
13si 信号電極用導電性部材
13so 走査電極用導電性部材
21 駆動用IC
23si 信号電極用導電性部材
23so 走査電極用導電性部材
26 上ケース
27 下ケース
32 マイクロホン
34 回路基板
A 信号電極用電極端子と走査電極用電極端子との間隔及び信号電極と走 査電極との間隔
B IC装着領域
Psi 信号電極
Pso 走査電極
Qsi 信号電極領域
Qso 走査電極領域
Claims (2)
- 複数の走査電極と複数の信号電極とを備えた液晶パネルを駆動するための駆動用ICであって、
前記複数の走査電極と導電接続するための複数の走査電極用電極端子を有する走査電極用電極端子群と、
前記複数の信号電極と導電接続するための複数の信号電極用電極端子を有する信号電極用電極端子群と、
を有し、
前記走査電極用電極端子群及び前記信号電極用電極端子群は、前記駆動用ICの同じ辺に沿って設けられ、
互いに隣り合う前記走査電極用端子群と前記信号電極用端子群との間には、前記複数の走査電極用電極端子における走査電極用電極端子同士の間隔及び前記複数の信号電極用電極端子における信号電極用電極端子同士の間隔よりも広い間隔が形成されていることを特徴とする駆動用IC。 - 複数の走査電極と複数の信号電極とを備えた液晶パネルを駆動するための駆動用ICであって、
前記駆動用ICの隣り合う辺の一方の辺に沿って設けられ、前記複数の走査電極と導電接続するための複数の走査電極用電極端子と、
前記駆動用ICの隣り合う辺の他方の辺に沿って設けられ、前記複数の信号電極と導電接続するための複数の信号電極用電極端子と、
を有し、
前記複数の走査電極用電極端子のうち前記他方の辺側の最端に位置する走査電極用電極端子と前記複数の信号電極用電極端子のうち前記一方の辺側の最端に位置する信号電極用電極端子との間には、前記複数の走査電極用電極端子における走査電極用電極端子同士の間隔及び前記複数の信号電極用電極端子における信号電極用電極端子同士の間隔よりも広い間隔が形成されていることを特徴とする駆動用IC。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003308809A JP3944743B2 (ja) | 1996-03-27 | 2003-09-01 | 駆動用ic |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7187296 | 1996-03-27 | ||
JP2003308809A JP3944743B2 (ja) | 1996-03-27 | 2003-09-01 | 駆動用ic |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP04438297A Division JP3536571B2 (ja) | 1996-03-27 | 1997-02-27 | 駆動用ic、液晶装置及び電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007036381A Division JP2007193348A (ja) | 1996-03-27 | 2007-02-16 | 液晶パネル及び液晶装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004006996A JP2004006996A (ja) | 2004-01-08 |
JP2004006996A5 JP2004006996A5 (ja) | 2005-06-23 |
JP3944743B2 true JP3944743B2 (ja) | 2007-07-18 |
Family
ID=30445350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003308809A Expired - Lifetime JP3944743B2 (ja) | 1996-03-27 | 2003-09-01 | 駆動用ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3944743B2 (ja) |
-
2003
- 2003-09-01 JP JP2003308809A patent/JP3944743B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2004006996A (ja) | 2004-01-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100405882C (zh) | 安装构造体、安装用基板、电光装置和电子仪器 | |
US7148427B2 (en) | Wiring substrate, display device, semiconductor chip, and electronic equipment | |
US5450222A (en) | Electrical connection of devices incorporating multiple liquid crystal cells | |
US6870590B2 (en) | Electrooptical unit with a flexible board and electronic apparatus | |
JP3536571B2 (ja) | 駆動用ic、液晶装置及び電子機器 | |
JP3721999B2 (ja) | 液晶装置及び電子機器 | |
EP1391774A1 (en) | Liquid crystal display | |
US6945789B2 (en) | Display module | |
KR101424037B1 (ko) | 액정표시장치 | |
US6741315B1 (en) | Liquid crystal device and electronic apparatus | |
JP3944743B2 (ja) | 駆動用ic | |
JP2004111810A (ja) | 複合基板の製造方法、複合基板の構造、電気光学装置及び電子機器 | |
KR20030029731A (ko) | 액정표시장치 | |
JP2001318618A (ja) | フレキシブル配線基板および表示パネル | |
JP3596546B2 (ja) | 液晶パネル、液晶装置及び電子機器 | |
JP2007193348A (ja) | 液晶パネル及び液晶装置 | |
JP2000284261A (ja) | 液晶装置及び電子機器 | |
JP3684886B2 (ja) | 半導体チップの実装構造、液晶装置及び電子機器 | |
JPH11212102A (ja) | 液晶表示パネル | |
JP2004145361A (ja) | 駆動用ic、液晶装置及び電子機器 | |
KR100534377B1 (ko) | 액정 표시 장치 및 그 제조 방법 | |
JP3567781B2 (ja) | 液晶装置、液晶装置の製造方法及び電子機器 | |
JP2000275672A (ja) | 液晶装置、液晶装置の製造方法及び電子機器 | |
JP3482881B2 (ja) | 半導体実装構造、液晶装置及び電子機器 | |
JP2008058769A (ja) | 実装構造体、電気光学装置及び電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040204 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040204 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20040204 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040723 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070216 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070314 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070327 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110420 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110420 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120420 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130420 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130420 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140420 Year of fee payment: 7 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term |