JP3854157B2 - 半導体製造装置及びそのクリーニング方法 - Google Patents

半導体製造装置及びそのクリーニング方法 Download PDF

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Publication number
JP3854157B2
JP3854157B2 JP2002006297A JP2002006297A JP3854157B2 JP 3854157 B2 JP3854157 B2 JP 3854157B2 JP 2002006297 A JP2002006297 A JP 2002006297A JP 2002006297 A JP2002006297 A JP 2002006297A JP 3854157 B2 JP3854157 B2 JP 3854157B2
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Prior art keywords
cleaning
film forming
chamber
chambers
forming chamber
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JP2002006297A
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Japanese (ja)
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JP2003209058A (ja
JP2003209058A5 (enrdf_load_stackoverflow
Inventor
正則 奥野
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Publication of JP2003209058A5 publication Critical patent/JP2003209058A5/ja
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JP2002006297A 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法 Expired - Lifetime JP3854157B2 (ja)

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JP2002006297A JP3854157B2 (ja) 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法

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JP2002006297A JP3854157B2 (ja) 2002-01-15 2002-01-15 半導体製造装置及びそのクリーニング方法

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JP2006201246A Division JP2006313934A (ja) 2006-07-24 2006-07-24 半導体製造装置および半導体製造装置の成膜処理方法

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JP2003209058A JP2003209058A (ja) 2003-07-25
JP2003209058A5 JP2003209058A5 (enrdf_load_stackoverflow) 2005-08-04
JP3854157B2 true JP3854157B2 (ja) 2006-12-06

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10096501B2 (en) 2013-08-27 2018-10-09 Hitachi Kokusai Electric Inc. Maintenance method of substrate processing apparatus, method for manufacturing semiconductor device, substrate processing apparatus, and storage medium capable of reading maintenance program of substrate processing apparatus
US10131992B2 (en) 2012-03-30 2018-11-20 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of controlling substrate processing apparatus, method of maintaining substrate processing apparatus, and recording medium
US10724137B2 (en) 2013-02-05 2020-07-28 Kokusai Eletric Corporation Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216911A (ja) * 2004-01-27 2005-08-11 Komatsu Electronic Metals Co Ltd エピタキシャル成長装置の排ガス処理システム
JP4225998B2 (ja) 2004-12-09 2009-02-18 東京エレクトロン株式会社 成膜方法及び成膜装置並びに記憶媒体
JP4931381B2 (ja) * 2005-02-08 2012-05-16 東京エレクトロン株式会社 基板処理装置，基板処理装置の制御方法，プログラム
JP4823628B2 (ja) * 2005-09-26 2011-11-24 東京エレクトロン株式会社 基板処理方法および記録媒体
JP5633167B2 (ja) * 2010-03-24 2014-12-03 株式会社Sumco エピタキシャル成長システム
JP6105436B2 (ja) * 2013-08-09 2017-03-29 東京エレクトロン株式会社 基板処理システム
JP7076499B2 (ja) * 2020-06-22 2022-05-27 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム
US11532525B2 (en) * 2021-03-03 2022-12-20 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
CN114360997B (zh) * 2021-12-09 2024-06-21 北京北方华创微电子装备有限公司 多腔室清洗方法和半导体工艺设备
CN114361075B (zh) * 2021-12-31 2025-08-26 北京北方华创微电子装备有限公司 半导体工艺方法和半导体工艺设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10131992B2 (en) 2012-03-30 2018-11-20 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of controlling substrate processing apparatus, method of maintaining substrate processing apparatus, and recording medium
US10724137B2 (en) 2013-02-05 2020-07-28 Kokusai Eletric Corporation Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining method
US10096501B2 (en) 2013-08-27 2018-10-09 Hitachi Kokusai Electric Inc. Maintenance method of substrate processing apparatus, method for manufacturing semiconductor device, substrate processing apparatus, and storage medium capable of reading maintenance program of substrate processing apparatus

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JP2003209058A (ja) 2003-07-25

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