JP3901804B2 - Component mounting head and component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention includes, for example, a component mounting method that is performed when a plurality of component holding members that hold electronic components and each of the held components is mounted on a circuit board, and a component mounting for executing the component mounting method. The present invention relates to a head and a component mounting apparatus including the component mounting head.
[0002]
[Prior art]
As shown in FIG. 5, the electronic component mounting machine 1 that has been conventionally used accommodates a board transport unit 2 that holds a circuit board when a circuit board 10 is carried in, out, and a part is mounted, and an electronic part to be mounted. The reel-type electronic component supply device 3 or the tray-type electronic component supply device 4 and the electronic component held from at least one of the electronic component supply device 3 and the electronic component supply device 4 are mounted to the mounting position on the circuit board 10. For this purpose, a component holding device 6 that can be moved in the X and Y directions by the XY robot 5 and a component recognition camera 7 that captures and measures the holding posture of the electronic component held by the component holding device 6 are provided. In addition, the component holding device 6 includes a head portion having a plurality of nozzles 8 that hold the electronic component 9 by sucking, for example.
[0003]
The head part will be described with reference to FIGS. As shown in FIG. 6, the head portion 50 is roughly divided into a hollow shape for suction, and a nozzle 8 holds the spline shaft 51 whose tip portion functions as the nozzle 8 and the measurement result of the component recognition camera 7. A motor 61 as a drive unit for rotating the spline shaft 51 around its axis in order to correct the holding posture of the electronic component, and the spline shaft 51 for holding and mounting the component by suction. A lifting device 64 that moves along the axial direction and a suction device 70 are provided.
The head unit 50 configured as described above operates as follows. The spline shaft 51 is lowered by the elevating device 64 at the component holding position in the component supply device 3 or the like, and the electronic component is sucked and held by the nozzle 8 by the suction operation by the suction device 70. For the above-described holding posture correction, the nozzle 8 holding the electronic component is rotated around its axis by the motor 61. Thereafter, when the head unit 50 is placed on the mounting position of the circuit board by the XY robot 5, the spline shaft 51 adsorbing the electronic component is lowered by the lifting device 64, and the electronic component is mounted at the mounting position. .
[0004]
Such a conventional head unit 50 will be described in more detail.
A nut 54 is fitted to one end of the spline shaft 51, and a nut 66 is fitted to the other end so as to be slidable in the axial direction. The nut 54 and the nut 66 rotate with the rotation of the spline shaft 51 around the axis. The nut 66 is rotatably supported by the base 58 of the head unit 50 via the bearing 65. A timing pulley 55 is attached to the nut 54, and the timing pulley 55 is rotatably supported on the base 58 of the head unit 50 via a bearing 56. A timing belt 59 is wound around the timing pulley 55 between the timing pulley 60 attached to the output shaft of the motor 61. Therefore, the spline shaft 51 can rotate around its axis via the timing pulley 60, the timing belt 59, the timing pulley 55, and the nut 54 by driving the motor 61.
A block 62 is fixed to the central portion of the spline shaft 51. Therefore, the block 62 rotates with the rotation of the spline shaft 51 around the axis and moves with the movement of the spline shaft 51 in the axial direction. A groove 68 is formed along the circumferential direction of such a block 62, and a roller 63 is slidably engaged with the groove 68. The member 69 is engaged. The lifting member 69 is connected to a lifting device 64 that moves the spline shaft 51 in the axial direction. The lifting device 64 is attached to the base 58. Therefore, by driving the lifting device 64, the spline shaft 51 can move in the axial direction via the lifting member 69, the roller 63, and the block 62.
[0005]
Further, in order to improve production efficiency, the head portion 50 is provided with a plurality of nozzles 8, and accordingly, a plurality of spline shafts 51 are also provided accordingly. In the component supply device 3 or the like, the plurality of nozzles 8 may hold the electronic components at the same time, but the plurality of electronic components are not simultaneously mounted on the circuit board. Therefore, the spline shafts 51 are lifted and lowered separately for component mounting. Further, in order to avoid interference between the mounted electronic component and the electronic component sucked by the nozzle 8, the rotation operation of the spline shaft 51 around the axis is performed with the spline shaft 51 raised. Therefore, although the lifting device 64 is provided for each spline shaft 51, only one rotating operation around the axis of the spline shaft 51 is provided for the plurality of spline shafts 51. That is, as shown in FIG. 7, the timing belt 59 is wound around both the timing pulley 55 of the spline shaft 51 and the timing pulley 72 of the spline shaft 71 not shown in FIG. Thus, both the spline shaft 51 and the spline shaft 71 are simultaneously rotated.
