JPH11298196A - Fitting method and equipment of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To judge possibility of generation of imperfect fitting and decide whether fitting operation is acceptable by detecting a lower surface position of an electronic component in the ascending state of a chucking nozzle, and making the electronic component possible to be fitted on a printed board when a chucking hold attitude is correctable. SOLUTION: At a chucking nozzle position 21a, a chucking nozzle 21 which does not chuck an electronic component 14 descends and is in contact with the upper surface 13 of a board. At a chucking nozzle position 21c, the nozzle 21 chucking and holding the component 14 descends, and the component 14 is in contact with the upper surface 13 of the board. The nozzle 21 at an accurate ascending position descends a stroke 15 and is in a state of the position 21a. The nozzle 21 chucks and holds the electronic component 14, decends toward the upper surface 13 of the board and is in a state of the position 21c. An ascent fitting head body and the nozzle 21 chuck and hold the component 14, and imperfect fitting can be prevented as far as a chucking nozzle position 21b. Since a light is shielded by the held component 14, a detecting signal of an off state is outputted by the positional relation ship of the position 21b and the optical axis of optical sensors 11, 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and apparatus for mounting a chip-shaped electronic component on a substrate, while the electronic component is held by a mounting head and transferred onto the substrate. In addition, the present invention relates to an improvement in an electronic component mounting method and apparatus which optically recognizes the planar position or posture of the electronic component and controls the position, and relates to the planar position or posture of the electronic component. In addition, the present invention relates to a technique for providing a means for detecting a height direction to prevent a mounting failure when mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art Conventionally, Japanese Unexamined Patent Publication No.
In Japanese Patent No. 222895, a plurality of mounting heads each having a suction nozzle for sucking an electronic component are provided on a peripheral portion of an index table that rotates intermittently, and the mounting head is circulated by the intermittent rotation of the index table. In an electronic component mounting apparatus that sucks and holds an electronic component from a predetermined supply device by a suction nozzle, transfers the electronic component, and mounts the electronic component on a substrate, the mounting head is capable of moving up and down with respect to the index table and intermittent rotation center axis of the index table A mounting head body which is rotated at a plurality of positions by rotating about a rotation center axis parallel to the mounting head body, and is rotatably and vertically movable with respect to the mounting head body at at least two or more positions with respect to the mounting head body. And holding the suction nozzles in an upward non-selection state or a downward selection state. Selecting means for selecting one of a plurality of types of the suction nozzles into a selected state having a large downward protruding length, and setting the other suction nozzles to a non-selected state, thereby setting a mounting head included in a predetermined mounting head. The main body and the suction nozzle are lowered, the electronic component is suctioned and held by the suction nozzle in the selected state, the electronic component is moved upward, orbits, and the mounting head body and the suction nozzle of the predetermined mounting head are lowered to suck the selected state. A configuration is disclosed in which the electronic component is mounted on the substrate with a nozzle.

[0003]

In the electronic component mounting apparatus described above, while the electronic component is being sucked and held by the suction nozzle and orbitally moved, the electronic component thus sucked and held is pressed from below by C.
The control device determines whether the size and posture of the electronic component is a predetermined size stored in advance in the image processing unit or whether the posture held by suction is correctable, based on a result of the image captured by the CD camera. There is provided a means for determining whether or not to perform the operation of mounting the sucked electronic component on the substrate based on the result. However, even if the size and posture of the electronic component can be determined with this means, the height of the electronic component can be determined. Position cannot be determined.Therefore, the suction nozzle holds the electronic component in a selected state in which the downward protruding length is large with respect to the mounting head main body, and the suction nozzle is fixed with respect to the mounting head main body. The dimensions are pushed downward by a compression spring,
When picking up and holding electronic components from a given supply device,
The suction nozzle is pushed back into the mounting head body when a force to push up from below is applied to the suction nozzle.
When the mounting head body rises, the suction nozzle returns to its original lower position.However, when the predetermined size of the suction nozzle that is moving around while holding the electronic component has not returned downward, the mounting head body and the suction nozzle are lowered. When mounting the electronic component sucked and held by the suction nozzle on the substrate, a distance is generated between the bottom surface of the electronic component and the substrate, and a mounting failure in which the electronic component is not mounted on the substrate occurs. The object of the present invention is a simple configuration, in which the mounting head main body is raised, the height position of the electronic component sucked and held by the suction nozzle is detected, and the mounting head main body and the suction nozzle are lowered to mount the electronic component on the substrate. It is an object of the present invention to provide a method and apparatus for determining in advance whether a mounting failure will not occur and determining whether to perform a mounting operation.

