JPH08222895A - Electronic parts mounting device - Google Patents

Abstract

PURPOSE: To reduce the size and weight of a mounting head by raising a selected suction nozzle while the nozzle holds electronic parts by suction and lowering the nozzle together with a mounting head main body to mount the electronic parts on a substrate. CONSTITUTION: The mounting head 10 of an electronic parts mounting device is provided with a mounting head main body 20 which can freely move in the vertical direction against an index table 5 and is positioned at a plurality of positions in the direction of rotation of the table 5 and one kind of nozzle selected by means of a selecting means out of a plurality of kinds of suction nozzles 11 held at the lower end section of the main body 20 is protruded down from the other nonselected nozzles. The nozzle 11 attracts electronic parts 100 by suction when the main body 20 is lowered and mounts the parts 100 on a substrate when the main body 20 is lowered after the table 5 makes intermittent rotation. Therefore, the size and weight of the mounting head can be reduced, because the head can attract and hold parts having various kinds of shapes and sizes by suction by changing the kind of the suction nozzle selected by means of the selecting means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus capable of mounting various types of electronic components on a board, and particularly, a plurality of mounting heads are arranged at the peripheral portion of an index table,
The present invention relates to an electronic component mounting apparatus suitable for a so-called sequence method in which electronic components are picked up and transferred in a mounting sequence from a supply device that is fixedly arranged in accordance with intermittent rotation of an index table.

[0002]

2. Description of the Related Art Recently, as leadless electronic components (chip components) have become widespread, the types thereof have increased, and in order to cope with these types, the types of suction nozzles as suction means for electronic components have also increased. Further, as the mounting density of the board increases, it has become necessary to mount the sucked electronic components at various angles. In order to satisfy such a condition, it is considered that the most efficient method is to arrange several kinds of suction nozzles on the circumference in one mounting head so that each suction nozzle is rotatable and satisfy the above condition. Came.

Japanese Patent Laid-Open No. 3-18100 discloses a conventional technique which discloses the above-mentioned structure in which one mounting head has a plurality of types of suction nozzles. This Japanese Patent Laid-Open No. 3-1810
In No. 0, the mounting heads provided at equal angular intervals on the index table are provided with a plurality of lifting shafts on a head block swingable with respect to the index table, and different kinds of suction pins (suction pins) are attached to the lower ends of the lifting shafts. Nozzle). Further, it has an elevating drive shaft for elevating the plurality of elevating shafts.

[0004]

By the way, JP-A-3-
The conventional mounting head as shown in No. 18100 moves up and down integrally with the center axis through the same head block and the raising and lowering drive shaft which is the center axis that moves up and down through the head block. In addition, the mounting head itself can be made smaller and lighter because it is composed of three vertically moving shafts that rotate freely and suction nozzles provided at the lower ends of these three vertically moving shafts. was difficult. Also,
Because conventional mounting heads cannot be made smaller, rolling bearings with low friction such as ball bearings and roller bearings cannot be used in the rotating part of the head block due to the mounting space, and there is no choice but to adopt a sliding bearing structure. As a result, when attempting rotational positioning at high speed, the resistance of the sliding part increased and there were cases where it could not rotate correctly.

Further, a valve is inserted inside the central axis of the mounting head, and the valve is turned on and off by a driving device that moves a certain amount up and down from the machine side (device body side). Dozens of mounting heads are used in one electronic component mounting device, and since the majority of the mounting heads were driven by the main unit side in the conventional device, the drive load on the main unit side increased and the speedup was hindered. At the same time, the cost of the entire device was being pressed.

In view of the above points, a first object of the present invention is to
An object of the present invention is to provide an electronic component mounting apparatus in which the mounting head is downsized and lightweight.

A second object of the present invention is to provide an electronic component mounting apparatus which can increase the mounting speed of electronic components.

Other objects and novel features of the present invention will be clarified in Examples described later.

[0009]

In order to achieve the above object, the first invention of the present application is to provide a plurality of mounting heads having suction nozzles for sucking electronic components at the peripheral portion of an index table that rotates intermittently. In the electronic component mounting apparatus, which moves the mounting head by rotating the index table intermittently, sucks and holds an electronic component from a predetermined supply device by a suction nozzle of the predetermined mounting head, and transfers and mounts the electronic component on a substrate. Is a mounting head main body which is movable up and down with respect to the index table and which is rotated by a rotation center axis parallel to the intermittent rotation center axis of the index table and positioned at a plurality of positions, and is held by a lower end portion of the mounting head body. At the two or more positions corresponding to the plurality of positions on the concentric circle of the rotation center axis at the lower end. A plurality of types of suction nozzles that are rotatably and vertically movable with respect to the head main body, and a selection unit that holds the suction nozzles in an upper non-selected state or a lower selected state are provided. One of the suction nozzles is in a selected state in which the downward protrusion length is large and the other suction nozzles are in a non-selected state, and the mounting head main body and the suction nozzle included in a predetermined mounting head are lowered.
The suction nozzle in the selected state sucks and holds the electronic component, moves up, moves around, and lowers the mounting head body and the suction nozzle included in the predetermined mounting head, and the suction nozzle in the selected state moves the electronic component to the substrate. It is configured to be attached to.

According to the second invention of the present application, a plurality of mounting heads each having a suction nozzle for sucking an electronic component are provided at a peripheral portion of an index table that rotates intermittently, and the mounting head stops with the intermittent rotation of the index table. Among the stations corresponding to the positions, a supply device for supplying electronic components is arranged at a plurality of supply device arrangement stations corresponding to the suction positions of the suction nozzles, and the mounting head is circulated by intermittent rotation of the index table. In the electronic component mounting apparatus that moves, suctions and holds the electronic component from the predetermined supply device by the suction nozzle of the predetermined mounting head, transfers it to the mounting station, and mounts it on the substrate, the mounting head moves up and down with respect to the index table. Freely and with a rotation center axis parallel to the intermittent rotation center axis of the index table The mounting head main body positioned at a plurality of rolling positions, and at least two or more corresponding to the plurality of positions on the concentric circle of the rotation center axis held at the lower end of the mounting head main body. A plurality of types of the suction nozzles that are rotatably and vertically movable with respect to the mounting head main body, and a selection unit that holds the suction nozzles in a non-selected state in the upper direction or a selected state in the lower position. In the supply device placement station, the supply device is arranged corresponding to a plurality of suction positions of the suction nozzles in a selected state determined by the rotation operation of the mounting head main body included in the mounting head, and a plurality of types of the suction devices are provided. Any one of the nozzles is set to a selected state in which the downward protruding length is large and the other suction nozzles are set to a non-selected state, and the index table is intermittently rotated to Among the mounting heads, a predetermined mounting head is positioned at a predetermined supply device arranging station, and the suction nozzle in the selected state selects a predetermined supply device arranged at the station by the rotation operation of the mounting head main body of the predetermined mounting head. The mounting head body and the suction nozzle are lowered, and the suction nozzle in the selected state sucks and holds the electronic component to move up, and moves around, and the mounting head body and the suction nozzle included in the predetermined mounting head are lowered. The electronic component is mounted on the substrate by the suction nozzle in the selected state.

