JP3929056B2 - コネクタ - Google Patents
コネクタ Download PDFInfo
- Publication number
- JP3929056B2 JP3929056B2 JP2004080992A JP2004080992A JP3929056B2 JP 3929056 B2 JP3929056 B2 JP 3929056B2 JP 2004080992 A JP2004080992 A JP 2004080992A JP 2004080992 A JP2004080992 A JP 2004080992A JP 3929056 B2 JP3929056 B2 JP 3929056B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- insulator
- holding portion
- solder
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 35
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000007747 plating Methods 0.000 description 9
- 230000013011 mating Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 230000002079 cooperative effect Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Images
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
相手側コネクタ及び配線基板における相互間の接続に供されると共に、インシュレータ内に該相手側コネクタに備えられる相手側コンタクトにそれぞれ接触可能な一端側の圧入部が圧入列設され、且つ他端側の端子部がそれぞれ配線基板上に半田付けにより実装接続される複数のコンタクトを有するコネクタが開示されている(例えば、特許文献1を参照)。
11a 保持部の一辺
12 保持部
12a 突部
12b 低濡れ性領域
14,16 接触部
18 端子部
20 インシュレータ
28 収容部
30 プリント配線基板
33 回路パターン
A 第1の方向
B 第2の方向
Claims (2)
- 導電性のコンタクトと、コンタクトを保持したインシュレータとを含み、前記コンタクトは、前記インシュレータに保持される保持部と、該保持部から第1の方向へ延びている接触部と、前記保持部から前記第1の方向とは逆方向へ延びておりかつ前記インシュレータの外へ延びて前記インシュレータを実装する接続対象物に半田によって接続される端子部とを有し、前記インシュレータは、前記コンタクトを収容する収容部を有しているコネクタにおいて、
前記保持部には、前記保持部の一辺から前記第1の方向を直交する方向に突出している突部が形成されており、
前記突部が前記収容部で前記インシュレータに圧入することによって保持されており、
前記突部を含む前記保持部の表裏面には、前記突部との協働作用により前記半田の這い上がりを阻止するよう前記第1の方向を直交する方向に前記半田に対して低濡れ性を有する低濡れ性領域が形成されていることを特徴とするコネクタ。 - 請求項1記載のコネクタにおいて、前記低濡れ性領域は、前記突部を含む前記保持部の表裏面に前記第1の方向を直交する方向で帯状に形成されていることを特徴とするコネクタ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004080992A JP3929056B2 (ja) | 2004-03-19 | 2004-03-19 | コネクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004080992A JP3929056B2 (ja) | 2004-03-19 | 2004-03-19 | コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005268128A JP2005268128A (ja) | 2005-09-29 |
JP3929056B2 true JP3929056B2 (ja) | 2007-06-13 |
Family
ID=35092438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004080992A Expired - Lifetime JP3929056B2 (ja) | 2004-03-19 | 2004-03-19 | コネクタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3929056B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4384193B2 (ja) * | 2007-03-14 | 2009-12-16 | 日本航空電子工業株式会社 | コネクタ |
WO2011075369A1 (en) | 2009-12-14 | 2011-06-23 | Leach International Corporation | Systems and methods for balancing multi-cell batteries |
JP5630875B2 (ja) * | 2012-06-28 | 2014-11-26 | ヒロセ電機株式会社 | 半田濡れ性を制御したコンタクトを有するコネクタ、及び、コンタクトのメッキ処理方法 |
-
2004
- 2004-03-19 JP JP2004080992A patent/JP3929056B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005268128A (ja) | 2005-09-29 |
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