JP3881193B2 - 電子部品実装済部品の製造方法、電子部品実装済部品、電子部品実装済完成品の製造方法及び電子部品実装済完成品 - Google Patents

電子部品実装済部品の製造方法、電子部品実装済部品、電子部品実装済完成品の製造方法及び電子部品実装済完成品 Download PDF

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Publication number
JP3881193B2
JP3881193B2 JP2001178522A JP2001178522A JP3881193B2 JP 3881193 B2 JP3881193 B2 JP 3881193B2 JP 2001178522 A JP2001178522 A JP 2001178522A JP 2001178522 A JP2001178522 A JP 2001178522A JP 3881193 B2 JP3881193 B2 JP 3881193B2
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JP
Japan
Prior art keywords
electronic component
circuit pattern
thermoplastic resin
component mounted
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001178522A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002374052A5 (https=
JP2002374052A (ja
Inventor
法人 塚原
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001178522A priority Critical patent/JP3881193B2/ja
Publication of JP2002374052A publication Critical patent/JP2002374052A/ja
Publication of JP2002374052A5 publication Critical patent/JP2002374052A5/ja
Application granted granted Critical
Publication of JP3881193B2 publication Critical patent/JP3881193B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001178522A 2001-06-13 2001-06-13 電子部品実装済部品の製造方法、電子部品実装済部品、電子部品実装済完成品の製造方法及び電子部品実装済完成品 Expired - Fee Related JP3881193B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001178522A JP3881193B2 (ja) 2001-06-13 2001-06-13 電子部品実装済部品の製造方法、電子部品実装済部品、電子部品実装済完成品の製造方法及び電子部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001178522A JP3881193B2 (ja) 2001-06-13 2001-06-13 電子部品実装済部品の製造方法、電子部品実装済部品、電子部品実装済完成品の製造方法及び電子部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2002374052A JP2002374052A (ja) 2002-12-26
JP2002374052A5 JP2002374052A5 (https=) 2005-05-12
JP3881193B2 true JP3881193B2 (ja) 2007-02-14

Family

ID=19019207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001178522A Expired - Fee Related JP3881193B2 (ja) 2001-06-13 2001-06-13 電子部品実装済部品の製造方法、電子部品実装済部品、電子部品実装済完成品の製造方法及び電子部品実装済完成品

Country Status (1)

Country Link
JP (1) JP3881193B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927146B2 (ja) * 2003-01-23 2012-05-09 新光電気工業株式会社 電子部品実装構造の製造方法
JP4489411B2 (ja) * 2003-01-23 2010-06-23 新光電気工業株式会社 電子部品実装構造の製造方法
JP4200285B2 (ja) * 2003-04-02 2008-12-24 パナソニック株式会社 回路基板の製造方法
JP4978030B2 (ja) * 2006-03-07 2012-07-18 セイコーエプソン株式会社 圧電デバイス
JP5593715B2 (ja) * 2010-02-01 2014-09-24 大日本印刷株式会社 パッケージ化半導体装置、パッケージ化半導体装置の製造方法
JP2011222555A (ja) * 2010-04-02 2011-11-04 Denso Corp 半導体チップ内蔵配線基板の製造方法
KR20130030555A (ko) * 2011-09-19 2013-03-27 삼성전기주식회사 인쇄회로기판용 적층판 및 인쇄회로기판 제조 방법

Also Published As

Publication number Publication date
JP2002374052A (ja) 2002-12-26

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