[0006]
[Problems to be solved by the invention]
As described above, in the case of the conventional head unit 50 that has a plurality of nozzles 8 and is configured such that these nozzles 8 are simultaneously rotated around the axis by one motor 61, the electronic components are formed by the plurality of nozzles 8. The above rotation for correcting the holding posture is executed for each electronic component when each of the electronic components is adsorbed. Every time the nozzles 8 are rotated, all the electronic components are rotated. That is, components other than the component that performs the holding posture correction are also rotated at the same time. Therefore, each electronic component receives a rotational moment more than necessary. In addition, the electronic component adsorbed by the nozzle 8 is held only by the frictional force with respect to the nozzle 8, and generally, there is a risk that the electronic component is displaced with respect to the nozzle 8 when it is excessively rotated. When the electronic component is displaced with respect to the nozzle 8, it may cause a defective mounting of the electronic component on the substrate. On the other hand, if a rotation mechanism is provided for each spline shaft, the entire head unit 50 becomes large, and expensive NC shafts increase unnecessarily, leading to an increase in cost.
The present invention has been made to solve such problems, and can improve the mounting quality of electronic components on a substrate, and further, a component mounting method, a component mounting head, and a component mounting head that do not increase costs. An object is to provide a component mounting device.
[0007]
[Means for Solving the Problems]
The component mounting method according to the first aspect of the present invention is provided in a component mounting head that is movable in two directions orthogonal to each other on a plane, and each of the component mounting members can move independently in the axial direction. The component holding member sequentially holds the components, and then sequentially mounts the held components on the mounted body.
After the component holding member holds the component, each component holding member is independently rotated around the axis of the component holding member to rotate the held component, and the held component is attached to the mounted body. It is characterized by being attached.
[0008]
  The component mounting head according to the second aspect of the present invention is a component mounting head that is movable in two directions orthogonal to each other on a plane, and each has a plurality of component holding members that are independently movable in the axial direction. , A component mounting head that sequentially holds the component on each component holding member and sequentially mounts the component on the mounted body,
  Generates driving force to rotate the component holding member around its axisThe component mounting head has one drive source and a first rotation member that passes through each of the component holding members in a non-contact state and rotates around the axis by the drive source. And
An interlocking device that is provided in each of the component holding members and that controls transmission of the driving force by the rotation driving unit to the component holding members and enables rotation around the axis for each of the component holding members. A second rotating member provided in each of the component holding members and penetrating through the component holding member and slidable in the axial direction without rotating about the axis with respect to the component holding member; and the second rotation A second member that moves the member in the axial direction so that the first rotating member and the second rotating member are brought into contact with each other, and the rotational force of the first rotating member is transmitted to the component holding member through the second member. An interlocking device having a moving device for a rotating member;
With respect to the component holding member that can be rotated around the axis of the component holding member by the interlocking device, the component holding member that has been rotated in order to mount the held component on the mounted body is axially moved. One moving device provided in the component mounting head to be moved to
The moving device moves the component holding member in the axial direction at the same time when the first rotating member and the second rotating member come into contact with each other by the second rotating member moving device.
It is characterized by that.
[0010]
  A component mounting apparatus according to a fourth aspect of the present invention is the second mode.LikeA component mounting head is provided.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
A component mounting method, a component mounting head, and a component mounting apparatus including the component mounting head according to an embodiment of the present invention will be described below with reference to the drawings. The component mounting method is executed by the component mounting head and the component mounting apparatus. Moreover, the same code | symbol is attached | subjected about the same component in each figure. Further, in the present embodiment, an electronic component is taken as an example of a component to be handled, and a circuit board is taken as an example of a mounted body on which the component is mounted, but is not limited thereto.
Further, the following spline shaft 110 corresponds to an embodiment that fulfills the function of the “component holding member” described in the means for solving the above problems.
[0012]
The electronic component mounting apparatus 100 of the present embodiment has the same configuration as the electronic component mounting machine 1 shown in FIG. 5, and as shown in FIG. 2, the board transport unit 2, the reel type electronic component supply device 3 and the tray type. An electronic component supply device 4, an XY robot 5, a component holding device 101, and a component recognition camera 7 are provided. Note that the components other than the component holding device 101 are the same as those provided in the electronic component mounting machine 1, and a description thereof will be omitted.