In the first or second aspect of the invention, the mounting head slides in the mounting head main body to open and close an air suction path communicating with the one suction nozzle in the selected state. The valve may be a valve body and an opening / closing drive means for the valve.

Further, the mounting head main body is positioned for each angle obtained by dividing one rotation by a predetermined number, and at least two of the positions for each angle divided by the predetermined number on the concentric circle are set. The suction nozzle may be provided at the position.

Further, one end of a spring for urging the suction nozzle downward may be in contact with a spring bearing member supported by a rolling bearing with respect to the mounting head body side.

The mounting head may have a structure in which the mounting head main body is rotatably supported by a rolling bearing with respect to a mounting head housing portion fixed to the index table.

The mounting heads may be arranged on a concentric circle of the intermittent rotation center axis of the index table and arranged at equal angular intervals.

[0016]

In the electronic component mounting apparatus of the present invention, the mounting head is provided with a mounting head main body which is vertically movable with respect to the index table and which is positioned at a plurality of rotational positions.
It has a plurality of types of suction nozzles held at the lower end of the mounting head body, and one suction nozzle selected by the selection means projects downward by a predetermined length from the remaining non-selected suction nozzles. , The mounting head body is lowered and the selected suction nozzle vacuum suctions and raises the electronic components from the supply device, the electronic components are transferred by intermittent rotation of the index table, and the mounting head body is lowered again. Mounting electronic components on the board. In either case, since the non-selected suction nozzle is in a position retracted upward, the presence of the non-selected suction nozzle does not interfere with the extraction of the electronic component from the supply device or the mounting of the electronic component on the substrate. Then, by changing the type of the suction nozzle selected by the selection means, components of various shapes and sizes can be suction-held and mounted on the substrate.

Further, as a structure for holding a plurality of types of suction nozzles at the lower end of the mounting head body, it is not necessary to provide an elevating shaft for holding the suction nozzles at the lower end for each suction nozzle, and the head block is penetrated. With no configuration, the mounting head can be made smaller (smaller diameter) and lighter in weight. Therefore, as in the case of the mounting head having only one suction nozzle, a large number can be arranged on the outer edge portion of the index table. This is extremely effective in the case of a sequence type component mounting apparatus in which the supply device is radially fixed around the index table, and the mounting head picks up and transfers the components in the mounting order from the supply device. Further, since the mounting head is light in weight, it is also advantageous in raising and lowering the mounting head main body and speeding up the rotating operation.

Further, among the stations corresponding to the position where the mounting head is stopped due to the intermittent rotation of the index table, a plurality of supply device arranging stations are determined by the rotating operation of the mounting head main body included in the mounting head. When the supply device is arranged corresponding to a plurality of suction positions of the suction nozzles in the selected state, a plurality of supply devices can be arranged for each one of the supply device arrangement stations, and any one of them can be arranged. Can be selected by the suction nozzle in the selected state. As a result, the number of feeders can be significantly increased or the number of stations (the number of mounting heads) can be significantly reduced compared to the case where one feeder is arranged in one station which has been commonly used. Also, the same number of supply devices as the conventional one can be supported.

Further, a valve in which the mounting head opens and closes an air suction path communicating with the one suction nozzle in the selected state by a sliding valve body sliding in the mounting head body; When further provided with the opening and closing drive means of,
Since the operation is performed by using the descending stroke of the mounting head body, it is not necessary to provide valve opening / closing drive means on the machine side (the machine body side other than the mechanism mounted on the index table), and the machine side The operating unit is simplified, the driving load is reduced, and the speed of the entire electronic component mounting apparatus is increased.

Further, the mounting head main body is positioned for each angle obtained by dividing one rotation by a predetermined number, and at least two of the positions for each angle divided by the predetermined number on the concentric circle are set. By providing the suction nozzle at the position, the position of the suction nozzle can be changed by the intermittent rotation operation of the mounting head main body at a constant angle, and the positioning of the suction nozzle can be performed accurately and easily.

When one end of a spring for urging the suction nozzle downward is in contact with a spring bearing member supported by a rolling bearing with respect to the mounting head body side,
The torsional stress of the spring generated when the suction nozzle is rotated can be released by utilizing the low friction function of the rolling bearing that supports the spring receiving member. As a result, the suction nozzle can be positioned in the rotation direction with high accuracy.

When the mounting head has a structure in which the mounting head main body is rotatably supported by a rolling bearing with respect to the mounting head housing portion fixed to the index table, friction at high speed rotation can be reduced, The mounting head body can be rotated at a high speed for positioning. Therefore, when the mounted head body is positioned at high speed, as in the case of using the plain bearing in the conventional head block, the problem that the frictional resistance of the sliding portion increases and the correct rotation cannot be achieved is eliminated.

When the mounting head is located on the concentric circles of the intermittent rotation center axis of the index table and arranged at equal angular intervals, the mounting head is stopped at the position where the index table rotates intermittently. Corresponding stations are also located at equal angular intervals on the concentric circles of the intermittent rotation center axis of the index table, which facilitates the arrangement of the supply device and the like and the arrangement of various mechanisms on the machine side.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings.

1 to 8 show a mounting head which is a main component of an embodiment of the present invention and a mechanical portion around the mounting head,
FIG. 9 shows the overall configuration of the embodiment.

First, the overall construction of the embodiment will be described with reference to FIG. In this figure, 1 is a base, 2 is an XY table installed on the base, and 3 is a printed circuit board mounted and fixed on the XY table. A disk-shaped index table 5 is supported by the base 1 and the body frame 4 integrated with the base 1 so as to be intermittently rotatable in a horizontal plane. A plurality of mounting heads 10 are mounted on the periphery of the disk-shaped index table 5 on the concentric circles of the intermittent rotation center axis at equal angular intervals. In the present embodiment, two types of three types of suction nozzles having a large diameter, a medium diameter, and a small diameter are selected and attached to each mounting head 10.

