JPH1168394A - Method of mounting component, component mounting head, and component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of mounting component, a component mounting head, and a component mounting device without increasing cost and capable of improving a quality of mounting an electronic component to a substrate. SOLUTION: A ganged device 172 and a transferring device 173 for a second rotor controlling execution or non-execution of rotation about an axis are set on each spline shaft 110 and the rotation about an axis are controlled on every spline shaft. The attitude of component can be corrected on each spline shaft and the component can be accurately mounted to the substrate without any change in an attitude of the component, posture corrected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method which has a plurality of component holding members for holding, for example, electronic components and is executed when each of the held components is mounted on a circuit board. Component mounting head, for performing
And a component mounting apparatus provided with the component mounting head.

[0002]

2. Description of the Related Art As shown in FIG. 5, a conventionally used electronic component mounter 1 carries a circuit board 10 in and out.
And a board transport unit 2 for holding a circuit board when mounting components.
A reel-type electronic component supply device 3 or a tray-type electronic component supply device 4 containing electronic components to be mounted, and an electronic component held from at least one of the electronic component supply device 3 and the electronic component supply device 4. A component holding device 6 that can be moved in the X and Y directions by an XY robot 5 to be mounted on a mounting position on the substrate 10, and a component recognition camera that captures and measures the holding posture of the electronic component held by the component holding device 6. 7 is provided. Further, the component holding device 6 includes a head unit having a plurality of nozzles 8 that hold the electronic component 9 by, for example, sucking.

[0003] The head section will be described with reference to FIGS. 6 and 7. As shown in FIG.
Is roughly divided into a spline shaft 51 having a hollow shape for suction and a tip portion functioning as a nozzle 8, and a holding posture of an electronic component held by the nozzle 8 based on a measurement result by the component recognition camera 7. Therefore, a motor 61 as a drive unit for rotating the spline shaft 51 around its axis, an elevating device 64 for moving the spline shaft 51 along its axial direction for a component holding operation and a component mounting operation by suction. , A suction device 70. The head unit 50 thus configured operates as follows. The spline shaft 51 is lowered by the elevating device 64 at the component holding position in the component supply device 3 or the like, and the nozzle 8 sucks and holds the electronic component by the suction operation of the suction device 70. For the above holding posture correction,
The nozzle 8 holding the electronic component is rotated about its axis by a motor 61. After that, when the head unit 50 is placed on the mounting position of the circuit board by the XY robot 5, the spline shaft 51 holding the electronic component is lowered by the elevating device 64 to mount the electronic component at the mounting position. .

[0004] Such a conventional head section 50 will be described in more detail. A nut 54 is fitted to one end of the spline shaft 51, and a nut 66 is fitted to the other end of the spline shaft 51 so that the spline shaft 51 can slide in the axial direction. The nut 54 and the nut 66 rotate with the rotation of the spline shaft 51 around the axis. The nut 66 is rotatably supported on the base 58 of the head unit 50 via a bearing 65. A timing pulley 55 is attached to the nut 54, and the timing pulley 55 is rotatably supported by a base 58 of the head unit 50 via a bearing 56. A timing belt 59 is wound around the timing pulley 55 between the timing pulley 55 and a timing pulley 60 attached to an output shaft of a motor 61. Therefore, the spline shaft 51 can be rotated around its axis by the driving of the motor 61 via the timing pulley 60, the timing belt 59, the timing pulley 55, and the nut 54. A block 62 is fixed to the center of the spline shaft 51, so that the block 62 rotates with the rotation of the spline shaft 51 around the axis, and moves with the axial movement. A groove 68 is formed in such a block 62 along its circumferential direction.
The roller 63 is slidably engaged with the roller 63, and the elevating member 69 is engaged with the roller 63. Lifting member 6
9 is connected to an elevating device 64 for moving the spline shaft 51 in the axial direction. The elevating device 64 is attached to the base 58. Therefore, the lifting device 6
4 by driving the lifting member 69, the roller 63,
The spline shaft 51 is movable in the axial direction through the block 62 and the block 62.