[0004]

In order to achieve the above object, according to the first aspect of the present invention, the suction nozzle for sucking and holding an electronic component is lifted in a state where the suction nozzle is raised. Whether the lower surface position of the electronic component to be held is at a predetermined height position is detected or not detected, whether the electronic component to be sucked and held by the suction nozzle is imaged from below and has a predetermined size, and whether or not the suction nozzle is held by suction. The electronic component to be picked up is imaged from below, and it is determined whether or not the suction holding posture is in a range that can be corrected, and it is detected that the electronic component is at a predetermined height position. The electronic component mounting method is characterized in that the electronic component to be sucked and held is mounted on the printed circuit board when the electronic component is determined to be within the range, and the electronic component to be sucked and held is not mounted on the printed circuit board. According to a second aspect of the present invention, there is provided a mounting head which circulates at a predetermined height position from a supply device arrangement station to an electronic component mounting station on a printed circuit board and back to a supply device arrangement station, and moves up and down at the mounting head. A mounting head body, a suction nozzle urged downward from a nozzle holder provided in the mounting head body and protruding to a predetermined position and slidable upward, and the suction nozzle circulates from a supply device arrangement station to an electronic component mounting station. An optical sensor that is provided in the middle and is urged downward from a nozzle holder provided in the mounting head main body and that detects light blocking of the suction nozzle that protrudes to a predetermined position, and an electronic component that suctions and holds the suction nozzle is imaged from below. Means to
A control device for determining a mounting operation of the mounting head, wherein whether the lower surface position of the electronic component to be suction-held by the suction nozzle is at a predetermined height position is detected or not detected by an optical sensor; The electronic component to be picked up is imaged from below by a means for imaging the electronic component, and whether or not the electronic component to be sucked and held by the suction nozzle is in a range where the electronic component to be sucked and held is imaged from below and the suction holding posture can be corrected. The control device determines whether or not the electronic component to be sucked and held on the printed circuit board is determined to be at a predetermined height position, and is determined to be of a predetermined size and the posture held by suction is within a range that can be corrected. The electronic component mounting device is characterized in that the electronic component to be sucked and held is not mounted on the printed circuit board.

[0005]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component mounting method and apparatus according to an embodiment of the present invention.
FIG. 6 shows an outline of an entire electronic component mounting apparatus as an object to which the present invention is applied. As an example, 1 is an index table, 2 is a mounting head, 3 is an XY table, and 3 is an XY table. A substrate mounting portion 5 for positioning and fixing the substrate is provided. An XY moving portion including the substrate mounting portion 5 is movable in the XY directions with respect to the main body gantry 4. The printed circuit board sent from the previous process, which is a board unloading conveyer, is taken in from the board unloading conveyer 6 and is conveyed. Both sides are supported and transported by the placing section 5 and fixed at a predetermined position. Reference numeral 8 denotes a component supply unit having a plurality of electronic component supply devices. A plurality of mounting heads 2 are mounted at equal intervals on the periphery of the index table 1, and each of the mounting heads 2 is rotated by rotation of the index table 1.
The electronic components are circulated from the component supply unit 8 for picking up the electronic components to the component supply unit 8 again via the XY table 3 for fixing the printed circuit board on which the electronic components are mounted to the board mounting unit 5. 9 is an operation panel. The mounting head main body 20 and the suction nozzle 21 of the mounting head 2 are respectively movable up and down with respect to the index table 1, and the rotation of the index table 1 causes the mounting head main body 20 and the suction nozzle 21 of the predetermined mounting head 2 to move to a predetermined position. When the suction nozzle 21 is in a selected state in which the length of the protrusion protruding downward from the mounting head main body 20 is large, the predetermined electronic component is sucked and held. With the rotation of the index table 1, the mounting head 2 holding each predetermined electronic component
One after another, the mounting work position on the XY table 3 is reached. The board mounting portion 5 of the XY table 3 on which the printed circuit board is mounted moves in the XY directions, and the position on the printed circuit board surface where a predetermined electronic component is to be mounted is positioned at the mounting operation position.
Mounting head body 20 of mounting head 2 holding electronic components
The suction nozzle 21 moves up and down at the mounting operation position to mount the electronic component on the printed circuit board surface. The electronic component is held by an adhesive previously applied to the printed circuit board surface. The printed circuit board on which all the predetermined electronic components are mounted is sent out by the board unloading conveyer 7 and sent to a subsequent process.