Similar to the above-described component holding device 6, the component holding device 101 includes the component mounting head 105 shown in FIG. 1, which has a plurality of nozzles 8 that hold the electronic component 9 by sucking, for example, and the component mounting head 105. Has a configuration that allows each of the plurality of nozzles 8 to rotate independently about the axis. Such a component mounting head 105 will be described below. FIG. 1 shows only one nozzle 8 out of the plurality of nozzles 8.
[0013]
As shown in FIG. 1, the component mounting head 105 is roughly divided into a spline shaft 110 having a hollow shape for suction and a tip portion functioning as the nozzle 8, and each spline shaft 110. One moving device 170 that moves the spline shaft 110 selected for the holding operation and the component mounting operation to the board along the axial direction, and the nozzle 8 holds the spline shaft based on the measurement result by the component recognition camera 7. One rotation drive unit 171 that rotates the spline shaft 110 around its axis in order to correct the holding posture of the electronic components that are present, and each of the spline shafts 110 is provided with a rotational force applied to the spline shaft 110 by the rotation drive unit 171. The transmission is controlled, and each spline shaft 110 rotates around its axis. It includes the interlock device 172 according to ability, at least the mobile device 170, and a control unit 180 for controlling operation of the rotational driving unit 171 and the interlocking device 172.
The basic operation of the component mounting head 105 configured as described above is as follows. That is, the spline shaft 110 is lowered by the moving device 170 at the component holding position in the component supply device 3 or the like, and the electronic component is sucked and held by the nozzle 8 by the suction operation by the suction device 70. Only the spline shaft 110 selected for the above-described holding posture correction is rotated around the axis by the interlocking device 172 and the rotation driving unit 171. When the component mounting head 105 is disposed on the circuit board mounting position by the XY robot 5, the spline shaft 110 that sucks the electronic component is lowered by the moving device 170, and the electronic component held by the nozzle 8 is moved. Attach to the mounting position.
[0014]
Such a component mounting head 105 will be described in more detail. As described above, only one spline shaft 110 is shown in FIG. 1, and the following constituent parts are provided for each spline shaft 110 unless otherwise specified.
A nut 112 is fitted to one end of the spline shaft 110 and a nut 140 is fitted to the other end of the spline shaft 110 so as to be slidable in the axial direction. The nut 112 and the nut 140 rotate together with the spline shaft 110 in the direction around the axis of the spline shaft 110. The nut 112 is rotatably supported by the base 116 of the component mounting head 105 via the bearing 113, and the nut 140 is rotatably supported by the base 116 via the bearing 138. Therefore, the spline shaft 110 is attached to the base 116 of the component mounting head 105 provided in the component holding device 101 so as to be rotatable about the axis and movable in the axial direction. In the present embodiment, the axial direction of the spline shaft 110 is oriented along the vertical direction, but the orientation direction of the spline shaft 110 is not limited to this.
[0015]
The moving device 170 is disposed on the other end portion side of the spline shaft 110, is driven by the motor 132 attached to the base 116, and extends along the axial direction of the spline shaft 110. A ball screw 133, a nut 134 that engages with the ball screw 133 and moves along the axial direction by driving the ball screw 133 by the motor 132, and a roller 136 that is rotatably attached to the nut 134. The spline shaft 110 can be moved in the axial direction by driving the motor 132 as long as the following disk 137 is in contact with the roller 136.
As shown in FIG. 4, one moving device 170 is provided for the plurality of spline shafts 110. In the present embodiment, one component holding device 101 is provided.
[0016]
A disc 137 is fixed to the spline shaft 110 in a state in which the spline shaft 110 penetrates between the spline shaft 110 and a nut 140 described later in detail. Therefore, the disk 137 moves and rotates with the movement of the spline shaft 110 in the axial direction and the rotation around the axis. A spring 139 is provided concentrically with the spline shaft 110 between the disc 137 and the first rotating member 126. As will be described later, since the first rotating member 126 is rotatably attached to the base 116 in the circumferential direction, the spline shaft 110 is moved along the axial direction along the nut 140 side by the spring 139 via the disc 137. Is being energized.