Further, in order to improve the production efficiency, the head section 50 is provided with a plurality of nozzles 8 and, accordingly, a plurality of spline shafts 51 are provided accordingly. In the component supply device 3 and the like, the plurality of nozzles 8 may simultaneously hold the electronic components, but the plurality of electronic components are not simultaneously mounted on the circuit board. Therefore, the spline shafts 51 move up and down separately for mounting components. Further, in order to avoid interference between the mounted electronic component and the electronic component sucked by the nozzle 8, the rotation operation of the spline shaft 51 around the axis is performed with the spline shaft 51 raised. Therefore, the elevating device 64 is provided for each spline shaft 51, but only one rotation operation around the axis of the spline shaft 51 is provided for the plurality of spline shafts 51. That is, as shown in FIG. 7, the timing belt 59 is wound around both the timing pulley 55 of the spline shaft 51 and the timing pulley 72 of the spline shaft 71 not shown in FIG. Thus, both the spline shaft 51 and the spline shaft 71 are simultaneously rotated.

[0006]

As described above, a plurality of nozzles 8 are provided, and these nozzles 8 are connected to one motor 61.
In the case of the conventional head unit 50 configured to simultaneously rotate around the axis, the rotation for correcting the holding posture of each electronic component is performed when the electronic components are sucked by the plurality of nozzles 8. Is executed, but each time,
As a result, all the electronic components are rotated. That is, components other than the component for which the holding posture is corrected are simultaneously rotated. Therefore, each electronic component receives a rotational moment more than necessary. Note that the electronic component sucked by the nozzle 8 is held only by the frictional force with respect to the nozzle 8, and generally, there is a risk that the electronic component is shifted with respect to the nozzle 8 when rotated excessively. When the electronic component is displaced with respect to the nozzle 8, it causes a failure in mounting the electronic component on the board. On the other hand, if a rotation mechanism is provided for each spline shaft, the entire head unit 50 becomes large, and the number of expensive NC shafts increases unnecessarily, leading to an increase in cost. The present invention has been made in order to solve such problems, and it is possible to improve the mounting quality of electronic components on a board, and furthermore, a component mounting method that does not increase costs, a component mounting head, and An object is to provide a component mounting device.

[0007]

According to a first aspect of the present invention, there is provided a component mounting method comprising a component mounting head movable in two directions orthogonal to each other on a plane, each of which is independently movable in an axial direction. A component mounting method in which each of the component holding members sequentially holds the component with a plurality of component holding members, and then sequentially mounts the held component on an object to be mounted, wherein the component holding member holds the component. After that, each of the component holding members is independently rotated around the axis of the component holding member to rotate the held component, and mounts the held component on the object.

A component mounting head according to a second aspect of the present invention is a component mounting head movable in two directions perpendicular to each other on a plane, and a plurality of component holding members each independently movable in an axial direction. A component mounting head that sequentially holds components by the respective component holding members and sequentially mounts the components on the mounted body, and generates a driving force for rotating the component holding member around its axis. A rotation drive unit, provided on each of the component holding members, controls transmission of the driving force by the rotation drive unit to the component holding member, and enables rotation about the axis for each of the component holding members. An interlocking device.

A component mounting head according to a third aspect of the present invention mounts, on the component to be mounted, a component held by a component holding member rotatable around the axis of the component holding member by the interlocking device. In order to move the rotatable component holding member in the axial direction, a single moving device provided on the component mounting head may be further provided.