FIG. 5 is a layout view of a main part of the electronic component mounting apparatus shown in FIG.
The index table 1 is intermittently rotated clockwise (in the direction of arrow F), but the index table 1 is omitted in the layout drawing, and the orthogonal center line is provided. (Dotted line) The point of intersection of 1a and 1b indicates the center of rotation. In this case, forty-eight stations corresponding to the positions where the mounting heads 2 stop due to the intermittent rotation of the index table 1 can be defined around the index table 1, and the first station S1 is a chip-shaped electronic component ( This is a position where a capacitor, a resistor, an inductor, an IC, etc.) are mounted on a printed circuit board, that is, a mounting station. The sixteenth to thirty-fifth stations S16 to S35 are where the electronic components are sucked and taken in from the supply device that supplies the chip-shaped electronic components, and are the supply device placement stations. At the 37th supply device selection station S37 before that, the rotation of the mounting head main body 20, which is the rotating portion of the mounting head 2, is performed clockwise or counterclockwise. This rotation operation is performed by meshing the gear 25 of the main unit 20 with the external drive means on the gear 25 shown in FIG.

As described above, the mounting head body 20 rotates by 90 degrees (rotates in the horizontal plane) about the rotation center axis parallel to the intermittent rotation axis of the index table 1, and as a result, each mounting head 2 is selected. The suction nozzle 21 has a plurality of suction positions in one supply device disposition station, and the component supply unit 8 stores the supply device in the index table 1 in accordance with the plurality of suction positions.
Can be arranged radially outward. For example, by rotating the mounting head body 20 every 90 degrees, one of three supply devices can be selected, and a predetermined electronic component can be sucked and held (picked up) by the suction nozzle 21 from the component supply position of the feed device.

In the station S12, the control device rotates the suction nozzle 21 in the selected state for sucking and holding the electronic component so that the electronic component is mounted on the printed circuit board in accordance with the mounting program. Turn by the required angle. The rotation of the suction nozzle 21
This is performed by bringing an external rubber roller on the main unit side into pressure contact with a friction wheel 54 shown in FIG. 4 integrally formed above the suction nozzle 21, and transmitting the rotation of the rubber roller to the friction wheel 54. At the station S11, the electronic component sucked and held by the suction nozzle 21 is imaged by a CCD camera, and a captured image of the electronic component is image-processed by image processing means. In accordance with a difference between the electronic component and the suction holding posture of the electronic component recognized by the image processing, the control device performs a correction rotation of a small angle at station S10. This station S10 is different from station S12 using an external rubber roller. It has a similar configuration.