FIG. 10 shows an example of an arrangement of the mounting head 10 having two kinds of suction nozzles 11 out of suction nozzles of large diameter, medium diameter and small diameter, and the circumference of the index table 5 is divided into 48. 10 mounting heads at 7.5 degree intervals
Are provided (a total of 48 are provided). In this case, 48 stations corresponding to the position where the mounting head 10 stops due to the intermittent rotation of the index table 5 (every 7.5 degrees) can be set around the index table 5, and the first station S1 can be set. Is a position where a chip-shaped electronic component (capacitor, resistor, inductor, IC, etc.) is mounted on the printed circuit board, that is, a mounting station. The sixteenth to thirty-fifth stations S16 to S35 are places where the electronic components are adsorbed and taken in from the supply device 6 that supplies the chip-shaped electronic components, and are stations for arranging the supply devices. The description of the other stations will be given later. As the supply device 6, for example, a supply unit such as a tape feeder that uses a tape-shaped electronic component put in a tape recess and taped can be used. It is assumed that the index table 5 in FIG. 10 intermittently rotates clockwise (direction of arrow F).

Further, as will be described in detail later, the mounting head main body, which is a portion for rotating and ascending and descending the mounting head 10, rotates about a rotation center axis parallel to the intermittent rotation center axis of the index table 5, and one rotation is predetermined. Positioning is performed for each angle divided by the number, and the suction nozzles 11 are provided at two positions among the positions for each angle divided by the predetermined number on the concentric circle of the rotation center axis of the mounting head body. There is. However, in this embodiment, the mounting head main body has a positioning stop position for every 90 degrees obtained by dividing one rotation into four, and the two kinds of suction nozzles 11 are provided at 180-degree intervals.

1 to 8 showing the mounting head 10 and the mechanical parts around it, the housing 12 of the mounting head 10 is directly fixed to the index table 5.
Ball bearings (or roller bearings, etc.) 13, 1 as rolling bearings are provided for the housing portion 12.
The mounting head main body 20 is rotatably attached via 4 so as to have a rotation center axis parallel to the intermittent rotation center axis of the index table 5.

As shown in FIG. 1, the mounting head body 2
Reference numeral 0 indicates a hollow rotary shaft 21 rotatably supported by ball bearings 13 and 14 housed and fixed above and below the mounting hole 12a of the housing 12, and a central hole 2 of the hollow rotary shaft 21.
2, a hollow elevating center shaft 23 slidably inserted in the elevating direction, and a nozzle guide bracket 24 connected and fixed to the lower end of the elevating center shaft 23. The hollow rotary shaft 21 is supported so as to be rotatable with respect to the housing portion 12 but does not move in the vertical direction, and the hollow rotary shaft 21 is provided above the hollow rotary shaft 21 on the machine side (a mechanism mounted on the index table). A gear 25, which meshes with a gear of an external drive means installed on the other side of the apparatus) and receives a rotational driving force, is fixedly integrated.

FIG. 2 shows a rotary positioning means for positioning the hollow rotary shaft 21 at a position where one rotation of the hollow rotary shaft 21 is equally divided. A positioning bush 26, which forms a positioning recess, is fixed to the large-diameter portion 21a above the hollow rotary shaft 21 at a position where one revolution (360 degrees) of the outer peripheral surface thereof is divided into four. Further, the housing portion 12 has a positioning lever 27
The intermediate portion of is positioned by a pin 28, and a positioning pin 29 for fitting and locking the positioning bush 26 is fixed to the tip of the positioning lever 27. A compression spring 30 is arranged between the rear portion of the positioning lever 27 and the housing portion 12, and biases the positioning pin 29 in a direction to be fitted into the positioning bush 26. Further, at the rear end of the positioning lever 27, a roller that receives an external operation force for releasing the engagement between the positioning pin 29 and the positioning bush 26 against the force of the compression spring 30 from the operation means on the machine side. 31 is pivotally attached.

Therefore, since the positioning pin 29 is normally fitted to the positioning bush 26, the hollow rotary shaft 21 is positioned at predetermined positions at 90-degree intervals obtained by dividing the entire circumference of the large diameter portion 21a into four parts. Although it maintains a fixed position, when the hollow rotary shaft 21 is rotated, the positioning lever 27
The rear end roller 31 is pushed to release the fitting between the positioning pin 29 and the positioning bush 26, and the gear 25 fixed to the upper portion of the hollow rotary shaft 21 is rotated by an external drive means as shown in FIG. Rotate by an integer multiple of the angle) and eliminate the external operation force to the roller 31, and re-fit the positioning pin 29 into the positioning bush 26 for positioning.

As shown in FIGS. 1 and 3, the hollow rotary shaft 2
Elevating center shaft 2 penetrating through the center hole 22 of 1
An elevating ring 40 that receives the elevating drive force from the machine side is fixedly integrated with the upper part of the unit 3. The vertical groove 41 of the elevating ring 40 is vertically fixed to the upper end surface of the hollow rotary shaft 21. The rotation transmission bar 42 is fitted. A ball plunger (a mechanism in which a steel ball is biased by a spring in a projecting direction) 43 is attached to one inner side surface of the vertical groove 41, and the rotation transmission bar 42 is provided on the other side of the ball plunger 43 and the vertical groove 41. It is sandwiched between the inner side surface and the vertical center shaft 2 without play in the circumferential direction (rotational direction).
The rotation of the hollow rotary shaft 21 is transmitted to the shaft 3. Further, a compression spring 44 is provided between the lower surface side of the lifting ring 40 and the upper surface side of the hollow rotary shaft 21 to constantly urge the lifting center shaft 23 upward.

An engaging groove 45 is formed on the outer peripheral surface of the elevating ring 40 in the circumferential direction of the elevating hammer solenoid 46 which is supported by the body frame 4 side in FIG. The solenoid pin 47 can be engaged. That is, by exciting the lifting hammer solenoid 46 at the raised position of the lifting center shaft 23, the solenoid pin 47 is projected as shown by the phantom line in FIG.
5 and then, in this state, the lifting hammer solenoid 4
When the whole 6 descends, the elevating center shaft 23 can be driven downward. When the lifting hammer solenoid 46 is de-energized at the lowered position of the lifting center shaft 23, the solenoid pin 47 is retracted and disengaged from the engaging groove 45, and the elastic force of the compression spring 44 causes the lifting center shaft 23 to move. Returns to the raised position. A mechanism having such an ascending / descending hammer solenoid 46 constitutes an ascending / descending driving means for the ascending / descending center shaft 23.