[0010] A component mounting apparatus according to a fourth aspect of the present invention is provided with the component mounting head according to the second aspect or the third aspect.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting method, a component mounting head, and a component mounting apparatus having the component mounting head according to one embodiment of the present invention will be described below with reference to the drawings. The component mounting method is executed by the component mounting head and the component mounting device. In each drawing, the same components are denoted by the same reference numerals. Further, in the present embodiment, electronic components are taken as examples of components to be handled, and a circuit board is taken as an example of a body to which the above components are mounted. However, the present invention is not limited to these. Further, as an embodiment which fulfills the function of “part holding member” described in the means for solving the above-mentioned problem, the following spline shaft 11 is used.
0 corresponds to this.

The electronic component mounting apparatus 100 of the present embodiment
As shown in FIG. 2, it has the same configuration as the electronic component mounter 1 shown in FIG. 5, and as shown in FIG. 2, the reel type electronic component supply device 3, the tray type electronic component supply device 4, the XY robot 5
And a component holding device 101 and a component recognition camera 7. In addition, each component other than the component holding device 101 is the same as that provided in the electronic component mounter 1, and the description is omitted. The component holding device 101 includes a component mounting head 105 illustrated in FIG. 1 having a plurality of nozzles 8 that hold the electronic component 9 by, for example, suction, similarly to the component holding device 6 described above. Has a configuration in which each of the plurality of nozzles 8 can be independently rotated around an axis. Such a component mounting head 10
5 will be described below. FIG. 1 shows only one of the nozzles 8.

As shown in FIG. 1, the component mounting head 105
Are roughly divided into a spline shaft 110 having a hollow shape for suction and having a tip portion functioning as the nozzle 8, and a spline shaft 110 provided on each of the spline shafts 110 for holding the component by suction and mounting the component on the board. One moving device 170 for moving the selected spline shaft 110 along its axial direction, and a spline for correcting the holding posture of the electronic component held by the nozzle 8 based on the measurement result by the component recognition camera 7. One rotation drive unit 17 for rotating the shaft 110 around its axis
1 and the spline shafts 110 provided on the respective spline shafts 110 and driven by the rotation drive unit 171.
Interlocking device 1 that controls the transmission of rotational force to each spline shaft 110 and enables rotation about each spline shaft 110
72, at least the moving device 170, the rotation driving unit 17
1 and a control device 18 for controlling the operation of the interlocking device 172
0. The basic operation of the component mounting head 105 configured as described above is as follows. That is, the moving device 170 is placed at the component holding position in the component supply device 3 or the like.
The spline shaft 110 is lowered, and the electronic component is sucked and held by the nozzle 8 by the suction operation of the suction device 70. Only the spline shaft 110 selected for the above-described holding posture correction is rotated around the axis by the interlocking device 172 and the rotation drive unit 171. When the component mounting head 105 is placed on the circuit board mounting position by the XY robot 5, the spline shaft 110 that is holding the electronic component is lowered by the moving device 170 and the nozzle 8
The electronic component held in is mounted at the mounting position.

The component mounting head 105 will be described in more detail. As described above, FIG. 1 shows only one spline shaft 110, and the following components are provided for each spline shaft 110 unless otherwise specified. A nut 112 is fitted to one end of the spline shaft 110, and a nut 140 is fitted to the other end of the spline shaft 110 so as to be slidable in the axial direction with respect to the spline shaft 110. The nut 112 and the nut 140 are connected to the spline shaft 11 in the direction around the spline shaft 110.
Rotates with 0. The nut 112 is rotatably supported on the base 116 of the component mounting head 105 via a bearing 113, and the nut 140 is
8 rotatably supported by the base 116. Therefore, the spline shaft 110 is connected to the component holding device 101.
It is attached to the base 116 of the component mounting head 105 provided therein so as to be rotatable around the axis and movable in the axial direction. In the present embodiment, the axial direction of the spline shaft 110 is oriented along the vertical direction, but the orientation direction of the spline shaft 110 is not limited to this.