Along with the intermittent rotation operation of the index table 1, a predetermined suction nozzle 21 is attached to a station S1 for mounting electronic components on a printed board fixed to the board mounting portion 5 of the XY table 3 in FIG. Arrives. At this station S1, the mounting head body 20 is driven downward by the solenoid pins 47 of the lifting / lowering hammer solenoid 46 shown in FIG. Place electronic components on

FIG. 4 is a cross-sectional view mainly showing the mounting head 2 and its peripheral mechanical parts.
The housing part 30 of the mounting head 2 is directly fixed to
The mounting head body 20 is rotatably attached to the housing 30 via bearings 33 and 34 so as to have a rotation axis parallel to the intermittent rotation axis of the index table 1. The mounting head body 20 includes a hollow rotary shaft 31 rotatably supported by bearings 33 and 34 fitted to the housing portion 30, and a central hole 2 of the hollow rotary shaft 31.
2 has a hollow elevating center shaft 23 slidably inserted in the elevating direction, and a nozzle guide bracket 24 connected and fixed to the lower end of the elevating center shaft 23. The hollow rotary shaft 31 is rotatable with respect to the housing part 30 but is supported so as not to move in the vertical direction. Above the hollow rotary shaft 31, the main unit side (mounted on the index table 1). A gear 25 that receives a rotational driving force by meshing with a gear of an external driving means installed on the apparatus main body (other than the mechanism) is fixedly integrated.

As shown in FIG. 4, an elevating ring 40 for receiving an elevating driving force from the machine is fixedly integrated above the elevating central shaft 23, and a concave groove 41 of the elevating ring 40 is provided.
A rotation transmission shaft 42 vertically fixed to the upper end of the hollow rotation shaft 31 is fitted. The rotation transmitting shaft 42 has the concave groove 4
The rotation of the hollow rotary shaft 31 is transmitted to the lifting center shaft 23 in a state where there is no play in the circumferential direction (rotation direction) by engaging with the shaft 1. In addition, a compression spring 44 is provided between the lower end surface of the elevating ring 40 and the upper end side of the hollow rotary shaft 31, and constantly urges the elevating central shaft 23 upward. An engagement groove 45 is formed on the outer peripheral surface of the elevating ring 40 in the circumferential direction. When the elevating solenoid 46 that is periodically moved up and down on the machine side is excited, the solenoid pin 47 protrudes (as indicated by a virtual line). ) The engaging and lowering of the entire lifting solenoid 46 allows the lifting center shaft 23 to be driven downward. When the excitation of the lifting solenoid 46 is released at the lowered position of the lifting center shaft 23, the solenoid pin 47 is retracted and disengaged from the engagement groove 45, and the lifting center shaft 23 is moved by the elastic force of the compression spring 44. Return to the ascending position.

A nozzle holder 51 is fixed to a nozzle guide bracket 24 fixedly integrated with a lower end portion of a lifting center shaft 23, and the suction nozzle 21 is slidably held in the vertical and rotational directions. A bearing 52 is fixed to the upper part of the center hole of the bearing 51. A portion of the inside of the bearing 52 below the intermediate flange 50a of the suction nozzle 21 is slidably fitted and rotatable together with the inner ring of the bearing 52. I have. The intermediate flange 50 a defines the lowering position of the suction nozzle 21, and is provided at a portion above the intermediate flange 50 a of the suction nozzle 21 over the entire circumference.
And a friction wheel 54 are formed. The outer peripheral surface of the friction wheel 54 is, for example, knurled. A hole 56 is formed in the upper part of the nozzle bracket 24, and a bearing 55 is fixed inside the lower part of the hole 56.
A cylindrical portion 50b at the upper end of the suction nozzle 21 is fitted to the inside of the nozzle 5 so as to be able to move up and down. Further, a spring receiving member 58 is rotatably attached to the upper inside of the hole 56 via a bearing 57. At the center of the lower surface of the spring receiving member 58, a spring guide rod 59 having a diameter smaller than the inner diameter of the cylindrical portion 50b is fixed. A compression spring 62 for urging the suction nozzle 21 downward is provided between the closing member 61 provided in the center hole 60 of the suction nozzle 21 and the spring receiving member 58. The lower portion of the compression spring 62 enters a portion of the center hole 60 above the closing member 61, and the upper portion of the compression spring 62 is guided by the outer periphery of the spring guide rod 59 so as not to come off. Although not shown, the nozzle holder 51 has a selection means for holding the suction nozzle 21 in a non-selected or selected state. The suction nozzle 21 shown in FIG. The suction nozzle 21 which is always pushed downward at 62 slides up and down inside the bearing 52, but in the selected state, the intermediate flange 50a of the suction nozzle 21 is received at the upper end of the bearing 52 and pushed down to the lowermost end. I have.

