JP3752231B2 - フロントエンドモジュール - Google Patents

フロントエンドモジュール Download PDF

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Publication number
JP3752231B2
JP3752231B2 JP2003037473A JP2003037473A JP3752231B2 JP 3752231 B2 JP3752231 B2 JP 3752231B2 JP 2003037473 A JP2003037473 A JP 2003037473A JP 2003037473 A JP2003037473 A JP 2003037473A JP 3752231 B2 JP3752231 B2 JP 3752231B2
Authority
JP
Japan
Prior art keywords
terminal
signal
frequency
integration
end module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003037473A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004032673A (ja
JP2004032673A5 (https=
Inventor
信也 中井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2003037473A priority Critical patent/JP3752231B2/ja
Publication of JP2004032673A publication Critical patent/JP2004032673A/ja
Priority to US10/774,607 priority patent/US7373171B2/en
Publication of JP2004032673A5 publication Critical patent/JP2004032673A5/ja
Application granted granted Critical
Publication of JP3752231B2 publication Critical patent/JP3752231B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Transceivers (AREA)
JP2003037473A 2002-03-27 2003-02-14 フロントエンドモジュール Expired - Fee Related JP3752231B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003037473A JP3752231B2 (ja) 2002-03-27 2003-02-14 フロントエンドモジュール
US10/774,607 US7373171B2 (en) 2003-02-14 2004-02-10 Front end module

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002089726 2002-03-27
JP2002130372 2002-05-02
JP2003037473A JP3752231B2 (ja) 2002-03-27 2003-02-14 フロントエンドモジュール

Publications (3)

Publication Number Publication Date
JP2004032673A JP2004032673A (ja) 2004-01-29
JP2004032673A5 JP2004032673A5 (https=) 2005-08-11
JP3752231B2 true JP3752231B2 (ja) 2006-03-08

Family

ID=31191846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003037473A Expired - Fee Related JP3752231B2 (ja) 2002-03-27 2003-02-14 フロントエンドモジュール

Country Status (1)

Country Link
JP (1) JP3752231B2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186596A (ja) 2004-12-27 2006-07-13 Hitachi Media Electoronics Co Ltd アンテナ共用装置およびそれを用いた無線通信端末
KR20080047623A (ko) * 2005-09-26 2008-05-29 글로나브 리미티드 다단식 공진 증폭기 시스템 및 방법
US20070161358A1 (en) * 2006-01-12 2007-07-12 Sony Ericsson Mobile Communications Ab Multiband radio module
DE102007019082B4 (de) 2007-04-23 2018-04-05 Snaptrack Inc. Frontendmodul
WO2010147197A1 (ja) * 2009-06-19 2010-12-23 株式会社村田製作所 高周波モジュール
JP5620812B2 (ja) * 2010-12-27 2014-11-05 ルネサスエレクトロニクス株式会社 高周波モジュールおよび無線通信システム
EP2693648A1 (en) * 2012-08-03 2014-02-05 BlackBerry Limited Mobile wireless communications device with rf lte switches and related methods
JP2016208484A (ja) * 2015-04-27 2016-12-08 太陽誘電株式会社 フロントエンド回路、モジュールおよび通信装置
WO2016194923A1 (ja) * 2015-06-03 2016-12-08 株式会社村田製作所 高周波フロントエンド回路
WO2021002271A1 (ja) * 2019-07-03 2021-01-07 株式会社村田製作所 高周波モジュール及び通信装置
US20250385661A1 (en) * 2022-06-21 2025-12-18 Kyocera Corporation Filter device, multilayer substrate, and communication apparatus

Also Published As

Publication number Publication date
JP2004032673A (ja) 2004-01-29

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