The moving device 170 is disposed on the other end of the spline shaft 110 and has a base 116.
, A ball screw 133 driven by the motor 132 and extending along the axial direction of the spline shaft 110, and engaged with the ball screw 133 and driven by the motor 132 to drive the ball screw 133 in the axial direction. Along with a roller 136 rotatably mounted on the nut 134
And The roller 136 has a disk 137 described below.
The spline shaft 110 can be moved in the axial direction by driving the motor 132 as long as the contact is in contact. Further, as shown in FIG. 4, one moving device 170 is provided for a plurality of spline shafts 110. In the present embodiment, one is provided in the component holding device 101.

The spline shaft 110 has a first rotating member 126 and a nut 140 which will be described in detail later.
With the spline shaft 110 penetrating the disk 13
7 is fixed to the spline shaft 110. Therefore, the disk 137 moves and rotates with the movement of the spline shaft 110 in the axial direction and the rotation around the axis.
A spring 1 is provided concentrically with the spline shaft 110 between the disk 137 and the first rotating member 126.
39 are provided. As described later, the first rotating member 126
Is attached to the base 116 so as to be rotatable in its circumferential direction.
7, the spline shaft 110 is urged toward the nut 140 along the axial direction.

The rotation driving unit 171 is disposed at substantially the center of the spline shaft 110, and has a motor 131 mounted on the base 116, a timing pulley 130 mounted on an output shaft of the motor 131, and a spline shaft 110. A first rotating member 126 which is arranged concentrically and which is inserted into the spline shaft 110 in a non-contact state with the spline shaft 110;
30 and a timing belt 129 wrapped around the first rotating member 126. In the present embodiment, two spline shafts 110 are provided, and the motor 131
Is provided only for these two spline shafts 110. The first rotating member 126 is attached to the base 116 through a bearing 127 so as to be rotatable around the axis of each spline shaft 110. Therefore, the timing belt 129 is hung between the timing pulley 130 and the plurality of first rotating members 126, and all the first rotating members 126 rotate around the axis by the operation of the motor 131. Further, the first rotating member 126 has a concave first engaging portion 141 that meshes with a second engaging portion 114 formed on a second rotating member 121 described later.

The interlocking device 172 is disposed in proximity to the rotation driving unit 171, and engages and disengages the second rotating member 121 and the first rotating member 126 with the second rotating member 121. A moving device 173 for two rotation members is provided. The second rotating member 121 is a member arranged to face the first rotating member 126 and inserted through the spline shaft 110 concentrically with the spline shaft 110, for rotating the spline shaft 110 around its axis. The second rotating member 121 has a spline shaft 1
10 is fitted to a nut 120 fitted to the spline shaft 110 in a state where it can slide in the axial direction and cannot rotate around the axis. The second rotating member 121 is formed with a convex second engaging portion 114 that engages with the first engaging portion 141 of the first rotating member 126. Therefore, the first rotating member 126 that can rotate around the axis of the spline shaft 110 without being in contact with the spline shaft 110 is connected via the first engaging portion 141 and the second engaging portion 114. Thus, the second rotating member 121 rotates around the axis of the spline shaft 110, thereby
The spline shaft 110 is rotated around its axis via 20. Also, the first engaging portion 141 and the second engaging portion 114
The second rotating member 121 is urged by the spring 119 toward the first rotating member 126 in order to ensure the engagement between the first rotating member 121 and the second rotating member 121. The spring 119 is inserted through the spline shaft 110 concentrically with the spline shaft 110, and one end of the spring 119 is connected to the component mounting head 10.
5 is in contact with a bearing 117 fixed to the base 116 and a ring-shaped plate 118 attached to the bearing 117.