[0017]
The rotational drive unit 171 is disposed at substantially the center of the spline shaft 110 and is concentric with the motor 131 attached to the base 116, the timing pulley 130 attached to the output shaft of the motor 131, and the spline shaft 110. A first rotating member 126 that is disposed and is inserted through the spline shaft 110 in a non-contact state with the spline shaft 110, and a timing pulley 129 and a timing belt 129 that is wound around the first rotating member 126 are provided. In this embodiment, two spline shafts 110 are provided, and only one motor 131 is provided for the two spline shafts 110. Further, the first rotating member 126 is attached to the base 116 through a bearing 127 so as to be rotatable around the axis of each spline shaft 110. Therefore, the timing belt 129 is wound around the timing pulley 130 and the plurality of first rotating members 126, and all the first rotating members 126 rotate around the axis by the motor 131 operating. Further, the first rotating member 126 has a concave first engaging portion 141 that meshes with a second engaging portion 114 formed on a second rotating member 121 described later.
[0018]
The interlocking device 172 is disposed in the vicinity of the rotation driving unit 171 and performs the second rotation member 121 and the second rotation member that engages and disengages the second rotation member 121 and the first rotation member 126. Mobile device 173 is provided.
The second rotating member 121 is a member that is disposed so as to face the first rotating member 126 and is concentric with the spline shaft 110 and is inserted through the spline shaft 110 to rotate the spline shaft 110 around its axis. The second rotating member 121 is fitted to a nut 120 fitted to the spline shaft 110 so as to be slidable in the axial direction of the spline shaft 110 and not rotatable about the axis. The second rotating member 121 is formed with a convex second engaging portion 114 that engages with the first engaging portion 141 of the first rotating member 126. Accordingly, the first engaging member 141 and the second engaging member 114 are connected to the first rotating member 126 that can rotate around the axis of the spline shaft 110 in a non-contact state with the spline shaft 110. Thus, the second rotating member 121 rotates in the direction around the axis of the spline shaft 110, thereby rotating the spline shaft 110 around the axis via the nut 120.
Further, the second rotating member 121 is biased toward the first rotating member 126 by the spring 119 in order to securely engage the first engaging portion 141 and the second engaging portion 114. The spring 119 is inserted into the spline shaft 110 concentrically with the spline shaft 110, and one end side of the spring 119 is a bearing 117 fixed to the base 116 of the component mounting head 105 and a ring shape attached to the bearing 117. Abutted against the plate 118.
[0019]
The second rotating member moving device 173 includes a moving member 124, a brake plate 122, a roller 125, and a cylinder 123. In the present embodiment, the cylinder 123 and the moving member 124 are both arranged parallel to the axial direction of the spline shaft 110, and the moving member 124 is connected to the output shaft of the cylinder 123. Therefore, when the output shaft of the cylinder 123 moves along the axial direction of the spline shaft 110, the moving member 124 also moves along the axial direction.
One end of the moving member 124 has a ring shape that is concentric with the spline shaft 110, abuts against the second rotating member 121, and moves the second rotating member 121 in the axial direction of the spline shaft 110 along with the movement of the moving member 124. A brake plate 122 is provided to be moved. The second rotating member 121 is pressed against the brake plate 122 by the urging force of the spring 119. When the first rotating member 126 and the second rotating member 121 are not engaged, the brake plate 122 causes unnecessary rotation of the second rotating member 121 around the axis due to friction with the second rotating member 121. On the other hand, when the first rotating member 126 and the second rotating member 121 are engaged, the contact between the brake plate 122 and the second rotating member 121 is released and the brake plate 122 is released. Does not hinder the rotation of the second rotating member 121.
At the other end of the moving member 124, a roller 125 projects from the spline shaft 110 side. The above-described disk 137 urged by the spring 139 contacts the roller 125. Therefore, the spline shaft 110 can be moved via the disc 137 in the same direction as the moving direction of the moving member 124. However, as described above, since the disk 137 also contacts the roller 136 of the moving device 170, the spline shaft 110 moves along with the movement of the roller 136 in the moving device 170 after the disk 137 contacts the roller 136. It will move in the axial direction. In the present embodiment, each component is configured such that when the first rotating member 126 and the second rotating member 121 are engaged, the disk 137 is released from contact with the roller 125 and is in contact with the roller 136. A member is configured.
In the present embodiment, the cylinder 123 is constituted by an air cylinder and is fixed to the base 116 of the component mounting head 105.
[0020]
The operation of the electronic component mounting apparatus 100 will be described below while mainly describing the operation of the component mounting head 105 configured as described above. In the component mounting head 105, each operation of the suction device 70, the motor 132 of the moving device 170, the motor 131 of the rotation driving unit 171, the cylinder 123 of the interlocking device 172, and other components included in the electronic component mounting device 100. The operation is controlled by the control device 180. In the present embodiment, the control device 180 is provided inside the electronic component mounting apparatus 100, but is not limited thereto, and may be provided outside the electronic component mounting apparatus 100.