As shown in FIGS. 1 and 4 to 7, two nozzle holders 51 are attached and fixed to the nozzle guide bracket 24 integrally fixed to the lower end of the elevating center shaft 23. Different diameters (different types)
The suction nozzles 11 are held slidably in the vertical and rotational directions, respectively. That is, a ball bearing (or roller bearing, etc.) 52 as a rolling bearing is fixed to the upper part of the center hole 51a of the nozzle holder 51, and the inside of the ball bearing 52 slides below the intermediate flange 50a of the suction nozzle 11. It fits freely,
Moreover, it is rotatable with the inner ring of the ball bearing 52. The intermediate flange 50a defines the lowering position of the suction nozzle 11, and an engaging projection 53 and a friction wheel 54 are formed on the entire circumference of the suction nozzle 11 above the intermediate flange 50a. The outer peripheral surface of the friction wheel 54 is, for example, knurled. Also,
A hole 56 is formed in the upper part of the nozzle guide bracket 24,
A ball bearing (or roller bearing, etc.) 55 as a rolling bearing is fixed to the inside of the lower portion of the hole 56, and the inside of the ball bearing 55 is suction nozzle 11.
The thin-walled cylindrical portion 50b at the upper end of is fitted so as to be able to move up and down. Further, a ball bearing (or a roller bearing, etc.) as a rolling bearing is provided inside the upper portion of the hole 56.
A spring bearing member 58 is rotatably attached via 57. At the center of the lower surface of the spring receiving member 58, a spring guide rod 59 having a diameter smaller than the inner diameter of the thin cylindrical portion 50b.
Is stuck. Then, the central hole 6 of the suction nozzle 11
A compression spring 62 for urging the suction nozzle 11 downward is disposed between a closing member (a set screw screwed in the inner circumference of the center hole) 61 provided at a position closer to the upper part of 0 and the spring receiving member 58. ing. The lower portion of the compression spring 62 is inserted into the portion of the central hole 60 above the closing member 61, and the upper portion of the compression spring 62 is fitted onto the outer periphery of the spring guide rod 59 and is guided so as not to come off.

The arrangement of the two kinds of suction nozzles 11 with respect to the elevating center shaft 23 corresponds to the positioning stop position for every 90 degrees, which is obtained by dividing one rotation of the mounting head body 20 into four. That is, they are arranged at two predetermined positions at 90 ° intervals (here, two positions at 180 ° intervals), which is obtained by dividing the circumference concentric with the elevating center axis 23 into four.

6 and 7 show selection means for holding the two types of suction nozzles 11 of each mounting head 10 in a non-selected or selected state. In these drawings, a latch (locking claw) 70 is pivotally attached to the nozzle holder 51 by a pin 71, and an extension spring 72 between the latch 70 and the nozzle holder 51 causes the tip of the latch 70 to come into pressure contact with the suction nozzle 11. It is biased in the direction. Further, a lock release pin 73 that abuts on the lower end of the latch 70 is provided on the nozzle holder 51 so as to partly protrude from the lower end surface of the nozzle holder 51 so as to be vertically movable (but not to drop). .

Then, as shown in FIG. 6, when the engagement protrusion 53 on the suction nozzle 11 side and the latch 70 are disengaged, the suction nozzle 11 is moved to the nozzle holder 51 by the elastic force of the compression spring 62. The selected state is projected downward from the lower end surface by a predetermined length. Further, by pushing up the tip (lower end) of the suction nozzle 11 by the nozzle returning means on the machine side, as shown in FIG.
The tip of the latch 70 engages with the lower surface of the engaging convex portion 53, and the suction nozzle 11 can be pulled up to the non-selected state. Further, by pushing up the lower end portion of the latch 70 corresponding to the suction nozzle 11 to be selected by the nozzle selecting means on the machine side through the locking release pin 73, the latch 70 rotates counterclockwise, and the engaging convex portion 53. 6 is disengaged and the suction nozzle 11 enters the selected state shown in FIG.

The suction nozzle 11 in the selected state shown in FIGS. 1 and 6.
For this, a rotational force can be applied by using a friction wheel 54 integrally provided on the suction nozzle 11. That is, as shown by the two-dot chain line in FIGS. 1 and 6, the external rubber roller 80 on the machine side is brought into pressure contact with the friction wheel 54,
The friction between the friction wheel 54 and the external rubber roller 80 transmits the rotation of the external rubber roller 80 to the friction wheel 54, and the suction nozzle 11 can be rotated by a predetermined angle.

As shown in FIG. 1, the center hole 60 of the suction nozzle 11 is open at the tip surface (lower end surface), and the closing member 6 is formed.
At 1, the upper part of the center hole 60 is closed. However, a spiral spring-shaped filter 91 is provided in the center hole 60 that serves as a vacuum suction path below the closing member 61. This filter 91 is provided in order to prevent the chip-like electronic component 100 sucked and held by the lower end surface of the suction nozzle 11 as shown by phantom lines from being broken or broken into the vacuum suction path. It is provided.

The inside of the center hole 60 communicates with a vacuum suction annular recess 92 on the outer periphery of the suction nozzle 11 through a hole in the radial direction, and when the suction nozzle 11 is in a selected state of projecting downward, a vacuum is generated. The suction annular recess 92 is further communicated with a vacuum suction passage 93 that opens to the outer peripheral surface of the nozzle holder 51. In the non-selected state of the suction nozzle 11, the vacuum suction annular recess 92 and the vacuum suction passage 93 are displaced from each other in height, so that both are blocked.

Vacuum suction passage 93 on the nozzle holder 51 side
The vacuum suction path 94 connected to the nozzle guide bracket 2
4 is formed. The opening / closing valve (mechanical valve) 110 of the vacuum suction path is provided in the inner peripheral hole 11 of the lifting center shaft 23.
1, an opening / closing operation rod 113 having a sliding valve body 112 that slides in the vertical direction with respect to 1, a vacuum suction annular recess 114 formed in the upper portion of the sliding valve body 112, and a sliding valve body 11
2 has an annular recess 115 for vacuum suction formed in the lower part of the inner peripheral hole 111 so as to surround 2. The vacuum suction annular recess 115 communicates with a vacuum suction passage 94 formed in the nozzle guide bracket 24. Open / close operation rod 11
A seal member 116 is provided between the lower end of the nozzle 3 and the nozzle guide bracket 24 to hermetically seal the two. The seal member 116 is an opening / closing operation rod 113.
It also has a function of maintaining the open / close state of the opening / closing operation rod 113 due to friction between and.