FIG. 1 is a diagram for explaining a main structure of the present invention. FIGS. 4 to 6 show an example of an electronic component mounting apparatus to which the present invention is applied. 1 are given the same reference numerals and only the components necessary for the description are simply emphasized. Therefore, FIG. 1 is an explanatory view schematically showing the necessary parts of the electronic component mounting apparatus shown in FIGS. is there. First, the suction nozzle 21 in a selected state in which the index table 1, the mounting head 2, and the electronic component are not suction-held and the mounting head body 20 is in an up state is shown.
Optical sensor 1 capable of detecting the lower end of suction nozzle 21 in this state
Optical sensor 11 provided with stations 1 and 12 at station S13
Is a light emitting side, and the optical sensor 12 constitutes a set of optical sensors on the light receiving side, and the optical sensors 11 and 12 are fixed to the main body base 4 side by supporting means (not shown). The detection signal output side of the optical sensor 12 is electronic. The light from the optical sensor 11 to the optical sensor 12, which is connected to the control device of the component mounting apparatus, is located at a position indicated by a dashed line as the optical axis 10. And the optical sensors 11 and 12 are fixed such that the optical axis 10 is orthogonal to the direction in which the mounting head body 20 moves up and down.
When the position 2 is raised, the optical axis 10 is blocked from the lower end of the suction nozzle 21 at the upper side, and the optical sensor 12 outputs a detection signal indicating an off state in which a predetermined amount of light has not reached to the control device.

First, the positions of the optical sensors 11 and 12 are set with respect to the suction nozzle 21 at an accurate ascending position. The positions of the optical sensors 11 and 12 are lowered, and a predetermined amount of light reaches the optical sensor 12. When the position of the optical sensors 11 and 12 is raised from the state where the detection signal indicating the ON state is output, the optical axis 10 is blocked from the lower end of the suction nozzle 21, and the optical sensor 12 eventually becomes the OFF state where the predetermined amount of light does not reach. The optical sensors 11 and 12 are further raised by 0.1 mm from this height position to output a detection signal indicating the detection signal, and are fixed to the main body gantry 4 side for position setting. As another position setting method, an optical sensor 11, 1 that can obtain a detection signal corresponding to the amount of light reaching the optical sensor 12 in the detection range of the optical sensor 11, 12
2, the height of the optical sensors 11 and 12 is fixed to the main body base 4 at a predetermined position, and the optical sensor 12 corresponding to the amount of light partially blocked by the suction nozzle 21 at the accurate ascending position. From the detection signal of FIG.
Optical sensor 12 according to the amount of light blocked when it is relatively low
Can be used as a reference.

Next, the overall operation of the main structure of the present invention will be described with reference to FIGS. 1 to 3. FIG.
In addition to the configurations 1 and 12, the configurations of different stations are simultaneously shown on the same figure to compare and explain the positional relationship. That is, the upper surface 13 of the printed circuit board fixed to the substrate mounting portion 5 in the station S1 is described. The suction nozzle positions 21a, 21b, and 21c are shown for convenience of description when the lifting position of the suction nozzle 21 is different, and the electronic components that the suction nozzle 21 suctions and holds are shown as the electronic components 14, and other symbols are described. Shown in the process.