[0021]
In step (indicated by “S” in FIG. 3) 1 in FIG. 3, the circuit board is carried in from the previous process by the board transport unit 2 and supported at the mounting position. Next, the component holding device 101 is moved to the reel-type component supply device 3 or the tray-type component supply device 4 by the XY robot 5. In step 2, the cylinder 123 provided in the spline shaft 110 (for convenience of description, referred to as spline shaft 110-1) having the nozzle 8 disposed above the component to be mounted is driven, and the cylinder 123 is connected to the first rotating member 126. The moving member 124 is lowered so that the second rotating member 121 is engaged. By this operation, the first rotating member 126 and the second rotating member 121 are engaged, and the disk 137 contacts the roller 136. Therefore, thereafter, the lowering operation of the spline shaft 110-1 is performed by the moving device 170. In step 3, the motor 131 of the rotation drive unit 171 is operated to rotate the nozzle 8 by a predetermined angle before the electronic component is sucked. As described above, since the first rotating member 126 and the second rotating member 121 are engaged at this time, the second rotating member including the timing pulley 130, the timing belt 129, the first rotating member 126, and the nut 120 is used. Through 121, the spline shaft 110-1 is rotated about the axis by the predetermined angle. Next, in step 4, the motor 132 of the moving device 170 is actuated to drive the ball screw 133, and the roller 136 is lowered to such an extent that the electronic component can be adsorbed by the nozzle 8. Therefore, the spline shaft 110-1 is lowered via the disk 137 urged by the roller 136 by the spring 139, and the nozzle 8 performs suction by the operation of the suction device 70. Therefore, the nozzle 8 sucks the electronic component.
[0022]
After the electronic components are attracted, in step 5, the motor 132 of the moving device 170 is operated to raise the spline shaft 110-1 through the ball screw 133, the block 135, the roller 136, and the disc 137. Further, in order to set the sucked electronic component at a predetermined mounting angle, the motor 131 of the rotation driving unit 171 is driven to rotate the nozzle 8 to the mounting angle. Further, when the spline shaft 110-1 is raised by the motor 132 and the roller 125 comes into contact with the disk 137, the cylinder 123 is actuated to raise the moving member 124 as step 6. Therefore, the spline shaft 110-1 further rises via the disk 137 that contacts the roller 125, and the second rotating member 121 rises by the brake plate 122. Thereby, the engagement between the first rotating member 126 and the second rotating member 121 is released, and the rotation of the spline shaft 110-1 in the direction around the axis is prevented by the friction between the brake plate 122 and the second rotating member 121. Is done.
[0023]
As Step 7, the operations in Steps 2 to 6 described above are also performed on a spline shaft 110 (referred to as a spline shaft 110-2 for explanation) that is different from the spline shaft 110-1, so that the spline shaft 110-2 An electronic component is also mounted on the nozzle 8. During step 7, as described above, the spline shaft 110-1 is prevented from rotating about its axis.
In this way, after the electronic components are attracted to the respective nozzles 8, the component holding device 101 is moved above the component recognition camera 7 by the XY robot 5 in step 8, and the electronic components are attracted to the respective nozzles 8. The posture is photographed, and the control device 180 determines whether or not the suction posture is corrected by an image processing technique.
In step 9, the spline shaft 110 is rotated around the axis by the following operation so that the nozzle 8 determined to require the suction correction needs to have a desired suction posture. For example, when it is necessary to correct the suction posture of the electronic component sucked by the nozzle 8 of the spline shaft 110-1, the cylinder 123 provided in the spline shaft 110-1 is operated, so that the first operation is performed again. The first rotating member 126 and the second rotating member 121 are engaged. Then, the motor 131 of the rotation drive unit 171 is operated to rotate the first rotating member 126, thereby causing the second rotating member 121 having the nut 120 to rotate the spline shaft 110-1 around the axis by a predetermined angle. Then, the suction posture is corrected. At this time, for the other spline shaft 110-2, the first rotating member 126 is rotating, but the first rotating member 126 and the second rotating member 121 of the spline shaft 110-2 are not engaged. The spline shaft 110-2 does not rotate around its axis.