The vacuum suction annular recess 114 on the sliding valve body 112 side communicates with the vacuum suction annular recess 117 on the outer peripheral surface of the elevating center shaft 23 through a hole in the elevating center shaft 23 in the radial direction. The ring-shaped concave portion 117 is further provided with a vacuum suction passage 119 of the housing portion 12 and the index table 5 (a distal end portion thereof surrounds the hollow rotary shaft 21 in an annular shape) through a radial hole 118 of the hollow rotary shaft 21, and a vacuum. The vacuum suction path 120 is connected to the suction path 120, and the vacuum suction path 120 is connected to a negative pressure source such as an external vacuum pump (however, the suction nozzle 11 is lifted after the electronic component is placed on the printed board. When returning to the position, and when ejecting defective electronic components, a positive pressure source may be connected instead of a negative pressure source.). Further, annular grooves 121 and 122 are formed on the inner peripheral surface of the mounting hole 12a of the housing portion 12 above and below the hole 118 and the vacuum suction passage 119, and the housing portion 12 and the hollow rotation are formed in the annular grooves 121 and 122. Axis 21
Sealing members 123 for hermetically sealing the space between and are provided.

As shown in FIGS. 1 and 8, the lifting ring 4
0 integrally has an extension portion 40a extending upward, and the valve operating lever 130 has a pin 1 attached to the extension portion 40a.
It is pivoted at 31. In the state shown in FIG. 1, the opening / closing operation rod 113 is pushed up from below by a valve returning means (not shown) on the machine side to a raised position, and the sliding valve body 112 of the opening / closing valve 110 has a vacuum suction annular recess 114 and a vacuum suction. The vacuum suction path is turned off by blocking the gap with the suction annular recess 115.

The operation of turning on the vacuum suction path of the opening / closing valve 110 is performed by lowering the lifting center shaft 23 after the valve operating lever 130 comes into contact with the upper end of the upper protrusion 42a of the rotation transmission bar 42. This is performed by pushing down the opening / closing operation rod 113 with the valve operation lever 130 as shown in FIG. That is, the valve operating lever 130 contacts the upper end of the upper protruding portion 42a of the rotation transmitting bar 42 and then rotates counterclockwise to push down the opening / closing operating rod 113. As a result, the sliding valve body 112 is lowered, and the vacuum suction annular recess 114 and the vacuum suction annular recess 115 communicate with each other to form a vacuum suction path from the suction nozzle 11 to the vacuum suction passage 120. The electronic component 100 can be adsorbed at its tip.

The upper protrusion 42 of the rotation transmission bar 42
By changing the position where the valve operating lever 130 is in contact with the upper protruding portion 42a by adjusting the length of a or the like, it is possible to change the timing at which vacuum suction is applied during the lowering process of the elevating central shaft 23.

Further, the opening / closing valve 110 can be returned to the OFF state by pushing up the lower end of the opening / closing operation rod 113 by the valve returning means on the machine side.

As described above, the 16th through 35th portions in FIG.
The thirteenth stations S16 to S35 are the feeder arrangement stations in which the feeder 6 is arranged.
At the seventh supply device selection station S37, the mounting head main body 20, which is the rotating portion of the mounting head 10, is rotated clockwise or counterclockwise. This rotating operation is performed by engaging the gear 25 of the mounting head main body 20 with the gear of the external driving means on the machine side.

As described above, the mounting head main body 20 rotates every 90 degrees (rotates in the horizontal plane) on the rotation center axis parallel to the intermittent rotation axis of the index table 5, and as a result, each mounting head 10 is selected. The suction nozzles 11 have suction positions at a plurality of locations in FIG. 11 (three locations a, b, c at 90-degree intervals in this embodiment), and the suction positions in FIG. 12 are associated with these suction locations. Thus, the supply devices 6 can be arranged radially toward the outside of the index table (in these figures, three supply devices 6 are arranged for one station). 9 mounting head body 20
By rotating every 0 degrees, the feeding devices 6 at three locations a, b, and c
It is possible to suction and hold (pick up) a predetermined electronic component with the suction nozzle 11 from the component supply position of the supply device 6 by selecting any one of the above.

Next, the overall operation of the embodiment will be described.

The mounting head 10 which has mounted the chip-shaped electronic component 100 on the printed circuit board at the first mounting station S1 in FIG. 10 has a disk-shaped index with the lifting center shaft 23 returned to the raised position. As the table 5 is intermittently rotated in the direction of arrow F by 7.5 degrees, the 48th station S48 and the like are sequentially passed to reach the 40th station S40. At this station S40, the position of each suction nozzle 11 is detected, and a positive pressure is supplied to the suction nozzle 11 in the selected state instead of a negative pressure to discharge the defective electronic component (the defective electronic component is mounted on the printed board. Without performing the above, it is adsorbed and held up to this station S40).

In the station S39, the lower end of each of the suction nozzles 11 is pushed up by the nozzle returning means on the machine side to return all of the suction nozzles 11 to the non-selected state of FIG.

At the station S38, the chip-shaped electronic component 10 to be picked up, which is instructed by the mounting program, is to be picked up.
A suction nozzle 11 that matches 0 is selected. That is, by pushing up the lock release pin 73 corresponding to the suction nozzle 11 to be selected by the nozzle selection means on the machine side, the desired suction nozzle 11 is brought into the selected state in which it is projected downward as shown in FIG. At that time, the state in which the desired suction nozzle 11 is projected downward is detected and confirmed by the suction nozzle detection means on the main body side.

In the supply device selection station S37, which of the supply devices 6 at the positions a, b and c is arranged as shown in FIG. 12 to correspond to each of the subsequent stations S16 to S35 and which electronic component should be taken in? The opening / closing valve 110 is rotated by a necessary amount according to a mounting program for instructing the opening / closing valve 110, and the opening / closing valve 110 of the opening / closing valve 110 is pushed up from below by the valve returning means on the main body side of the opening / closing valve 110. The vacuum suction path is returned to the off state. When the mounting head body 20 does not need to rotate, the opening / closing valve 110 is only returned to the vacuum suction path OFF state.

At the station S36, the suction nozzle position detecting means on the machine side determines whether or not the suction nozzle 11 in the selected state is arranged so that the electronic components of the supply device 6 designated by the mounting program can be selected and taken in. The rotation position detection hole provided in the gear 25 is detected and confirmed.