At the suction nozzle position 21a, the suction nozzle 21 which does not hold the electronic component 14 by suction moves down and
3, the suction nozzle position 21c is a state in which the suction nozzle 21 holding the electronic component 14 by suction moves down and the electronic component 14 contacts the substrate upper surface 13. The width of the double-headed arrow 15 is the mounting head body 20 and the suction nozzle 21.
Indicates that the suction nozzle 21 at the accurate ascending position is in the state of the suction nozzle position 21a when the stroke 15 is lowered. The suction nozzle 21 not holding the electronic component by suction is placed on the upper surface 13 of the substrate. Although it is meaningless to lower the mounting position of the electronic component 14 when the electronic component 14 is sucked down and the suction nozzle 21 is lowered toward the upper surface 13 of the substrate, the suction nozzle position 21c is reached. Is lowered, the suction nozzle 21 presses and compresses the compression spring 62 while the nozzle holder 51
Since the thickness of the electronic component 14 is absorbed by the compression spring 62, the suction nozzle 21 holding the electronic component 14 by suction is lowered toward the substrate upper surface 13 so that the electronic component 14 comes into contact with the substrate upper surface 13. If the mounting head main body 20 and the suction nozzle 21 which are raised can suck and hold the electronic component 14 to prevent the mounting failure up to the suction nozzle position 21b, the suction nozzle position 21b and the optical sensor 11 can be prevented. The positional relationship between the optical axes 10, 12 is such that the light is blocked by the electronic component 14 held by suction,
If the detection signal indicating the OFF state in which the predetermined light amount does not reach is output, it can be determined that the mounting is not defective. Therefore, in a state where the mounting head body 20 and the suction nozzle 21 are raised, the optical sensor 12 If a detection signal indicating an OFF state in which the light amount does not reach is output, it is determined that the mounting does not result in a mounting failure. In the mounting determination table shown in FIG. If a detection signal indicating the state is output, it is expressed as detection,
If a predetermined amount of light reaches the optical sensor 12 and a detection signal indicating the ON state is output, it is expressed as non-detection.

On the other hand, in order to prevent the conventional mounting failure, the electronic component 14 sucked and held by the suction nozzle 21 is picked up by the CCD camera at the station S11, and the picked-up image of the electronic component 14 is processed by the image processing means. Then, it is determined whether or not the size of the electronic component 14 is a predetermined size stored in advance in the image processing means from the imaging result, and it is determined whether or not the posture held by suction is in a correctable range. In the mounting determination table shown in FIG. 3, as the component recognition result, the electronic component 14 is recognized as a predetermined size from the imaging result, and when it is determined that the posture held and held by the electronic component 14 is within the correctable range, the electronic component 14 is expressed as normal. Reference numeral 14 denotes an abnormality if the predetermined size is not determined or the correction of the posture held and held is not determined or both are not determined.

FIG. 2 is a flow chart for explaining the operation according to the present invention.
In S35 to S35, when the predetermined mounting head 2 specified by the mounting program reaches the predetermined supply device, the mounting head 2
The operation of raising and lowering the mounting head body 20 and the suction nozzle 21 to suction and hold a predetermined electronic component 14 is "loading of mounted component". The mounting head 2 is detected in height by the optical sensors 11 and 12 in the station S13. The operation performed is “detection of height of suction nozzle or mounted component”, FIG.
No. in the mounting determination table of No. indicates the determination of the height detection result. 1 to N
o. Next, the mounting head 2 picks up an image of the electronic component 14 suctioned and held by the suction nozzle 21 (or may not hold it at all) in the station S11 with a CCD camera in the station S11. The operation to judge the suction and holding posture is "mounted component recognition"
In the mounting determination table shown in FIG.
o. 1 to No. This is the operation shown in FIG.
By the time the mounting head 2 reaches the station S1 where the electronic component 14 is mounted on the upper surface 13 of the substrate, the mounting head 2
The control device determines whether or not to perform the mounting operation. This is a determination described as “mounting operation” in the mounting determination table of FIG. 3, and is determined by a combination of the above-described height detection result and component recognition result. In particular, it is possible to judge the present invention as N0.3.

