JP3859791B2 - 高電圧電気絶縁部品用液状シリコーンゴム組成物およびその製造方法 - Google Patents
高電圧電気絶縁部品用液状シリコーンゴム組成物およびその製造方法 Download PDFInfo
- Publication number
- JP3859791B2 JP3859791B2 JP03134197A JP3134197A JP3859791B2 JP 3859791 B2 JP3859791 B2 JP 3859791B2 JP 03134197 A JP03134197 A JP 03134197A JP 3134197 A JP3134197 A JP 3134197A JP 3859791 B2 JP3859791 B2 JP 3859791B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- silicone rubber
- silicon
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920002379 silicone rubber Polymers 0.000 title claims description 70
- 239000000203 mixture Substances 0.000 title claims description 62
- 239000004944 Liquid Silicone Rubber Substances 0.000 title claims description 34
- 238000010292 electrical insulation Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000004945 silicone rubber Substances 0.000 claims description 36
- 239000000843 powder Substances 0.000 claims description 32
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 22
- -1 triazole compound Chemical class 0.000 claims description 21
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 15
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 229910021485 fumed silica Inorganic materials 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 6
- 239000000347 magnesium hydroxide Substances 0.000 claims description 6
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 6
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 150000002736 metal compounds Chemical class 0.000 claims description 4
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 21
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 230000000704 physical effect Effects 0.000 description 11
- 238000001723 curing Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 239000011787 zinc oxide Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 239000012763 reinforcing filler Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- SMCLTAARQYTXLW-UHFFFAOYSA-N 1,1-diphenylprop-2-yn-1-ol Chemical compound C=1C=CC=CC=1C(C#C)(O)C1=CC=CC=C1 SMCLTAARQYTXLW-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 1
- CPIXYSJHEFGRDR-UHFFFAOYSA-N 3-cyclohexylbut-1-yn-1-ol Chemical compound OC#CC(C)C1CCCCC1 CPIXYSJHEFGRDR-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03134197A JP3859791B2 (ja) | 1997-01-29 | 1997-01-29 | 高電圧電気絶縁部品用液状シリコーンゴム組成物およびその製造方法 |
| US09/014,812 US5942571A (en) | 1997-01-29 | 1998-01-28 | Silicone rubber composition for use in high-voltage electrical insulating parts and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03134197A JP3859791B2 (ja) | 1997-01-29 | 1997-01-29 | 高電圧電気絶縁部品用液状シリコーンゴム組成物およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10212414A JPH10212414A (ja) | 1998-08-11 |
| JPH10212414A5 JPH10212414A5 (enExample) | 2004-12-09 |
| JP3859791B2 true JP3859791B2 (ja) | 2006-12-20 |
Family
ID=12328543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03134197A Expired - Fee Related JP3859791B2 (ja) | 1997-01-29 | 1997-01-29 | 高電圧電気絶縁部品用液状シリコーンゴム組成物およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5942571A (enExample) |
| JP (1) | JP3859791B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105949790A (zh) * | 2016-07-07 | 2016-09-21 | 五谊环保科技（上海）有限公司 | 一种新型耐高温阻燃环保硅橡胶及其制备方法 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3846574B2 (ja) * | 2002-06-18 | 2006-11-15 | 信越化学工業株式会社 | 耐トラッキング性シリコーンゴム組成物及びこれを用いた電力ケーブル |
| JP3919011B2 (ja) * | 2003-04-22 | 2007-05-23 | 信越化学工業株式会社 | 熱硬化性シリコーンゴム組成物 |
| JP4256309B2 (ja) * | 2003-09-29 | 2009-04-22 | 株式会社東芝 | 超音波プローブおよび超音波診断装置 |
| JP2010031271A (ja) * | 2008-07-02 | 2010-02-12 | Yazaki Corp | シリコーン表面処理水酸化マグネシウム |
| JP4917184B1 (ja) * | 2010-10-01 | 2012-04-18 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 高電圧電気絶縁部品用液状シリコーンゴム組成物 |
| US20130309432A1 (en) * | 2011-01-20 | 2013-11-21 | Chiichiro Hasegawa | Use Of Magnesium Compound For Improving Water Resistance Of Cured Silicone Rubber |
| CN102504613B (zh) * | 2011-11-11 | 2013-07-31 | 山东久隆高分子材料有限公司 | 一种用于led封装补强用改性气相法白炭黑的制备方法 |
| JP6426727B2 (ja) * | 2013-06-27 | 2018-11-21 | エルケム・シリコーンズ・フランス・エスアエスＥＬＫＥＭ ＳＩＬＩＣＯＮＥＳ Ｆｒａｎｃｅ ＳＡＳ | 電気ワイヤ又は電気ケーブルの製造に特に利用し得る熱加硫性ポリオルガノシロキサン組成物 |
| JP6428591B2 (ja) * | 2015-12-10 | 2018-11-28 | 信越化学工業株式会社 | 付加硬化型シリコーンゴム組成物及びシリコーンゴム |
| US12077706B2 (en) | 2021-01-28 | 2024-09-03 | TE Connectivity Services Gmbh | Hybrid silicone composite for high temperature applications |
| CN113061344A (zh) * | 2021-03-30 | 2021-07-02 | 上海瑞起新材料科技有限公司 | 一种复合绝缘子用加成型液体硅橡胶及其制备方法 |
| JP7606439B2 (ja) * | 2021-10-19 | 2024-12-25 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| CN116396618B (zh) * | 2023-02-06 | 2024-09-06 | 广州玖盈化工材料有限公司 | 一种可修复型防火封堵剂及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3965065A (en) * | 1975-09-08 | 1976-06-22 | Dow Corning Corporation | Method of improving the electrical properties of organopolysiloxane elastomers and compositions therefor |
| JPS6226124A (ja) * | 1985-07-27 | 1987-02-04 | Teruaki Yoshida | 荒地走行用三輪駆動車 |
| US5204279A (en) * | 1991-06-03 | 1993-04-20 | Sgs-Thomson Microelectronics, Inc. | Method of making SRAM cell and structure with polycrystalline p-channel load devices |
| JP3104568B2 (ja) * | 1995-03-24 | 2000-10-30 | 信越化学工業株式会社 | 高電圧電気絶縁体用シリコーンゴム組成物 |
| JPH09316335A (ja) * | 1996-05-24 | 1997-12-09 | Toray Dow Corning Silicone Co Ltd | 液状シリコーンゴム組成物およびその製造方法 |
-
1997
- 1997-01-29 JP JP03134197A patent/JP3859791B2/ja not_active Expired - Fee Related
-
1998
- 1998-01-28 US US09/014,812 patent/US5942571A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105949790A (zh) * | 2016-07-07 | 2016-09-21 | 五谊环保科技（上海）有限公司 | 一种新型耐高温阻燃环保硅橡胶及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5942571A (en) | 1999-08-24 |
| JPH10212414A (ja) | 1998-08-11 |
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