As described above, the supply devices 6 are fixedly arranged at the supply device arranging stations S16 to S35 at the three maximum positions a, b and c as shown in FIG. 12 (of the index table 5). Radially arranged on the outer peripheral side.). For example, if the supply device 6 is a tape feeder using taping of chip-shaped electronic components, the positions a, b, and c are the electronic component supply positions (component pickup positions by the suction nozzle 11) of the respective supply devices 6. Then, when the suction nozzle 11 in the selected state arrives and is positioned on the predetermined supply device 6 of the predetermined station due to the intermittent rotation of the index table 5, the lifting center shaft 2 is moved.
3 is lowered by the operation of the hammer solenoid 46 for raising and lowering on the side of this machine, and the suction nozzle 11 is lowered accordingly.
To suck the electronic component (during the downward movement of the elevating center shaft 23, the suction suction of the suction nozzle 11 is turned on so that the electronic component is sucked). At the same time, the suction nozzle in the non-selected state also descends, but it does not interfere because it does not project downward. After that, the electronic components are picked up from the supply device 6 and held by the suction nozzle 11 by the return of the elevating center shaft 23 and the suction nozzle 11 to the raised position. That is, even if the elevating center shaft 23 returns to the raised position, the opening / closing operation rod 113 of the opening / closing valve 110 is held in the lowered state by the friction of the seal member 116, so that the suction by the suction nozzle 11 is continued.

At the station S15, the position of the suction nozzle 11 in the selected state is directly detected by the suction nozzle detecting means. Then, at the station S14, the origin of the suction nozzle 11 holding the electronic component is returned. That is,
Necessary rotation of the mounting head body 20 is performed so that the suction nozzle 11 in the selected state is located at the outermost position of the index table 5. Further, at the station S13, it is confirmed by the suction nozzle position detection means that the origin return of the suction nozzle 11 has been correctly performed. The mounting head body 20
Since the hollow rotary shaft 21 is supported by the ball bearings 13 and 14 having low friction with respect to the housing portion 12, the rotation can be smoothly performed at high speed.

At the station S12, the suction nozzle 11 in the selected state holding the electronic component by suction is rotated so that the electronic component 100 is instructed to be mounted on the printed circuit board according to the mounting program. Turn only at an angle. The rotation of the suction nozzle 11 is as shown in FIG.
Further, as shown in FIG. 6, the external rubber roller 80 on the machine side is pressed against the friction wheel 54 integrally formed on the upper part of the suction nozzle 11 and the rotation of the rubber roller 80 is transmitted to the friction wheel 54. .

At the station S11, the electronic component sucked and held by the suction nozzle 11 is imaged by the camera, the captured image of the electronic component is image-processed by the image processing means, and the electronic component designated by the mounting program is mounted on the printed circuit board. According to the difference between the posture and the suction posture of the electronic component recognized by the image processing, the correction turning of a minute angle is performed in the station S10 as in the case of the station S12 using the external rubber roller 80.

The rotation of the suction nozzle 11 in the stations S10 and S12 is such that the suction nozzle 11 is rotatably supported by the nozzle holder 51 and the nozzle guide bracket 24 by the ball bearings 52 and 55 having low friction, and the spring receiving member. Since 58 is also rotatably supported by the nozzle guide bracket 24 by the low-friction ball bearing 57, the operation is extremely smooth, and a torsion force is accumulated in the compression spring 62 that urges the suction nozzle 11 downward. The suction nozzle 11 does not rotate incorrectly.

Thereafter, along with the intermittent rotation operation of the index table 5, the electronic component 10 on the XY table 2 in FIG.
The suction nozzle 11 arrives at the station S1 for mounting 0. Then, at this station S1, the raising / lowering center shaft 23 is driven downward by the raising / lowering hammer solenoid 46 on the main body side, and the suction nozzle 11 sucking the electronic component is also lowered accordingly, and the electronic component is mounted on the printed circuit board 3. Place. An adhesive is usually applied in advance to the component mounting position on the printed circuit board, and the electronic component can be mounted on the printed circuit board 3 by the mounting operation of the electronic component by lowering the suction nozzle 11. When the suction nozzle 11 returns to the raised position, a positive pressure is supplied to the suction nozzle 11 instead of a negative pressure so that the electronic component is reliably separated from the suction nozzle 11. The electronic component mounting position on the printed circuit board 3 is determined by moving the printed circuit board 3 with the XY table 2.

According to this embodiment, the following effects can be obtained.

(1) The mounting head 10 has the mounting head main body 20 as a portion that rotates and moves up and down, but only the lifting center shaft 23 penetrates the housing portion 12 of the mounting head 10 and moves up and down. , The suction nozzle 1 around the lower part of the raising / lowering center shaft 23 integrally with the raising / lowering center shaft 23.
1 is arranged in a plural number, and each suction nozzle 11 itself is configured to be rotatable and move up and down with respect to the mounting head body 20. As a result, the mounting head 10 as a whole can be made smaller, smaller in diameter, and lighter in weight, and the weight can be reduced by about 60% as compared with the conventional device (Japanese Patent Laid-Open No. 3-18100) in which an elevating shaft is provided for each suction nozzle. It is possible to Therefore, the intermittent rotation of the index table 5 is increased, and the mounting head main body 2
It is possible to increase or decrease the speed of 0 and speed up the rotation operation.

(2) At the lower end of the mounting head main body 20, that is, at the lower end of the elevating center shaft 23, a plurality of types of suction nozzles 1 are provided.
The structure for holding 1 eliminates the need to provide an elevating shaft for holding the suction nozzle at the lower end for each suction nozzle, and the mounting head main body 20 can be composed of the hollow rotary shaft 21 and the mechanical portion inside thereof, It can have a small diameter. Therefore, as in the case of the mounting head having only one suction nozzle, a large number can be arranged on the outer edge portion of the index table 5. This is extremely effective in the case of a sequence type component mounting device in which the supply device 6 is radially fixed around the index table 5 and the mounting head picks up and transfers the components in the mounting order from the supply device 6. Furthermore, since the mounting head body 20 has a small diameter,
The hollow rotating shaft 21, which is an outer rotating portion of the mounting head body 20, can be rotatably supported by the ball bearings 13 and 14 having low friction with respect to the housing portion 12, and the mounting head body 20 can rotate at high speed. Therefore, when the head block is positioned at a high speed such as when using a slide bearing, there is no problem that the frictional resistance of the sliding portion increases and the head block cannot rotate properly.