[0019]

As described above, according to the electronic component mounting method and apparatus of the present invention, the lower end of the suction nozzle or the lower surface of the electronic component held by suction is detected by the optical sensor while the suction nozzle is raised. The combination of height detection or non-detection and conventional imaging of electronic components using a CCD camera to determine whether the size or suction holding posture is normal or abnormal determines whether or not to perform the mounting operation. The height direction of the electronic component sucked and held by the suction nozzle is detected, and it is determined that the electronic component comes into contact with the upper surface of the printed circuit board, and the mounting operation can be performed. In the conventional imaging by a CCD camera for preventing a mounting failure at the time of mounting, for example, the suction nozzle 2 is used when suctioning and holding an electronic component from a supply device.
When the suction nozzle 21 is pushed back to the nozzle holder 51 and thereafter the suction nozzle 21 does not return to its original lower position even when the mounting head body 21 is raised, the electronic component held by the suction nozzle 21 with respect to the upper surface of the printed circuit board is held. When wearing
Even if the mounting head body 21 is lowered, there is a gap between the lower surface of the electronic component and the upper surface of the printed circuit board to prevent a phenomenon in which the electronic component is not mounted. can get.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a main configuration of the present invention.

FIG. 2 is a flowchart illustrating an operation according to the present invention.

FIG. 3 is a mounting determination table based on height detection and component recognition.

FIG. 4 is a cross-sectional view of a mounting head and peripheral mechanisms.

FIG. 5 is a layout view of a main part of the electronic component mounting apparatus.

FIG. 6 is a diagram showing an outline of the entire electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Index table 2 Mounting head 3 XY table 4 Main body base 5 Substrate mounting part 8 Component supply part 10 Optical axis 11, 12 Optical sensor 13 Substrate upper surface 14 Electronic component 20 Mounting head main body 21 Suction nozzle 21a, 21b, 21c Suction Nozzle position S1 Electronic component mounting station S10 Correction turning station S11 Electronic component imaging station S12 Electronic component turning station S13 Height position detection station S16 to S35 Supply device placement station S37 Supply device selection station

Claims (2)

[Claims] 1. A state in which a lower surface position of an electronic component to be sucked and held by the suction nozzle is detected or not detected in a state where the suction nozzle for sucking and holding the electronic component is raised. It is determined whether the electronic component to be sucked and held by the nozzle is imaged from below and has a predetermined size, and whether the electronic component to be sucked and held by the suction nozzle is imaged from below and whether or not the sucking and holding posture is within a correctable range. Then, the electronic component to be suction-held is mounted on the printed circuit board if the predetermined height position is detected and it is determined that the suction-holding posture is within the correctable range when the electronic component to be suction-held is in the predetermined size. A method for mounting an electronic component, wherein the electronic component is not mounted on a printed circuit board. 2. A mounting head that circulates at a predetermined height from a supply device disposition station to an electronic component mounting station on a printed circuit board and back to the supply device disposition station; a mounting head body that moves up and down at the mounting head;
A suction nozzle urged downward from a nozzle holder provided in the mounting head body and protruding to a predetermined position and slidable upward, and the suction nozzle is provided in the middle of circulation from a supply device arrangement station to an electronic component mounting station, An optical sensor for detecting light blocking of the suction nozzle protruded to a predetermined position by being urged downward from a nozzle holder provided in the mounting head body, a unit for imaging an electronic component of the suction nozzle to be held by suction, and mounting; A control device for judging a mounting operation of the head, wherein whether the lower surface position of the electronic component to be suction-held by the suction nozzle is a predetermined height position is detected or not detected by an optical sensor, and the suction nozzle is suction-held. A means for imaging the electronic component from below to determine whether the electronic component has a predetermined size or not, and a method for imaging the electronic component held by the suction nozzle by suction. The control device determines whether or not the suction holding posture is within a range that can be corrected by capturing an image from below, and detects that the suction holding position is a predetermined height position, and corrects the suction holding position in a predetermined size. An electronic component mounting apparatus characterized in that the electronic component to be sucked and held is mounted on a printed circuit board when it is determined that the electronic component is within a possible range, and the electronic component to be sucked and held is not mounted on the printed circuit board.