JP3787526B2 - Ｉｃチップの製造方法 - Google Patents

Ｉｃチップの製造方法 Download PDF

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Publication number
JP3787526B2
JP3787526B2 JP2002006558A JP2002006558A JP3787526B2 JP 3787526 B2 JP3787526 B2 JP 3787526B2 JP 2002006558 A JP2002006558 A JP 2002006558A JP 2002006558 A JP2002006558 A JP 2002006558A JP 3787526 B2 JP3787526 B2 JP 3787526B2
Authority
JP
Japan
Prior art keywords
wafer
pressure
layer
sensitive adhesive
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002006558A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003209083A5 (enrdf_load_stackoverflow
JP2003209083A (ja
Inventor
正輝 福岡
康彦 大山
宗宏 畠井
聡史 林
滋 檀上
政彦 北村
興一 矢嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Sekisui Chemical Co Ltd
Original Assignee
Disco Corp
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002006558A priority Critical patent/JP3787526B2/ja
Application filed by Disco Corp, Sekisui Chemical Co Ltd filed Critical Disco Corp
Priority to KR10-2003-7014522A priority patent/KR20040105546A/ko
Priority to PCT/JP2003/000238 priority patent/WO2003060972A1/ja
Priority to US10/475,257 priority patent/US6939741B2/en
Priority to CNB038002329A priority patent/CN1322554C/zh
Priority to TW092100744A priority patent/TWI267168B/zh
Priority to EP03701719A priority patent/EP1467402A4/en
Publication of JP2003209083A publication Critical patent/JP2003209083A/ja
Publication of JP2003209083A5 publication Critical patent/JP2003209083A5/ja
Application granted granted Critical
Publication of JP3787526B2 publication Critical patent/JP3787526B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002006558A 2002-01-15 2002-01-15 Ｉｃチップの製造方法 Expired - Lifetime JP3787526B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002006558A JP3787526B2 (ja) 2002-01-15 2002-01-15 Ｉｃチップの製造方法
PCT/JP2003/000238 WO2003060972A1 (fr) 2002-01-15 2003-01-15 Procede de fabrication d'une puce de circuit integre
US10/475,257 US6939741B2 (en) 2002-01-15 2003-01-15 IC chip manufacturing method
CNB038002329A CN1322554C (zh) 2002-01-15 2003-01-15 Ic片的生产方法
KR10-2003-7014522A KR20040105546A (ko) 2002-01-15 2003-01-15 Ｉｃ칩의 제조 방법
TW092100744A TWI267168B (en) 2002-01-15 2003-01-15 Manufacturing method of IC chip
EP03701719A EP1467402A4 (en) 2002-01-15 2003-01-15 IC CHIP PROCESS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002006558A JP3787526B2 (ja) 2002-01-15 2002-01-15 Ｉｃチップの製造方法

Publications (3)

Publication Number Publication Date
JP2003209083A JP2003209083A (ja) 2003-07-25
JP2003209083A5 JP2003209083A5 (enrdf_load_stackoverflow) 2004-12-24
JP3787526B2 true JP3787526B2 (ja) 2006-06-21

Family

ID=27645293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002006558A Expired - Lifetime JP3787526B2 (ja) 2002-01-15 2002-01-15 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP3787526B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4462997B2 (ja) 2003-09-26 2010-05-12 株式会社ディスコ ウェーハの加工方法
JP4647228B2 (ja) 2004-04-01 2011-03-09 株式会社ディスコ ウェーハの加工方法
JP2010042469A (ja) * 2008-08-12 2010-02-25 Tokyo Ohka Kogyo Co Ltd サポートプレート
JP5706258B2 (ja) * 2011-07-08 2015-04-22 株式会社東京精密 ウェハの電気特性検査方法

Also Published As

Publication number Publication date
JP2003209083A (ja) 2003-07-25

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