(3) The mounting head 10 has a plurality of types of suction nozzles 11 held by the lower end of the mounting head main body 20 which can be moved up and down with respect to the index table 5 and can be rotated by the selection means (latch). 70, locking release pin 73
One suction nozzle 11 selected by the mechanism including the above) protrudes downward by a predetermined length from the remaining non-selected suction nozzles, and the chip-shaped electronic component from the supply device 6 is selected by the selected suction nozzle. It is possible to perform suction of 100, transfer of electronic components accompanying intermittent rotation of the index table 5, and mounting of electronic components on the printed circuit board 3. Since the non-selected suction nozzles are in a position retracted upward, they all descend simultaneously with the mounting head main body 20, but the presence of the non-selected suction nozzles causes the electronic components to be taken out from the supply device 6 or the electronic components to the substrate 3. It does not interfere with wearing. By changing the type of the suction nozzle to be selected, electronic components having various shapes and sizes can be suction-held and mounted on the substrate.

(4) The intermediate portion of the suction nozzle 11 is a low-friction ball bearing 52, and the upper portion of the suction nozzle 11 is rotatably supported by the nozzle holder 51 and the nozzle guide bracket 24 by a low-friction ball bearing 55. And a compression spring 6 for urging the suction nozzle 11 downward.
Since the spring bearing member 58 with which 2 abuts is also rotatable by the ball bearing 57 having low friction, the suction nozzle 11
The rotation can be surely executed, and the torsion force is not accumulated in the compression spring 62, and the turning of a small angle can be executed accurately. Moreover, the suction nozzle 11 held at the lower end of the mounting head body 20 may be swung or corrected to swivel, and the object is lightweight and swung reliably at high speed.

(5) The mounting head 10 opens and closes the air suction path communicating with the one suction nozzle 11 in the selected state by the sliding valve body 112 sliding in the mounting head body 20. Since the opening / closing valve 110 and the opening / closing driving means for the valve (the valve operating lever 130 and the mechanical portion associated therewith) are built-in, the mounting head main body 20 is operated by utilizing the descending stroke. There is no need to provide valve opening / closing drive means on the machine side (device main body side other than the mechanism mounted on the index table), the machine side operating unit is simplified, the drive load is reduced, and the entire electronic component mounting device is installed. The speed of can be improved.

(6) The mounting head body 20 is positioned at each angle obtained by dividing one rotation by a predetermined number (four in this embodiment), and is concentric with the rotation center of the mounting head body 20. By providing the suction nozzles 11 at two or more positions among the positions for each angle divided by the predetermined number, the suction nozzles 11 can be moved by the intermittent rotation operation of the mounting head main body 20 at a constant angle. The position can be changed, and the positioning of the suction nozzle 11 can be accurately and easily performed.

(7) The positional relationship of the suction nozzles 11 can be changed by rotating the mounting head main body 20 by a predetermined angle, and a plurality (for example, three) for each one of the supply device arrangement stations.
It is possible to arrange the feeding devices 6 of 1 to select one of the feeding devices. As a result, the number of supply devices can be increased up to 3 times as compared with the case where one supply device is arranged in one station which is generally used in the past, or the number of stations (the number of mounting heads) is increased by one. Even if it is / 3, the same number of supply devices as the conventional one can be supported.

It is possible to arrange a maximum of three feeders in all the feeder placement stations, but in actual use, one or two feeders can be placed in one feeder placement station.
In some cases, only one feeder may be arranged.

Further, in the above embodiment, the case where the selected suction nozzle has three suction positions by the rotation of the mounting head main body 20 has been described, but it should have two or four suction positions. Is also possible.

The mounting head body 20 is the hollow rotary shaft 2
Although the gear 25 is integrated with 1 to receive the rotational force from the machine side, other transmission means such as a friction wheel may be used.

Further, the suction nozzle provided on the mounting head main body 20 is selected from among two kinds of large diameter, medium diameter and small diameter, but any two kinds out of four or more kinds of suction nozzles are selected. It is also possible to select and to provide the mounting head main body 20. Further, the suction surface of the suction nozzle is not limited to a cylindrical shape, but may be a square shape or the like.

Although the embodiment of the present invention has been described above, it is obvious to those skilled in the art that the present invention is not limited to this and various modifications and changes can be made within the scope of the claims. Let's do it.

[0075]

As described above, according to the electronic component mounting apparatus of the present invention, a plurality of mounting heads having suction nozzles for sucking electronic components are provided on the peripheral edge of the index table which rotates intermittently, and the index is provided. When the mounting head is circulated by intermittent rotation of the table, the suction nozzle of the predetermined mounting head sucks and holds the electronic component from the predetermined supply device, and the electronic component is transferred and mounted on the substrate, the mounting head uses the index A mounting head body that can be raised and lowered with respect to the table and that is rotated at a rotation center axis parallel to the intermittent rotation center axis of the index table and is positioned at a plurality of positions, and the lower end portion that is held by the lower end portion of the mounting head body. On the mounting head main body at at least two or more positions corresponding to the plurality of positions on the concentric circle of the rotation center axis in Since a plurality of types of suction nozzles that are rotatably and vertically movable are provided, and a selection unit that holds the suction nozzles in a non-selected state in which the suction nozzles are upward or in a state that is selected in a lower direction, a plurality of types of suction nozzles are provided. One of the suction nozzles is set to a selected state with a large downward projection length,
The other suction nozzles are in the non-selected state, and the mounting head body and the suction nozzles of the predetermined mounting head are lowered, and the suction nozzles in the selected state suck and hold the electronic components to move them up and move in a circle. It is possible to lower the mounting head main body and the suction nozzle included in the head, and mount the electronic component on the substrate by the suction nozzle in the selected state. In this case, since the suction nozzle in the non-selected state is at the position retracted upward, the presence of the non-selection suction nozzle does not interfere with the extraction of the electronic component from the supply device or the mounting of the electronic component on the substrate. By changing the type of the suction nozzle to be selected, components of various shapes and sizes can be suction-held and mounted on the substrate.

Further, as a structure for holding a plurality of types of suction nozzles at the lower end of the mounting head body, there is no need to provide an elevating shaft for holding the suction nozzles at the lower end for each suction nozzle, and the mounting head is made smaller. (Thinner) and lighter weight. Therefore, as in the case of the mounting head having only one suction nozzle, a large number can be arranged on the outer edge portion of the index table. Further, since the mounting head is light in weight, it is also advantageous in raising and lowering the mounting head main body and speeding up the rotating operation.

Since the mounting head main body has a small diameter, it is possible to mount it on the index table side with a low-friction rolling bearing, which is also an advantage in increasing the speed of rotation of the mounting head main body. . In addition, the suction nozzle itself is lightweight and small in size, and swirling can be reliably performed at high speed.

[Brief description of drawings]

FIG. 1 is a partial front sectional view showing an embodiment of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a plan sectional view showing a rotary positioning means portion of a hollow rotary shaft of the mounting head body in the embodiment.

FIG. 3 is a side view showing the upper configuration of the mounting head in the embodiment.

