JP3843200B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP3843200B2
JP3843200B2 JP2000092660A JP2000092660A JP3843200B2 JP 3843200 B2 JP3843200 B2 JP 3843200B2 JP 2000092660 A JP2000092660 A JP 2000092660A JP 2000092660 A JP2000092660 A JP 2000092660A JP 3843200 B2 JP3843200 B2 JP 3843200B2
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JP
Japan
Prior art keywords
substrate
processing
supply nozzle
liquid supply
liquid
Prior art date
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Expired - Fee Related
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JP2000092660A
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English (en)
Japanese (ja)
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JP2001284206A (ja
JP2001284206A5 (enExample
Inventor
孝之 戸島
武彦 折居
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000092660A priority Critical patent/JP3843200B2/ja
Priority to US09/801,918 priority patent/US6634806B2/en
Priority to TW090105741A priority patent/TW494451B/zh
Priority to KR1020010012577A priority patent/KR100588927B1/ko
Publication of JP2001284206A publication Critical patent/JP2001284206A/ja
Priority to US10/653,999 priority patent/US6817790B2/en
Publication of JP2001284206A5 publication Critical patent/JP2001284206A5/ja
Application granted granted Critical
Publication of JP3843200B2 publication Critical patent/JP3843200B2/ja
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  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2000092660A 2000-03-13 2000-03-30 基板処理装置及び基板処理方法 Expired - Fee Related JP3843200B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000092660A JP3843200B2 (ja) 2000-03-30 2000-03-30 基板処理装置及び基板処理方法
US09/801,918 US6634806B2 (en) 2000-03-13 2001-03-09 Substrate processing method and substrate processing apparatus
TW090105741A TW494451B (en) 2000-03-13 2001-03-12 Substrate processing method and substrate processing apparatus
KR1020010012577A KR100588927B1 (ko) 2000-03-13 2001-03-12 기판처리방법 및 기판처리장치
US10/653,999 US6817790B2 (en) 2000-03-13 2003-09-04 Substrate processing method and substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000092660A JP3843200B2 (ja) 2000-03-30 2000-03-30 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2001284206A JP2001284206A (ja) 2001-10-12
JP2001284206A5 JP2001284206A5 (enExample) 2005-06-23
JP3843200B2 true JP3843200B2 (ja) 2006-11-08

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JP2000092660A Expired - Fee Related JP3843200B2 (ja) 2000-03-13 2000-03-30 基板処理装置及び基板処理方法

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JP (1) JP3843200B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030083779A (ko) * 2002-04-22 2003-11-01 주식회사 디엠에스 액정표시소자용 처리장치 및 처리방법
US7300598B2 (en) * 2003-03-31 2007-11-27 Tokyo Electron Limited Substrate processing method and apparatus
JP4369325B2 (ja) 2003-12-26 2009-11-18 東京エレクトロン株式会社 現像装置及び現像処理方法
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
JP4704173B2 (ja) * 2005-09-30 2011-06-15 大日本印刷株式会社 微細パターン形成体の製造方法
KR100908255B1 (ko) * 2007-11-21 2009-07-20 김경희 현상액과 세정액 아암을 일체로 형성한 스핀 유닛 그작동방법
JP5305331B2 (ja) 2008-06-17 2013-10-02 東京エレクトロン株式会社 現像処理方法及び現像処理装置
JP4788785B2 (ja) * 2009-02-06 2011-10-05 東京エレクトロン株式会社 現像装置、現像処理方法及び記憶媒体
JP4700117B2 (ja) * 2009-02-25 2011-06-15 東京エレクトロン株式会社 現像処理方法
JP4794685B1 (ja) 2010-10-19 2011-10-19 ミクロ技研株式会社 基板処理装置及び基板処理方法
JP6545464B2 (ja) * 2015-01-07 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス 現像方法
CN111045299B (zh) * 2020-01-02 2023-07-21 长江存储科技有限责任公司 一种显影洗边设备和显影洗边方法
CN115220314A (zh) * 2022-07-07 2022-10-21 上海众鸿电子科技有限公司 一种集成式晶圆显影装置、清洗装置及清洗方法

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JP2001284206A (ja) 2001-10-12

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