The second rotating member moving device 173 includes a moving member 124, a brake plate 122, a roller 125,
And a cylinder 123. In the present embodiment, the cylinder 123 and the moving member 124 are both arranged in parallel to the axial direction of the spline shaft 110,
The moving member 124 is connected to the output shaft. Therefore, the output shaft of the cylinder 123 is
By moving along the zero axis direction, the moving member 124 also moves along the axial direction. One end of the moving member 124 has a ring shape concentric with the spline shaft 110 and abuts on the second rotating member 121 to move the moving member 124 and move the second rotating member 121 in the axial direction of the spline shaft 110. To be moved to the brake plate 122
Is provided. The second rotating member 121 is pressed against the brake plate 122 by the urging force of the spring 119. The brake plate 122 is connected to the first rotating member 126 and the second rotating member 126.
In a state where the rotating member 121 is disengaged, the friction with the second rotating member 121 acts to prevent unnecessary rotation of the second rotating member 121 in the direction around the axis.
On the other hand, when the first rotating member 126 and the second rotating member 121 are engaged, the contact between the brake plate 122 and the second rotating member 121 is released, and the brake plate 122 rotates the second rotating member 121. It does not hinder. A roller 125 is provided at the other end of the moving member 124 so as to protrude toward the spline shaft 110. The above-described disk 137 urged by the spring 139 contacts the roller 125. Therefore, the spline shaft 110 can be moved via the disk 137 in the same direction as the moving direction of the moving member 124. However, as described above, the disk 137
Since the roller also contacts the roller 136 of the moving device 170, the spline shaft 110 moves in the axial direction with the movement of the roller 136 in the moving device 170 after the disk 137 contacts the roller 136. In this embodiment, the first rotating member 126 and the second rotating member 12
Each member is configured so that the disk 137 is released from contact with the roller 125 at the time of engagement with the roller 1 and contacts the roller 136. In this embodiment, the cylinder 123 is formed by an air cylinder, and is fixed to the base 116 of the component mounting head 105.

The component mounting head 10 thus configured
5, the electronic component mounting apparatus 100 will be described mainly.
The operation of will be described below. The component mounting head 1
05, the suction device 70, the motor 132 of the moving device 170, the motor 131 of the rotation drive unit 171, the cylinder 123 of the interlocking device 172, and the electronic component mounting device 1
The operation of each of the other components provided in
At 80, operation control is performed. The control device 180 is provided inside the electronic component mounting device 100 in the present embodiment,
The present invention is not limited to this.
0 may be provided outside.

In step 1 (indicated by "S" in the figure) 1 of FIG. 3, the circuit board is carried in by the board transport section 2 from the previous process and is supported at the mounting position. Next, the XY robot 5
As a result, the component holding device 101 is moved to the reel type component supply device 3 or the tray type component supply device 4. In step 2, a cylinder 123 provided on a spline shaft 110 having a nozzle 8 disposed above a component to be mounted (hereinafter, referred to as a spline shaft 110-1) is driven. The moving member 124 is lowered so that the second rotating member 121 is engaged. By this operation, the first rotating member 126 and the second rotating member 121 are engaged, and the disk 137 is
Abut. Therefore, after this, the spline shaft 110
The lowering operation of −1 is performed by the moving device 170.
Also, in step 3, before the suction of the electronic component, the nozzle 8
Is rotated by a predetermined angle, the motor 131 of the rotation drive unit 171 operates. As described above, the first rotating member 1
26 and the second rotating member 121 are engaged at this time, so that the timing pulley 130, the timing belt 1
29, a first rotating member 126, and a spline shaft 110- via a second rotating member 121 including a nut 120.
1 is rotated about its axis by the predetermined angle. next,
In step 4, the motor 132 of the moving device 170 is operated to drive the ball screw 133, and the roller 136 is lowered to such an extent that the electronic component can be sucked by the nozzle 8. Therefore, the spline shaft 110 is rotated through the disk 137 urged by the roller 136 by the spring 139.
−1 is lowered, and the nozzle 8 performs suction by the operation of the suction device 70. Therefore, the nozzle 8 sucks the electronic component.