FIG. 4 is a front view showing the lower structure of the mounting head in the embodiment.

FIG. 5 is a bottom view of the same.

FIG. 6 is a side sectional view showing a suction nozzle and a selection means for the suction nozzle in a suction nozzle selection state.

FIG. 7 is a side sectional view showing a state where the suction nozzle is not selected.

FIG. 8 is a partial cross-sectional view showing a mechanism portion for opening / closing an opening / closing valve incorporated in the mounting head.

FIG. 9 is a front view with a partial cross section showing the overall configuration of the embodiment.

FIG. 10 is an explanatory diagram showing a mounting head arrangement and a station arrangement with respect to the index table in the embodiment.

FIG. 11 is an explanatory diagram showing positions at which a supply device can be arranged in each station.

FIG. 12 is an explanatory diagram showing a case where three supply devices are arranged in one station.

[Explanation of symbols]

 1 Base 2 XY Table 3 Printed Circuit Board 4 Body Frame 5 Index Table 6 Supply Device 10 Mounting Head 11 Adsorption Nozzle 12 Housing 13, 13, 52, 55, 57 Ball Bearing 20 Mounting Head Main Body 21 Hollow Rotation Shaft 23 Vertical Center Shaft 24 Nozzle Guide Bracket 25 Gear 26 Positioning Bush 27 Positioning Lever 29 Positioning Pin 30, 44, 62 Compression Spring 31 Roller 40 Lifting Ring 41 Vertical Groove 42 Rotation Transmission Bar 42a Top Projection 43 Ball Plunger 45 Engagement Groove 46 Lifting Hammer Solenoid 51 Nozzle holder 53 Engagement convex part 54 Friction wheel 58 Spring receiving member 70 Latch 73 Lock release pin 80 External rubber roller 91 Filter 92, 114, 115, 117 Vacuum suction annular concave part 93, 9 , 119, 120 vacuum line 100 electronic component 110 on-off valve 112 sliding valve member 113 opening and closing rod 130 valve control lever S1 mounting station S16 to S35 feeder placement station

Claims (7)

[Claims] 1. A plurality of mounting heads each having a suction nozzle for sucking an electronic component are provided at a peripheral portion of an index table that rotates intermittently, and the mounting heads are orbitally moved by the intermittent rotation of the index table, and a predetermined mounting head is provided. The suction nozzle holds and sucks electronic components from a specified supply device.
In the electronic component mounting apparatus for transferring and mounting on a substrate, the mounting head is movable up and down with respect to the index table and rotates at a rotation center axis parallel to the intermittent rotation center axis of the index table and is positioned at a plurality of positions. And a mounting head main body that is held by the lower end of the mounting head main body and is located on the concentric circle of the rotation center axis at the lower end of the mounting head main body at at least two or more positions corresponding to the plurality of positions. A plurality of types of the suction nozzles, which are rotatably and vertically movable with respect to each other, and selection means for holding the suction nozzles in a non-selected state in which the suction nozzles are upwardly selected or in a state in which the suction nozzles are selected downward. One of them is set to the selected state with a large downward projection length, and the other suction nozzles are set to the non-selected state, and the mounting head provided in the predetermined mounting head is set. The main body and the suction nozzle are lowered, and the suction nozzle in the selected state sucks and holds the electronic component to move up, and the circuit moves around, and the mounting head body and the suction nozzle included in the predetermined mounting head are lowered to suction the selected state. An electronic component mounting apparatus, wherein the electronic component is mounted on the substrate with a nozzle. 2. A station corresponding to a position where a plurality of mounting heads each having a suction nozzle for sucking an electronic component are provided at a peripheral portion of an index table that rotates intermittently, and the mounting head stops at the intermittent rotation of the index table. A supply device for supplying electronic components is arranged at a plurality of supply device arrangement stations corresponding to the suction positions of the suction nozzles, and the mounting head is circulated by intermittent rotation of the index table to perform a predetermined mounting. In an electronic component mounting device that suctions and holds an electronic component from a predetermined supply device by a suction nozzle of the head, transfers the electronic component to a mounting station, and mounts it on a substrate, the mounting head is movable up and down with respect to the index table and the index table. It rotates on a rotation center axis parallel to the intermittent rotation center axis and moves at multiple positions. The mounting head main body to be determined, and the mounting head held at the lower end of the mounting head main body at at least two or more positions corresponding to the plurality of positions on the concentric circle of the rotation center axis at the lower end. A plurality of types of the suction nozzles that are rotatably and vertically movable with respect to the main body, and a selection means that holds the suction nozzles in a non-selected state in which the suction nozzles are upwardly selected or a state in which the suction nozzles are selected downwards are provided. In the station, the supply device is arranged corresponding to a plurality of suction positions of the suction nozzles in a selected state which is determined by the rotation operation of the mounting head main body included in the mounting head, and any one of the plurality of suction nozzles is provided. One of the mounting heads is set to a predetermined state by intermittent rotation of the index table with each of the suction nozzles in a selected state with a large downward projection length and the other suction nozzles in a non-selected state. The mounting head is positioned at a predetermined supply device arranging station, and the predetermined supplying device arranged at the station is selected by the suction nozzle in the selected state by the rotation operation of the mounting head main body provided in the predetermined mounting head, and the mounting head main body and The suction nozzle is lowered, the suction nozzle in the selected state suctions and holds the electronic component, and the electronic component is moved up and moved, and the mounting head main body and the suction nozzle of the predetermined mounting head are lowered to lower the suction nozzle in the selected state. And mounting the electronic component on the substrate. 3. A valve in which the mounting head opens and closes an air suction path communicating with the one suction nozzle in the selected state by a sliding valve body sliding in the mounting head body, and the valve. Opening and closing drive means of the
Or the electronic component mounting device according to 2. 4. The mounting head main body is positioned for each angle obtained by dividing one rotation by a predetermined number, and two or more of the positions for each angle divided by the predetermined number on the concentric circle are set. The suction nozzle is provided at a position.
The electronic component mounting device according to 2 or 3. 5. An end of a spring for urging the suction nozzle downward is in contact with a spring bearing member supported by a rolling bearing with respect to the mounting head body side.
Alternatively, the electronic component mounting device according to item 4. 6. The mounting head comprises a mounting head housing, which is fixed to the index table, and the mounting head main body being rotatably supported by rolling bearings. Electronic component mounting device described. 7. The mounting heads are arranged on a concentric circle of the intermittent rotation center axis of the index table and arranged at equal angular intervals.
5. The electronic component mounting device according to 5 or 6.