JP3767847B2 - リングフレームへの接着テープ貼着方法及び装置 - Google Patents

リングフレームへの接着テープ貼着方法及び装置 Download PDF

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Publication number
JP3767847B2
JP3767847B2 JP30222299A JP30222299A JP3767847B2 JP 3767847 B2 JP3767847 B2 JP 3767847B2 JP 30222299 A JP30222299 A JP 30222299A JP 30222299 A JP30222299 A JP 30222299A JP 3767847 B2 JP3767847 B2 JP 3767847B2
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tape
adhesive tape
ring frame
chuck
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Japanese (ja)
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JP2001127075A (ja
JP2001127075A5 (enrdf_load_stackoverflow
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隆博 芦田
昌宏 森田
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Takatori Corp
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Takatori Corp
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  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP30222299A 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置 Expired - Fee Related JP3767847B2 (ja)

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JP30222299A JP3767847B2 (ja) 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置

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JP30222299A JP3767847B2 (ja) 1999-10-25 1999-10-25 リングフレームへの接着テープ貼着方法及び装置

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JP2001127075A JP2001127075A (ja) 2001-05-11
JP2001127075A5 JP2001127075A5 (enrdf_load_stackoverflow) 2005-04-21
JP3767847B2 true JP3767847B2 (ja) 2006-04-19

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5151053B2 (ja) * 2006-03-30 2013-02-27 富士通セミコンダクター株式会社 半導体装置の製造方法
CN107859677B (zh) * 2017-10-31 2023-07-25 苏州奥卫川诚自动化科技有限公司 一种可调式贴胶工具
JP6954611B2 (ja) * 2017-11-13 2021-10-27 Uht株式会社 テープ貼付装置及びテープ貼付方法
KR102233318B1 (ko) * 2020-10-12 2021-03-29 제너셈(주) 테이프 마운터

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