[0024]
In the next step 10, the component holding apparatus 101 places the nozzles 8 above the mounting position on the circuit board by the XY robot 5. For each nozzle 8, the cylinder 123 and the moving device 170 are operated as described above to lower the spline shaft 110, and the sucked electronic components are sequentially mounted on the circuit board. When mounting of parts is completed for all the nozzles 8 and when further mounting of parts is necessary, the component holding device 101 is again set to the reel-type part supply device 3 or the tray-type part by the XY robot 5 to suck the electronic parts. It arrange | positions to the supply apparatus 4 and the operation | movement of step 2-10 is repeated.
[0025]
In this embodiment, as described above, after the suction posture is corrected for all the nozzles 8 in step 9, the mounting of the components is sequentially performed in step 10. For example, for each nozzle 8, Correction of the suction posture and mounting of parts may be executed.
[0026]
As described above, according to the electronic component mounting apparatus 100 of the present embodiment, since the held component can be rotated around the axis of the nozzle 8 for each nozzle 8, there is one component whose end is corrected at one end. There is no deviation. Thus, mounting quality can be improved without causing defective mounting of components on the substrate.
Furthermore, since only one nozzle rotation mechanism is provided for all nozzles, the entire component mounting head does not become large.
Furthermore, since only one moving device 170 for moving each spline shaft in the axial direction is provided for each spline shaft, the cost can be increased without increasing the number of expensive NC shafts. Absent.
[0027]
【The invention's effect】
As described in detail above, according to the component mounting method of the first aspect of the present invention, the component mounting head of the second aspect, and the component mounting apparatus of the fourth aspect, the interlocking device is provided, Since it is configured to rotate independently about its axis, the component holding posture can be corrected for each component holding member after each component holding member holds the member. Therefore, unlike the prior art, other component holding members do not rotate when the component holding posture of one component holding member is corrected. Therefore, the holding posture of the component once the holding posture correction has been completed does not change, and the component can be accurately mounted on the mounted body, and the mounting quality can be improved.
[0028]
  further,Second aspectAccording to this component mounting head, since one moving device is provided for a plurality of component holding members, only one expensive NC shaft is required, and the cost is not increased.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a component mounting head according to an embodiment of the present invention.
2 is a perspective view showing a component mounting apparatus including the component mounting head shown in FIG. 1. FIG.
FIG. 3 is a flowchart showing an operation of the component mounting apparatus shown in FIG. 2;
4 is a perspective view showing a structure of a moving device provided in the component mounting head shown in FIG. 1. FIG.
FIG. 5 is a perspective view showing a conventional component mounter.
FIG. 6 is a cross-sectional view showing a conventional head portion.
7 is a plan view of a rotation mechanism portion of the spline shaft shown in FIG. 6. FIG.
[Explanation of symbols]
10 ... circuit board, 70 ... suction device,
100 ... electronic component mounting apparatus, 105 ... component mounting head,
110 ... spline shaft, 121 ... second rotating member,
126: first rotating member, 131: motor,
171 ... Rotation drive unit, 172 ... Interlocking device,
173: Second rotating member moving device, 180: Control device.

Claims (3)

A component mounting head that is movable in two directions orthogonal to each other on a plane, each of which has a plurality of component holding members that can move independently in the axial direction. A component mounting head for sequentially mounting to a mounted body while holding
  A rotation driving unit that generates a driving force for rotating the component holding member about its axis, and the component mounting head penetrates the component holding member in a non-contact state with each of the component holding members. A rotation drive unit having a first rotation member that rotates about the axis by the drive source;
  An interlocking device that is provided in each of the component holding members and that controls transmission of the driving force by the rotation driving unit to the component holding members and enables rotation around the axis for each of the component holding members. A second rotating member provided in each of the component holding members and penetrating through the component holding member and slidable in the axial direction without rotating about the axis with respect to the component holding member; and the second rotation A second member that moves the member in the axial direction so that the first rotating member and the second rotating member are brought into contact with each other, and the rotational force of the first rotating member is transmitted to the component holding member through the second member. An interlocking device having a moving device for a rotating member;
  With respect to the component holding member that can be rotated around the axis of the component holding member by the interlocking device, the component holding member that has been rotated in order to mount the held component on the mounted body is axially moved. One moving device provided in the component mounting head to be moved to
  The moving device moves the component holding member in the axial direction at the same time when the first rotating member and the second rotating member come into contact with each other by the second rotating member moving device.
A component mounting head characterized by that. The component mounting head according to claim 1, wherein the component is held by the component holding member by suction of the component by a suction device. A component mounting apparatus comprising the component mounting head according to claim 1.

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