After the electronic components have been attracted, in step 5, the motor 132 of the moving device 170 operates to
3. The spline shaft 110-1 is raised via the block 135, the roller 136, and the disk 137.
Further, in order to set the sucked electronic component at a predetermined mounting angle, the motor 131 of the rotation drive unit 171 is driven to rotate the nozzle 8 to the mounting angle. Further, the motor 132
Causes the spline shaft 110-1 to rise,
When the roller 125 comes into contact with the roller 37, the cylinder 123 is operated and the moving member 124 is raised in step 6. Therefore, the spline shaft 110-1 is further raised via the disk 137 abutting on the roller 125, and the second rotating member 121 is further raised by the brake plate 122. Thereby, the engagement between the first rotating member 126 and the second rotating member 121 is released, and the rotation of the spline shaft 110-1 around the axis is prevented by the friction between the brake plate 122 and the second rotating member 121. Is done.

In step 7, the spline shaft 1
10-1 and a different spline shaft 110 (for explanation,
The electronic components are also mounted on the nozzle 8 of the spline shaft 110-2 by executing the above-described steps 2 to 6 for the spline shaft 110-2).
During step 7, the spline shaft 110-1 is prevented from rotating around its axis as described above. After the electronic components are sucked to the respective nozzles 8 in this manner, in step 8, the component holding device 101 is moved above the component recognition camera 7 by the XY robot 5, and the electronic components are sucked by the respective nozzles 8. The posture is photographed, and the control device 180 determines whether or not the suction posture is corrected by the image processing technique. In step 9, the following operation is performed so that the nozzle 8 determined to require the above-described suction correction to have a desired suction posture.
The spline shaft 110 is rotated around the axis. For example, when it is necessary to correct the suction attitude of the electronic component sucked by the nozzle 8 of the spline shaft 110-1, the cylinder 123 provided on the spline shaft 110-1 is operated, so that the operation described above is performed again. The first rotating member 126 and the second rotating member 121 are engaged. And
The motor 131 of the rotation drive unit 171 is operated to rotate the first rotating member 126, whereby the spline shaft 110-is rotated by the second rotating member 121 having the nut 120.
1 is rotated around the axis by a predetermined angle to correct the suction posture. At this time, the other spline shaft 110-
For 2, the first rotating member 126 is rotating,
Since the first rotating member 126 and the second rotating member 121 of the spline shaft 110-2 are not engaged, the spline shaft 110-2 does not rotate around its axis.

In the next step 10, the XY robot 5 causes the component holding device 101 to place each nozzle 8 above the mounting position on the circuit board. Then, the cylinder 123 and the moving device 170 are provided for each nozzle 8 as described above.
To lower the spline shaft 110,
The sucked electronic components are sequentially mounted on the circuit board. When the mounting of the components is completed for all the nozzles 8 and further mounting of the components is necessary, the XY robot 5 picks up the component holding device 101 to suck the electronic components.
Is again disposed on the reel-type component supply device 3 or the tray-type component supply device 4, and the operations of steps 2 to 10 are repeated.

In the present embodiment, as described above, after the suction postures of all the nozzles 8 have been corrected in step 9, the components are sequentially mounted in step 10. The correction of the suction attitude and the mounting of the components may be executed every 8 seconds.

As described above, according to the electronic component mounting apparatus 100 of the present embodiment, the held component can be rotated around the axis of the nozzle 8 for each nozzle 8, so that
The component whose holding posture has been corrected does not shift. Therefore, the mounting quality can be improved without occurrence of mounting failure of the components on the board and the like. Further, since only one nozzle rotation mechanism is provided for all nozzles, the entire component mounting head does not become large. Furthermore, since only one moving device 170 for moving each spline shaft in the axial direction is provided for each spline shaft, the number of expensive NC shafts is not increased, and the cost is increased. Absent.

