JP3895884B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP3895884B2
JP3895884B2 JP08178699A JP8178699A JP3895884B2 JP 3895884 B2 JP3895884 B2 JP 3895884B2 JP 08178699 A JP08178699 A JP 08178699A JP 8178699 A JP8178699 A JP 8178699A JP 3895884 B2 JP3895884 B2 JP 3895884B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
back surface
external connection
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP08178699A
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English (en)
Japanese (ja)
Other versions
JP2000277542A5 (https=
JP2000277542A (ja
Inventor
治雄 兵藤
茂夫 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP08178699A priority Critical patent/JP3895884B2/ja
Publication of JP2000277542A publication Critical patent/JP2000277542A/ja
Publication of JP2000277542A5 publication Critical patent/JP2000277542A5/ja
Application granted granted Critical
Publication of JP3895884B2 publication Critical patent/JP3895884B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Die Bonding (AREA)
JP08178699A 1999-03-25 1999-03-25 半導体装置 Expired - Lifetime JP3895884B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08178699A JP3895884B2 (ja) 1999-03-25 1999-03-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08178699A JP3895884B2 (ja) 1999-03-25 1999-03-25 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2004285690A Division JP4017625B2 (ja) 2004-09-30 2004-09-30 半導体装置の製造方法
JP2006311131A Division JP2007073987A (ja) 2006-11-17 2006-11-17 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2000277542A JP2000277542A (ja) 2000-10-06
JP2000277542A5 JP2000277542A5 (https=) 2005-06-23
JP3895884B2 true JP3895884B2 (ja) 2007-03-22

Family

ID=13756181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08178699A Expired - Lifetime JP3895884B2 (ja) 1999-03-25 1999-03-25 半導体装置

Country Status (1)

Country Link
JP (1) JP3895884B2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7595547B1 (en) 2005-06-13 2009-09-29 Vishay-Siliconix Semiconductor die package including cup-shaped leadframe
US6744124B1 (en) * 1999-12-10 2004-06-01 Siliconix Incorporated Semiconductor die package including cup-shaped leadframe
JP2002252318A (ja) 2001-02-27 2002-09-06 Nec Kansai Ltd チップ型半導体装置
JP3942500B2 (ja) 2002-07-02 2007-07-11 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP3853263B2 (ja) * 2002-07-08 2006-12-06 Ｎｅｃエレクトロニクス株式会社 半導体装置
DE10249206B3 (de) * 2002-10-22 2004-07-01 Siemens Ag Verfahren zum Zusammenbau eines Leistungsbauelements
DE10249205B3 (de) * 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
US6841865B2 (en) * 2002-11-22 2005-01-11 International Rectifier Corporation Semiconductor device having clips for connecting to external elements
JP4222092B2 (ja) 2003-05-07 2009-02-12 富士電機デバイステクノロジー株式会社 半導体ウェハ、半導体装置および半導体装置の製造方法
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
EP4044226A1 (en) * 2021-02-16 2022-08-17 Nexperia B.V. A semiconductor device and a method of manufacturing of a semiconductor device

Also Published As

Publication number Publication date
JP2000277542A (ja) 2000-10-06

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