[0027]

As described above in detail, according to the component mounting method of the first aspect, the component mounting head of the second aspect, and the component mounting apparatus of the fourth aspect of the present invention, an interlocking device is provided. Since the holding members are configured to be independently rotated about their axes, the holding posture of the component after each component holding member holds the member can be corrected for each component holding member. Therefore, unlike the related art, when correcting the holding posture of the component in one certain component holding member, the other component holding members do not rotate. Therefore, the holding posture of the component whose holding posture has been once corrected does not change, and the component can be accurately mounted on the body to be mounted, and the mounting quality can be improved.

Further, according to the component mounting head of the third aspect of the present invention, since one moving device is provided for a plurality of component holding members, only one expensive NC shaft is required, which increases the cost. Never.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a component mounting head according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a component mounting apparatus provided with the component mounting head shown in FIG.

FIG. 3 is a flowchart showing an operation of the component mounting apparatus shown in FIG. 2;

4 is a perspective view showing a structure of a moving device provided in the component mounting head shown in FIG.

FIG. 5 is a perspective view showing a conventional component mounter.

FIG. 6 is a sectional view showing a conventional head unit.

FIG. 7 is a plan view of a rotation mechanism of the spline shaft shown in FIG. 6;

[Explanation of symbols]

Reference Signs List 10: circuit board, 70: suction device, 100: electronic component mounting device, 105: component mounting head, 110: spline shaft, 121: second rotating member, 126: first rotating member, 131: motor, 171: rotational drive 172: interlocking device, 173: moving device for the second rotating member, 180: control device.

Claims (9)

[Claims] 1. A component mounting head that is movable in two directions orthogonal to each other on a plane, and is respectively held by a plurality of component holding members (110) that are independently movable in an axial direction. After the members sequentially hold the parts,
A component mounting method for sequentially mounting the held components on an object to be mounted (10), wherein after the component holding members hold the components, each of the component holding members is independently rotated around the axis of the component holding member. A component mounting method comprising: rotating a component held by rotation; and mounting the held component on the object. 2. A mounting operation of the held component on the object to be mounted is performed on one of the component holding members selected to perform the mounting operation on one of the plurality of component holding members. The component mounting method according to claim 1, which is performed by a moving device (170). 3. A component mounting head that is movable in two directions orthogonal to each other on a plane, and has a plurality of component holding members (110) that are each independently movable in an axial direction.
A component mounting head that sequentially holds components on each of the component holding members and sequentially mounts the components on a mounting target (10), wherein the rotation generates a driving force for rotating the component holding members around their axes. A drive unit (171), provided on each of the component holding members, for controlling the transmission of the driving force by the rotary drive unit to the component holding member, and enabling rotation about the axis for each of the component holding members. And an interlocking device (172, 173). 4. The rotary drive section includes one drive source (131) and the component holding members penetrate the component mounting head in a non-contact state, and rotate around the axis by the drive source. The component mounting head according to claim 3, further comprising: a first rotating member (126) that rotates. 5. The interlocking device according to claim 1, wherein said interlocking device is provided on each of said component holding members, and is slidable in said axial direction without rotating around said axis with respect to said component holding members. A second rotating member (121), the second rotating member is moved in the axial direction to bring the first rotating member into contact with the second rotating member, and the rotational force of the first rotating member is reduced by the second member. Transmitted to the component holding member via
The component mounting head according to claim 3 or 4, further comprising a moving device (173) for a rotating member. 6. A component holding member rotatable around the axis of the component holding member by the interlocking device, the component holding member being rotatable to mount the held component on the object. Moving the member in its axial direction,
One moving device (17) provided in the component mounting head
The component mounting head according to any one of claims 3 to 5, further comprising (0). 7. The moving device for the second rotating member, wherein the first rotating member and the second rotating member are brought into contact with each other, and at the same time, the moving device moves the component holding member in the axial direction. 6. The component mounting head according to 6. 8. The component mounting head according to claim 3, wherein the component holding by the component holding member is performed by suctioning the component by a suction device. 9. A component mounting apparatus comprising the component mounting head according to claim 3. Description: